Packaged electronic device with integral antenna

1. An electronic device, comprising:

a substrate having a first side, a second side, a conductive feed line, a conductive layer, and a conductive terminal, the second side being spaced apart from the first side along a first direction, the conductive feed line being spaced apart from the first side along the first direction, the conductive layer being spaced apart from the conductive feed line along the first direction, the conductive layer including an aperture aligned with a portion of the conductive feed line, and the conductive terminal being attached to the second side of the substrate;

a semiconductor die attached to the first side of the substrate, the semiconductor die being spaced apart from the aperture along a second direction that is orthogonal to the first direction, and the semiconductor die comprising: a first terminal coupled to the conductive feed line, and a second terminal coupled to the conductive layer;

an antenna assembly having a first side, a second side, a conductive antenna, and an insulator, the first side of the antenna assembly being spaced apart from and facing the first side of the substrate along the first direction, the conductive antenna including a first portion exposed along the second side of the antenna assembly, and a second portion exposed along the first side of the antenna assembly, the second portion being spaced apart from and at least partially facing the aperture along the first direction; and

a support structure mounted to a portion of the first side of the substrate and to a portion of the first side of the antenna assembly, the support structure supporting the first side of the antenna assembly spaced apart from the first side of the substrate along the first direction.

2. The electronic device of claim 1 , wherein the insulator includes a ceramic material.

3. The electronic device of claim 1 , wherein the insulator includes a laminate.

4. The electronic device of claim 1 , wherein the insulator includes a molding compound.

5. The electronic device of claim 4 , wherein the support structure includes solder.

6. The electronic device of claim 4 , wherein the support structure includes epoxy.

7. The electronic device of claim 1 , wherein the support structure includes solder.

8. The electronic device of claim 1 , wherein the support structure includes epoxy.

9. The electronic device of claim 1 , wherein the conductive antenna includes copper.

10. The electronic device of claim 1 , wherein the conductive layer extends along the first side of the substrate.

11. An antenna apparatus, comprising:

an antenna assembly having a first side and an opposite second side, the antenna assembly comprising a conductive antenna, and an insulator engaging the conductive antenna, the conductive antenna including a first portion with an exposed surface along the second side, and a second portion exposed along the first side;

a conductive feed line extending on or in a substrate;

a conductive layer on or in the substrate, the conductive layer including an aperture between the conductive feed line and the second portion of the conductive antenna; and

a support structure mounted to a portion of the substrate and to a portion of the first side of the antenna assembly to support the antenna assembly and to provide an air gap between the second portion of the conductive antenna and the aperture.

12. The antenna apparatus of claim 11 , wherein the insulator includes a molding compound.

13. The antenna apparatus of claim 11 , wherein the support structure includes solder.

14. The antenna apparatus of claim 11 , wherein the conductive antenna includes copper.

15. The antenna apparatus of claim 11 , wherein the conductive layer extends along a side of the substrate.

16. A method, comprising:

attaching a semiconductor die to a substrate;

electrically coupling terminals of the semiconductor die to conductive pads of the substrate; and

attaching an antenna assembly to the substrate using a support structure to provide an air gap between an exposed portion of a conductive antenna of the antenna assembly and an aperture in a conductive layer on or in the substrate.

17. The method of claim 16 , further comprising:

forming a conductive antenna having a first portion, and a second portion; and

engaging the conductive antenna to an insulator to form the antenna assembly having a first side and an opposite second side, with a surface of the first portion exposed along the second side, and a surface of the second portion exposed along the first side;

wherein attaching the antenna assembly to the substrate includes positioning the antenna assembly with the surface of the second portion spaced apart from and facing the aperture in the conductive layer on or in the substrate.

18. A method, comprising:

forming a conductive antenna having a first portion, and a second portion;

engaging the conductive antenna to an insulator to form an antenna assembly having a first side and an opposite second side, with a surface of the first portion exposed along the second side, and a surface of the second portion exposed along the first side including performing a molding process that engages a molding compound with portions of the conductive antenna, and that leaves the surface of the first portion exposed along the second side, and the surface of the second portion exposed along the first side;

attaching a semiconductor die to a substrate;

electrically coupling terminals of the semiconductor die to conductive pads of the substrate; and

attaching an antenna assembly to the substrate using a support structure to provide an air gap between an exposed portion of a conductive antenna of the antenna assembly and an aperture in a conductive layer on or in the substrate including positioning the antenna assembly with the surface of the second portion spaced apart from and facing the aperture in the conductive layer on or in the substrate.

19. A method, comprising:

attaching a semiconductor die to a substrate including performing a flip-chip attach process that engages conductive features of the semiconductor die to the conductive pads of the substrate;

electrically coupling terminals of the semiconductor die to conductive pads of the substrate including performing a reflow process that solders the conductive features of the semiconductor die to the conductive pads of the substrate; and

attaching an antenna assembly to the substrate using a support structure to provide an air gap between an exposed portion of a conductive antenna of the antenna assembly and an aperture in a conductive layer on or in the substrate.

20. A method, comprising:

attaching a semiconductor die to a substrate;

electrically coupling terminals of the semiconductor die to conductive pads of the substrate including performing a wire bonding process that couples bond wires between the conductive features of the semiconductor die and respective conductive pads of the substrate and attaching conductive solder balls to conductive features of the substrate; and

attaching an antenna assembly to the substrate using a support structure to provide an air gap between an exposed portion of a conductive antenna of the antenna assembly and an aperture in a conductive layer on or in the substrate.