IP Library Granted Patent US 11,787,097
Granted Patent B2
US 11,787,097 · App. 17/173,130 · Granted Oct 17, 2023

Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes

Inventors: Sheila F. Chopin (Austin, TX); Nishant Lakhera (Austin, TX); Boon Yew Low (Subang Jaya, MY)
Assignee: NXP USA, INC.
B29C48/271B29C48/388B29C48/39H01L21/565
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Quick Facts
Patent No.
US 11,787,097
App. No.
17/173,130
Granted
Oct 17, 2023
Kind
B2
Abstract

An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

Claims (9)

1. An encapsulant compound apparatus, comprising:

a mechanical operator characterized as a kneader, the kneader comprising:

a rotator shaft; and

a kneader cam installed onto the rotator shaft, the kneader cam including a first insert disposed on a kneading surface of the kneading cam, wherein, when the rotator shaft is rotated, the kneader cam operates to knead an encapsulant compound and the first insert operates to capture foreign material in the encapsulant compound.

2. The encapsulant compound apparatus of claim 1 , wherein the first insert is a coil magnet placed within a hole in the surface of the mechanical operator.

3. The encapsulant compound apparatus of claim 1 , wherein the first insert is a rigid magnet pressed into a hole in the surface of the mechanical operator.

4. The encapsulant compound apparatus of claim 1 , wherein the insert first is fabricated of one of zinc, stainless steel, a titanium alloy, and a composite plastic.

5. The encapsulant compound apparatus of claim 1 , wherein the first insert is replaceable.

6. The encapsulant compound apparatus of claim 1 , wherein the mechanical operator further includes a second insert disposed on the surface of the mechanical operator.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2021
From: CHOPIN, SHEILA F.; LAKHERA, NISHANT; LOW, BOON YEW
To: NXP USA, INC.
Reel/Frame 055221/0109 →
Continuity (1)
Related Publication 20220250301A1 · Aug 11, 2022