OLED PANEL WITH INORGANIC PIXEL ENCAPSULATING BARRIER
Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.
1 . A device, comprising:
a substrate;
adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device;
inorganic overhang structures disposed over an upper surface of the PDL structures, wherein each of the inorganic overhang structures comprises:
a lower layer disposed as a single body over the upper surface of a PDL structure of the PDL structures, the lower layer comprising a first composition of a conductive inorganic material; and
an upper portion comprising a second composition different than the first composition, the upper portion disposed over the lower layer, the upper portion including first and second extensions extending laterally past first and second sidewalls of the lower layer, respectively; and
a first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over and in contact with the first anode;
a first cathode disposed over the first OLED material, the first cathode extending under the first extension of the upper portion of a first inorganic overhang structure and contacting the conductive inorganic material of the first composition of the lower layer at the first sidewall of the first inorganic overhang structure of the inorganic overhang structures; and
a first encapsulation layer disposed over the first cathode, wherein the first encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the first sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a first underside surface of the first extension such that a first area is defined between the first encapsulation layer on the first underside surface and the first encapsulation layer over the first cathode; and
over at least a first portion of a top surface of the upper portion of the first inorganic overhang structure; and
a second sub-pixel comprising:
a second anode;
a second OLED material disposed over and in contact with the second anode;
a second cathode disposed over the second OLED material, the second cathode extending under the second extension of the upper portion of the first inorganic overhang structure; and
a second encapsulation layer disposed over the second cathode, wherein the second encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the second sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a second underside surface of the second extension such that a second area is defined between the second encapsulation layer on the second underside surface and the second encapsulation layer over the second cathode; and
over at least a second portion of the top surface of the upper portion of the first inorganic overhang structure.
2 - 4 . (canceled)
5 . The device of claim 1 , wherein:
the first OLED material is defined by a first underside edge of the first extension of the of the upper portion such that the first OLED material does not contact the lower layer of the first inorganic overhang structure; and
the first cathode is defined by the first underside edge of the upper portion of the first inorganic overhang structure.
6 . The device of claim 1 , wherein:
the upper portion comprising the second composition includes a non-conductive inorganic material or the conductive inorganic material, the non-conductive inorganic material comprising an inorganic silicon-containing material and the conductive inorganic material comprising a metal-containing material.
7 . The device of claim 1 , wherein the first sub-pixel further comprises a first plug disposed over the first encapsulation layer, the first plug having a plug transmittance that is matched or substantially matched to an OLED transmittance of the first OLED material.
8 - 11 . (canceled)
12 . The device of claim 1 , further comprising a global passivation layer disposed over the inorganic overhang structures, the first encapsulation layer, and the second encapsulation layer.
13 - 15 . (canceled)
16 . The device of claim 23 , wherein:
the first OLED material is defined by the first underside edge of the upper portion such that the first OLED material does not contact the lower layer of the first inorganic overhang structure; and
the first cathode is defined by the first underside edge of the upper portion of the first inorganic overhang structure.
17 - 19 . (canceled)
20 . The OLED display of claim 23 , wherein:
the first OLED material forms an OLED angle θ OLED between a first OLED vector and a first overhang vector, the first overhang vector defined by the first underside edge and a respective PDL structure, the OLED vector defined by an edge of the first OLED material and the first underside edge; and
the first cathode forms a first cathode angle θ cathode between a first cathode vector and the overhang vector, the first cathode vector defined by the edge of the first cathode and the first underside edge.
