Programmable charge-storage transistor, an array of elevationally-extending strings of memory cells, and a method of forming an array of elevationally-extending strings of memory cells
A programmable charge-storage transistor comprises channel material, insulative charge-passage material, charge-storage material, a control gate, and charge-blocking material between the charge-storage material and the control gate. The charge-blocking material comprises a non-ferroelectric insulator material and a ferroelectric insulator material. Arrays of elevationally-extending strings of memory cells of memory cells are disclosed, including methods of forming such. Other embodiments, including method, are disclosed.
1. A method of forming an array of elevationally-extending strings of memory cells, the method comprising:
forming a stack comprising vertically-alternating tiers of different composition first and second materials, the first material being insulative;
forming elevationally-extending channel openings into the alternating tiers;
forming first charge-blocking insulator material in the channel openings elevationally along the alternating tiers;
forming charge-storage material in the channel openings elevationally along the alternating tiers and the first charge-blocking insulator material;
forming insulative charge-passage material in the channel openings elevationally along the alternating tiers and the charge-storage material;
forming transistor channel material in the channel openings elevationally along the alternating tiers and the insulative charge-passage material;
removing at least some of the second material from the stack;
forming second charge-blocking insulator material laterally proximate the first charge-blocking insulator material, the second charge-blocking insulator material being of different composition from that of the first charge-blocking insulator material, one of the first charge-blocking insulator material or the second charge-blocking insulator material comprising a non-ferroelectric insulator material, the other of the first charge-blocking insulator material or the second charge-blocking insulator material comprising a ferroelectric insulator material; and
forming control-gate material laterally over the second charge-blocking insulator material, the control-gate material having terminal ends corresponding to control-gate regions of individual memory cells.
2. The method of claim 1 comprising forming the first charge-blocking insulator material to comprise the non-ferroelectric insulator material, and forming the second charge-blocking insulator material to comprise the ferroelectric insulator material.
3. The method of claim 2 wherein the ferroelectric insulator material is directly above and directly below the control-gate material in the individual memory cells in a finished construction.
4. The method of claim 3 wherein the ferroelectric insulator material is directly against a top and a bottom of the control-gate material in the individual memory cells in a finished construction.
5. The method of claim 1 comprising forming the first charge-blocking insulator material to comprise the ferroelectric insulator material, and forming the second charge-blocking insulator material to comprise the non-ferroelectric insulator material.
6. The method of claim 1 comprising forming the second charge-blocking insulator material directly against the first charge-blocking insulator material.