Method of transferring material from microfabricated device
Methods of transferring material from a first device having an array of microwells to a second device is provided. In some examples, the first device and the second device are moved together toward a stopper plate and impinge on the stopper plate. In other examples, the first device and the second device are kept stationary and an impinging device is impacted on a mounting structure enclosing the first and second devices, causing material transfer from the microwells of the first device to the second device. Apparatus for carrying out the transfer of material is also disclosed.
1. A method of transferring material from a first device comprising an upper surface including a first array of microwells to a second device comprising an upper surface, wherein at least one of the first array of microwells contain at least one cell, the method comprising:
securing an assembly comprising the first device and the second device in a mounting structure, wherein the first device and the second device are positioned in a way that the upper surface of the second device is opposite the upper surface of the first device and the relative positions of the first device and the second device are fixed; and
moving the mounting structure carrying the first device and the second device toward a stopper plate, the stopper plate having an initial position apart from the mounting structure, until the assembly or a part of the mounting structure contacts the stopper plate, wherein the speed of the mounting structure immediately before the contact is sufficient to cause the transfer of at least a portion of the well content of the at least one of the first array of microwells of the first device to the upper surface of the second device.
2. A method of transferring material from a first device comprising an upper surface including a first array of microwells to a second device comprising an upper surface, wherein at least one of the first array of microwells contain at least one cell, the method comprising:
securing an assembly comprising the first device and the second device in a mounting structure, wherein the first device and the second device are positioned in a way that the upper surface of the second device is opposite the upper surface of the first device and the relative positions of the first device and the second device are fixed; and
moving an impinging device toward the assembly, wherein the impinging device has an initial position apart from the assembly, until the impinging device contacts the assembly or a part of the mounting structure, wherein the momentum of the impinging device immediately before the contact is sufficient to cause the transfer of at least a portion of the well content of the at least one of the first array of microwells of the first device to the upper surface of the second device.
3. The method of claim 1 , wherein the upper surface of the second device comprises a second array of microwells, wherein securing the assembly further comprises aligning at least one microwell of the first array of microwells of the first device with at least one microwell of the second array of microwells of the second device.
4. The method of claim 1 , wherein the upper surface of the second device comprises a conducting substrate.
5. The method of claim 4 , wherein the upper surface of the second device further comprises a MALDI matrix material deposited on top of the conducting substrate.
6. The method of claim 1 , wherein the content in the at least one of the first array of microwells of the first device comprises liquid and a plurality of cells.
7. The method of claim 1 , wherein the mounting structure is configured such that moving the mounting structure toward the stopper plate causes direct contact between the second device with the stopper plate.
8. The method of claim 1 , wherein at least a part of the mounting structure is slidable along a guide rail, and wherein moving the assembly comprises moving the assembly along the guide rail.
9. The method of claim 1 , wherein the mounting structure is configured to be movable along a curve toward the stopper plate.
10. The method of claim 1 , wherein positioning the first device and the second device comprises contacting the upper surface of the first device with the upper surface of the second device.
11. The method of claim 1 , wherein the surface density of the first array of microwells is at least 150 microwells per cm 2 , at least 250 microwells per cm 2 , at least 400 microwells per cm 2 , at least 500 microwells per cm 2 , at least 750 microwells per cm 2 , at least 1,000 microwells per cm 2 , at least 2,500 microwells per cm 2 , at least 5,000 microwells per cm 2 , at least 7,500 microwells per cm 2 , at least 10,000 microwells per cm 2 , at least 50,000 microwells per cm 2 , at least 100,000 microwells per cm 2 , or at least 160,000 per cm 2 .
12. The method of claim 1 , wherein each microwell of the first array of microwells of the first device has a diameter of from about 5 μm to about 500 μm, from about 10 μm to about 300 μm, or from about 20 μm to about 200 μm.
13. The method of claim 2 , wherein the upper surface of the second device comprises a second array of microwells, wherein securing the assembly further comprises aligning at least one microwell of the first array of microwells of the first device with at least one microwell of the second array of microwells of the second device.
14. The method of claim 2 , wherein the upper surface of the second device comprises a conducting substrate.
15. The method of claim 14 , wherein the upper surface of the second device further comprises a MALDI matrix material deposited on top of the conducting substrate.
16. The method of claim 2 , wherein the content in the at least one of the first array of microwells of the first device comprises liquid and a plurality of cells.
17. The method of claim 2 , wherein positioning the first device and the second device comprises contacting the upper surface of the first device with the upper surface of the second device.
18. The method of claim 2 , wherein the surface density of the first array of microwells is at least 150 microwells per cm 2 , at least 250 microwells per cm 2 , at least 400 microwells per cm 2 , at least 500 microwells per cm 2 , at least 750 microwells per cm 2 , at least 1,000 microwells per cm 2 , at least 2,500 microwells per cm 2 , at least 5,000 microwells per cm 2 , at least 7,500 microwells per cm 2 , at least 10,000 microwells per cm 2 , at least 50,000 microwells per cm 2 , at least 100,000 microwells per cm 2 , or at least 160,000 per cm 2 .
19. The method of claim 2 , wherein each microwell of the first array of microwells of the first device has a diameter of from about 5 μm to about 500 μm, from about 10 μm to about 300 μm, or from about 20 μm to about 200 μm.