21 . (canceled)
22 . (canceled)
23 . A device, comprising:
a substrate;
adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device;
inorganic overhang structures disposed over an upper surface of the PDL structures, wherein each of the inorganic overhang structures comprises:
a lower layer disposed as a single body over the upper surface of a PDL structure of the PDL structures, the lower layer comprising a first composition of a conductive inorganic material; and
an upper portion comprising a second composition different than the first composition, the upper portion disposed over the lower layer, the upper portion including first and second extensions extending laterally past first and second sidewalls of the lower layer, respectively; and
a first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over and in contact with the first anode; and
a first cathode disposed over the first OLED material, the first cathode of the first sub-pixel having the first OLED material configured to emit light of a first color when energized, the first cathode extending under the first extension of the upper portion of a first inorganic overhang structure and contacting the conductive inorganic material of the first composition of the lower layer at the first sidewall of the first inorganic overhang structure of the inorganic overhang structures;
a first encapsulation layer disposed over the first cathode, wherein the first encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the first sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a first underside surface of the first extension; and
over at least a first portion of a top surface of the upper portion of the first inorganic overhang structure;
a second sub-pixel comprising:
a second anode; and
a second OLED material disposed over and in contact with the second anode;
a second cathode disposed over the second OLED material, the second cathode of the second sub-pixel having the second OLED material configured to emit light of a second color when energized, the first color being different from the second color, the second cathode extending under the second extension of the upper portion of the first inorganic overhang structure; and
a second encapsulation layer disposed over the second cathode, the second encapsulation layer spaced apart from the first encapsulation layer, wherein the second encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the second sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a second underside surface of the second extension; and
over at least a second portion of the top surface of the upper portion of the first inorganic overhang structure; and
a global passivation layer disposed over the inorganic overhang structures and the first and second sub-pixels.
24 . (canceled)
25 . An organic light-emitting diode (OLED) display, comprising:
a sub-pixel circuit, the sub-pixel circuit comprising:
a substrate;
adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the sub-pixel circuit;
inorganic overhang structures disposed over an upper surface of the PDL structures, wherein each of the inorganic overhang structures comprises:
a lower layer disposed as a single body over the upper surface of a PDL structure of the PDL structures, the lower layer comprising a first composition of a conductive inorganic material; and
an upper portion comprising a second composition different than the first composition, the upper portion disposed over the lower layer, the upper portion including first and second extensions extending laterally past first and second sidewalls of the lower layer, respectively;
a first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over and in contact with the first anode;
a first cathode disposed over the first OLED material, the first cathode extending under the first extension of the upper portion of a first inorganic overhang structure and contacting the conductive inorganic material of the first composition of the lower layer at the first sidewall of the first inorganic overhang structure of the inorganic overhang structures; and
a first encapsulation layer disposed over the first cathode, wherein the first encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the first sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a first underside surface of the first extension such that a first area is defined between the first encapsulation layer on the first underside surface and the first encapsulation layer over the first cathode; and
over at least a first portion of a top surface of the upper portion of the first inorganic overhang structure;
a second sub-pixel comprising:
a second anode;
a second OLED material disposed over and in contact with the second anode;
a second cathode disposed over the second OLED material, the second cathode extending under the second extension of the upper portion of the first inorganic overhang structure; and
a second encapsulation layer disposed over the first cathode, the second encapsulation layer spaced apart from the first encapsulation layer, wherein the second encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the second sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a second underside surface of the second extension such that a second area is defined between
the second encapsulation layer on the second underside surface and the second encapsulation layer over the second cathode; and
over at least a second portion of the top surface of the upper portion of the first inorganic overhang structure; and
a global passivation layer disposed over the inorganic overhang structures and the first and second sub-pixels.
26 . (canceled)
27 . (canceled)
28 . The device of claim 1 , wherein the first encapsulation layer is separated from the second encapsulation layer by a discontinuity, the discontinuity between the first encapsulation layer and the second encapsulation layer over the top surface of the upper portion of the first overhang structure.
29 . The device of claim 1 , wherein the first and second encapsulation layers contact the top surface of the upper portion of the first overhang structure.
30 . The device of claim 1 , wherein the first and second encapsulation layers include a non-conductive inorganic material.
31 . The device of claim 1 , wherein the non-conductive inorganic material includes a silicon-containing material.
32 . The device of claim 1 , wherein:
the inorganic overhang structures are disposed on the upper surface of the PDL structures;
the lower layer is disposed as the single body on the upper surface of the PDL structure of the PDL structures; and
the upper portion disposed on the lower layer.
33 . The device of claim 1 , wherein the second cathode contacts the conductive inorganic material of the second composition of the lower layer at the second sidewall of the first inorganic overhang structure of the inorganic overhang structures.
34 . The device of claim 1 , wherein the single body is a composition of indium tin oxide.
35 . The device of claim 1 , wherein the single body includes copper, titanium, aluminum, molybdenum, silver, indium tin oxide, indium zinc oxide, or combinations thereof.
36 . The device of claim 1 , wherein:
the first encapsulation layer is disposed over a first upper sidewall of the upper portion of the first inorganic overhang structure; and
the second encapsulation layer is disposed over a second upper sidewall of the upper portion of the first inorganic overhang structure.
