Transient liquid phase bonding of surface coatings and metal-covered materials
A method for bonding components is disclosed. The method may comprise positioning an interlayer between a metallic component and a metal-plated non-metallic component at a bond region, heating the bond region to a bonding temperature to produce a liquid at the bond region, and maintaining the bond region at the bonding temperature until the liquid has solidified to form a bond between the metallic component and the metal-plated non-metallic component at the bond region. A method for providing a part having a customized coating is also disclosed. The method may comprise applying a metallic coating on a surface of a metallic substrate, and bonding the metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating.
1. A method for providing a part having a customized coating, comprising:
applying at least one metallic coating on a surface of a metallic substrate to provide a coated substrate; and
bonding the at least one metallic coating to the metallic substrate by a transient liquid phase bonding process to provide the part having the customized coating,
wherein the transient liquid phase bonding process comprises progressively heating the coated substrate to a bonding temperature,
wherein progressively heating the coated substrate to the bonding temperature comprises 1) heating the coated substrate to a first temperature that is lower than the bonding temperature to cause at least a portion of the at least one metallic coating to form at least one liquid interlayer, 2) heating the coated substrate past the first temperature to cause the at least one liquid interlayer to expand in thickness and dissolve a portion of a material forming the metallic substrate, and 3) heating the coated substrate to the bonding temperature to cause the at least one liquid interlayer to undergo an isothermal solidification process,
wherein heating the coated substrate to the first temperature causes a portion of the at least one metallic coating to melt by eutectic melting, and wherein the liquid interlayer is formed between the metallic substrate and an un-melted portion of the at least one metallic coating.
2. A method of claim 1 , wherein the customized coating has a set of properties different than those of the metallic substrate and the at least one metallic coating.
3. The method of claim 1 , wherein a bond between the customized coating and the metallic substrate has a melting temperature that exceeds the bonding temperature.
4. The method of claim 3 , wherein heating the coated substrate to the first temperature causes the at least one metallic coating to melt by direct melting.
5. The method of claim 3 , further comprising continuing heating the part past the bonding temperature to increase the portion of the material forming the metallic substrate in the customized coating.
6. The method of claim 1 , wherein the at least one metallic coating has a thickness of 1 micron to 500 microns.