IP Library › Granted Patent US 11,289,826
Granted Patent B2
US 11,289,826 · App. 17/171,855 · Granted Mar 29, 2022

Electric wire connection structure and connection method

Inventor: Hideki Adachi (Makinohara, JP)
Assignee: YAZAKI CORPORATION
H01R4/187H01R4/02H01R11/11H01R25/16
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Quick Facts
Patent No.
US 11,289,826
App. No.
17/171,855
Granted
Mar 29, 2022
Kind
B2
Abstract

A connection structure for an electric wire includes an electric wire that has a conductor and an outer sheath covering the conductor; a bonding member that is made of a conductive metal material and is attached to the electric wire and; and a busbar that is made of a conductive metal material and on which the bonding member is overlapped and ultrasonically bonded with the conductor interposed between the busbar and the bonding member. The bonding member includes a crimping portion for crimping and fixing the electric wire.

Claims (12)

1. A connection structure for an electric wire, the connection structure comprising:

an electric wire that has a conductor and an outer sheath covering the conductor;

a bonding member that is made of a conductive metal material and is attached to the electric wire; and

a busbar that is made of a conductive metal material and on which the bonding member is overlapped and ultrasonically bonded with the conductor interposed between the busbar and the bonding member,

wherein the bonding member includes a crimping portion that crimps and fixes the electric wire.

2. The connection structure for an electric wire according to claim 1 ,

wherein the bonding member is made of copper or a copper alloy.

3. The connection structure for an electric wire according to claim 1 ,

wherein the bonding member is made of aluminum or an aluminum alloy.

4. A connection method of an electric wire, the connection method comprising:

an electric wire fixing step of crimping and fixing a crimping portion provided on a bonding member made of a conductive metal material to an electric wire exposing a conductor from an outer sheath; and

a bonding step of overlapping and ultrasonically bonding the bonding member to a busbar made of a conductive metal material via the conductor.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2021
From: ADACHI, HIDEKI
To: YAZAKI CORPORATION
Reel/Frame 055203/0719 →
Priority Claims (1)
JP JP2020-020624 · Feb 10, 2020 · national
Continuity (1)
Related Publication 20210249796A1 · Aug 12, 2021