37 . The device of claim 36 , wherein:
the first OLED material, the first cathode, and the first encapsulation layer are disposed over the first upper sidewall of the upper portion of the first inorganic overhang structure; and
the second OLED material, second first cathode, and the second encapsulation layer are disposed over the upper second sidewall of the upper portion of the first inorganic overhang structure.
38 . The device of claim 1 , wherein:
the first encapsulation layer is a first passivation layer; and
the second encapsulation layer is a second passivation layer.
39 . The device of claim 38 , wherein:
the first passivation layer is continuous from the upper portion of the first inorganic overhang structure, the first underside surface of the first extension, and to the first cathode at the first sidewall of the first inorganic overhang structure; and
the second passivation layer is continuous from the upper portion of the first inorganic overhang structure, the second underside surface of the second extension, and to the second cathode at second sidewall of the first inorganic overhang structure.
40 . The device of claim 38 , wherein the first passivation layer and the second passivation layer include a non-conductive inorganic material.
41 . The device of claim 40 , wherein the non-conductive inorganic material is a silicon-containing material.
42 . The device of claim 28 , wherein a first material is disposed between the second encapsulation layer and the first encapsulation layer that are spaced apart from each other.
43 . The device of claim 42 , wherein the first material is an acrylic material.
44 . The device of claim 42 , wherein the first material is disposed in:
the first area between the first encapsulation layer on the first underside surface and the first encapsulation layer over the first cathode; and
the second area between the second encapsulation layer on the second underside surface and the second encapsulation layer over the second cathode.
45 . The device of claim 7 , wherein:
the first plug of the first sub-pixel is disposed in the first area between the first encapsulation layer on the first underside surface and the first encapsulation layer over the first cathode; and the
a second plug of the second sub-pixel is disposed in the second area between the second encapsulation layer on the second underside surface and the second encapsulation layer over the second cathode.
46 . The device of claim 1 , wherein:
the first encapsulation layer is continuous from the upper portion of the first inorganic overhang structure, the first underside surface of the first extension, and to the first cathode at the first sidewall of the first inorganic overhang structure; and
the second encapsulation layer is continuous from the upper portion of the first inorganic overhang structure, the second underside surface of the second extension, and to the second cathode at second sidewall of the first inorganic overhang structure.
47 . A device, comprising:
a substrate;
adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device;
inorganic overhang structures disposed over an upper surface of the PDL structures, wherein each of the inorganic overhang structures comprises:
a lower layer disposed as a single body over the upper surface of a PDL structure of the PDL structures, the lower layer comprising a first composition of a conductive inorganic material; and
an upper portion comprising a second composition different than the first composition, the upper portion disposed over the lower layer, the upper portion including first and second extensions extending laterally past first and second sidewalls of the lower layer, respectively; and
a first sub-pixel comprising:
a first anode;
a first organic light-emitting diode (OLED) material disposed over and in contact with the first anode;
a first cathode disposed over the first OLED material, the first cathode extending under the first extension of the upper portion of a first inorganic overhang structure and contacting the conductive inorganic material of the first composition of the lower layer at the first sidewall of the first inorganic overhang structure of the inorganic overhang structures; and
a first encapsulation layer disposed over the first cathode, wherein the first encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the first sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a first underside surface of the first extension such that a first area is defined between the first encapsulation layer on the first underside surface and the first encapsulation layer over the first cathode; and
over at least a first portion of a top surface of the upper portion of the first inorganic overhang structure; and
a second sub-pixel comprising:
a second anode;
a second OLED material disposed over and in contact with the second anode;
a second cathode disposed over the second OLED material, the second cathode extending under the second extension of the upper portion of the first inorganic overhang structure; and
a second encapsulation layer disposed over the second cathode, the second encapsulation layer spaced apart from the first encapsulation layer, wherein the second encapsulation layer extends:
to contact the conductive inorganic material of the first composition of the lower layer of the first inorganic overhang structure at the second sidewall;
to contact the second composition of the upper portion of the first inorganic overhang structure at a second underside surface of the second extension such that a second area is defined between the second encapsulation layer on the second underside surface and the second encapsulation layer over the second cathode; and
over at least a second portion of the top surface of the upper portion of the first inorganic overhang structure.