IP Library › Granted Patent US 11,335,769
Granted Patent B2
US 11,335,769 · App. 17/171,585 · Granted May 17, 2022

Semiconductor device

Inventors: Kenichi Matsushita (Nonoichi Ishikawa, JP); Tatsuya Ohguro (Kanazawa Ishikawa, JP)
Assignees: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
H01L29/0607H01L29/41708H01L29/41725
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Quick Facts
Patent No.
US 11,335,769
App. No.
17/171,585
Granted
May 17, 2022
Kind
B2
Abstract

A semiconductor device includes a semiconductor part, a terminal insulating film, a first protective film, a second electrode, a terminal electrode, a first insulating film, and a second protective film. The terminal insulating film is provided on the semiconductor part in the terminal region. The first protective film is provided on the terminal insulating film. The first and second protective films includes silicon and nitrogen. The second electrode is provided on the semiconductor part in the cell region and includes an end portion located on the first protective film. The terminal electrode is provided on the first protective film in the terminal region and is connected to the semiconductor part. The first insulating film is provided on the first protective film. The first insulating film includes hydrogen and contacts the second electrode and the terminal electrode. The second protective film covers the first insulating film.

Claims (43)

1. A semiconductor device having a cell region and a terminal region set in the device, the terminal region surrounding the cell region, the device comprising:

a first electrode;

a semiconductor part provided on the first electrode;

a terminal insulating film provided on the semiconductor part in the terminal region;

a first protective film provided on the terminal insulating film, the first protective film including silicon and nitrogen;

a second electrode provided on the semiconductor part in the cell region, the second electrode including an end portion located on the first protective film;

a terminal electrode provided on the first protective film in the terminal region and connected to the semiconductor part;

a first insulating film provided on the first protective film, the first insulating film including hydrogen and contacting the terminal electrode and the end portion of the second electrode, the first insulating film including a lower portion located between the second electrode and the terminal electrode, the first insulating film including an upper portion located on the second electrode and the terminal electrode; and

a second protective film covering the upper portion of the first insulating film and including silicon and nitrogen.

2. The device according to claim 1 , wherein

the first insulating film further includes silicon, oxygen, and nitrogen.

3. The device according to claim 1 , wherein

the second protective film contacts the terminal electrode.

4. The device according to claim 1 , wherein

the second protective film contacts the first protective film at a terminal side of the terminal electrode.

5. The device according to claim 1 , wherein

the second protective film contacts the second electrode.

6. The device according to claim 1 , further comprising:

a metal film provided on the first insulating film and connected to the second electrode,

the metal film including a portion that overlaps the terminal electrode and is separated from the terminal electrode,

the semiconductor part including

a first semiconductor layer connected to the first electrode and the terminal electrode, the first semiconductor layer being of a first conductivity type, and

a second semiconductor layer provided on the first semiconductor layer in the cell region and connected to the second electrode, the second semiconductor layer being of a second conductivity type.

7. The device according to claim 6 , further comprising:

a second insulating film provided at a terminal side of the first insulating film,

the second insulating film including hydrogen,

the second insulating film including

a lower portion located on the first protective film, and

an upper portion located on the terminal electrode,

the second protective film being provided also on the upper portion of the second insulating film.

8. The device according to claim 1 , further comprising:

a metal member provided on the second electrode,

an upper surface of the metal member being positioned higher than the second protective film.

9. A semiconductor device having a cell region and a terminal region set in the device, the terminal region surrounding the cell region, the device comprising:

a first electrode;

a semiconductor part provided on the first electrode;

a terminal insulating film provided on the semiconductor part in the terminal region;

a first protective film provided on the terminal insulating film, the first protective film including silicon and nitrogen;

a second electrode provided on the semiconductor part in the cell region, the second electrode including an end portion located on the first protective film;

a terminal electrode provided on the first protective film in the terminal region and connected to the semiconductor part;

a first insulating film provided on the first protective film, the first insulating film contacting the terminal electrode and the end portion of the second electrode, the first insulating film including a lower portion located between the second electrode and the terminal electrode, the first insulating film including an upper portion located higher than the second electrode and the terminal electrode;

a second protective film covering the upper portion of the first insulating film and including silicon and nitrogen; and

a metal film provided on the first insulating film and connected to the second electrode, the metal film including a portion that overlaps the terminal electrode and is separated from the terminal electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2021
From: MATSUSHITA, KENICHI; OHGURO, TATSUYA
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 055210/0706 →
Priority Claims (1)
JP JP2020-153313 · Sep 11, 2020 · national
Continuity (1)
Related Publication 20220085154A1 · Mar 17, 2022