Method for production of a component by atomic diffusion bonding

1. A method for producing a component from two plates, wherein both plates are electrically isolating, at least one of the plates is optically transparent, and between the plates at least one planar conductor section and at least one isolator section are formed, said method comprising the steps:

bonding the plates at mutually facing bonding faces, wherein a metal layer is arranged between the plates, and

processing the metal layer by local heating of the metal layer by use of laser radiation such that the metal layer is converted into the at least one isolator section in a partial region, and the at least one planar conductor section is formed adjacent to the at least one isolator section, wherein to form the at least one isolator section, a light path of the laser radiation and the component are moved relative to each other in order to convert the metal layer into the at least one isolator section over a line or area, wherein

the plates are polished on sides of the bonding faces and the bonding faces are formed by metallic bond layers, and

the bonding of the plates comprises atomic diffusion bonding, wherein the metallic bond layers form the metal layer between the bonded plates.

2. The method according to claim 1 , wherein

the atomic diffusion bonding is carried out at room temperature.

3. The method according to claim 1 , wherein

the plates on the bonding face sides are polished to a roughness which is less than 1 nm rms.

4. The method according to claim 1 , wherein

during processing of the metal layer by local heating of the metal layer, a metal contained in the metal layer undergoes a change in a material microstructure under an effect of the laser radiation so as to form the at least one isolator section.

5. The method according to claim 1 , wherein

the plates are made of different materials.

6. The method according to claim 1 , wherein

one of the plates is made of a material having a high-voltage disruptive strength of at least 1000 V/mm.

7. The method according to claim 1 , wherein

the plates comprise at least one of material selected from the group consisting of glass, glass ceramic, crystalline material, sapphire, diamond, ceramic and plastic.

8. The method according to claim 1 , wherein

at least one of the plates on the bonding face side has a smoothing layer on which the associated metallic bond layer is formed.

9. The method according to claim 1 , wherein

at least one of the plates on the bonding face side has at least one adhesion-promoting layer on which the associated metallic bond layer is formed.

10. The method according to claim 1 , with at least one of the features

the metal layer is heated locally by the laser radiation with a wavelength at which the at least one of the plates is transparent,

the metal layer is heated locally by focused or defocused laser radiation, and

the laser radiation for locally heating the metal layer is generated with a pulsed laser.

11. The method according to claim 1 , wherein

the component is a carrier of an electrostatic holding device which comprises the bonded plates and contains at least one large-area electrode that is formed by the at least one conductor section and configured for loading with a high voltage, wherein the at least one isolator section is arranged adjacent to the at least one large-area electrode.

12. The method according to claim 11 , comprising at least one of the features

the electrostatic holding device contains at least two electrodes which are each formed by a conductor section and are separated from each other by the at least one isolator section, and

the processing of the metal layer by use of laser radiation comprises production of at least one conductor track which is connected to the at least one electrode.

13. The method according to claim 1 , wherein

the component is a conductor component which is composed of the bonded plates and contains at least one conductor track that is formed by the at least one conductor section and configured for loading with an electrical current, wherein the at least one isolator section is arranged adjacent to the at least one conductor track.

14. The method according to claim 13 , with at least one of the features

the conductor component contains at least two conductor tracks which are each formed by a conductor section and are separated from each other by the at least one isolator section, and

the at least one conductor track is configured as a drive device for moving a workpiece under an effect of alternating electrical fields or as a heating resistor.