IP Library › Granted Patent US 11,906,871
Granted Patent B2
US 11,906,871 · App. 17/183,747 · Granted Feb 20, 2024

Electronic paper package structure

Inventor: Jen-Shiun Huang (Hsinchu, TW)
Assignee: E INK HOLDINGS INC.
G02F1/1679G02F1/167G02F1/16753
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Quick Facts
Patent No.
US 11,906,871
App. No.
17/183,747
Granted
Feb 20, 2024
Kind
B2
Abstract

An electronic paper package structure including a substrate, an electronic ink layer, a cover plate, at least one water vapor barrier and a sealant is provided. The electronic ink layer is disposed on the substrate. The cover plate covers the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate. The at least one water vapor barrier is disposed in the groove. The sealant is filled into the groove to cover the at least one water vapor barrier.

Claims (10)

1. An electronic paper package structure, comprising:

a substrate;

an electronic ink layer having four corners, disposed on the substrate;

a cover plate configured to cover the electronic ink layer, wherein the electronic ink layer is located between the substrate and the cover plate, and a groove is defined by a lower surface of the cover plate, a side surface of the electronic ink layer and an upper surface of the substrate;

a plurality of water vapor barriers disposed in the groove and protruding from a side surface of the cover plate; and

a sealant that fills the groove to cover the water vapor barriers, wherein the groove comprises a first area and a second area, and the water vapor barriers are only disposed in the first area of the groove, the first area corresponding to the four corners of the electronic ink layer.

2. The electronic paper package structure according to claim 1 , wherein a water vapor barrier capacity of each of the water vapor barriers is greater than a water vapor barrier capacity of the sealant.

3. The electronic paper package structure according to claim 1 , wherein a material of each of the water vapor barriers comprises polymer, metal or ceramics.

4. The electronic paper package structure according to claim 1 , wherein the side surface of the electronic ink layer is separated from the side surface of the cover plate by a first size, the side surface of the electronic ink layer is separated from a side surface of the substrate by a second size, the first size is smaller than the second size, and a size of the water vapor barrier is between the first size and the second size or is smaller than the first size.

5. The electronic paper package structure according to claim 1 , wherein the second area corresponds to an edge of the electronic ink layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2021
From: HUANG, JEN-SHIUN
To: E INK HOLDINGS INC.
Reel/Frame 055390/0879 →
Priority Claims (1)
TW 109112275 · Apr 13, 2020 · national
Continuity (1)
Related Publication 20210318586A1 · Oct 14, 2021
Cited By (1)
US 12,222,625