Semiconductor device and semiconductor memory device
A semiconductor device according to an embodiment includes an oxide semiconductor layer, a gate electrode, and the gate electrode, a first electrode electrically connected to the oxide semiconductor layer, a second electrode electrically connected to the oxide semiconductor layer, a first conductive layer provided at at least one position between the oxide semiconductor layer and the first electrode and between the oxide semiconductor layer and the second electrode, the first conductive layer containing a first metal element, a first element different from the first metal element, and one of oxygen (O) or nitrogen (N), and a second conductive layer between the oxide semiconductor layer and the first conductive layer, the second conductive layer containing oxygen (O) and a second element different from both of the first metal element and the first element. The gate electrode is between the first electrode and the second electrode in the first direction.
1. A semiconductor device comprising:
an oxide semiconductor layer;
a gate electrode;
a gate insulating layer provided between the oxide semiconductor layer and the gate electrode;
a first electrode electrically connected to the oxide semiconductor layer at a first position of the oxide semiconductor layer;
a second electrode electrically connected to the oxide semiconductor layer at a second position of the oxide semiconductor layer disposed in a first direction with respect to the first position;
a first conductive layer provided at at least one position between the oxide semiconductor layer and the first electrode or between the oxide semiconductor layer and the second electrode, the first conductive layer containing a first metal element, a first element different from the first metal element, and oxygen (O); and
a second conductive layer provided between the oxide semiconductor layer and the first conductive layer, the second conductive layer containing oxygen (O) and a second element different from both of the first metal element and the first element,
wherein a third position of the oxide semiconductor layer facing the gate electrode is disposed between the first position and the second position in the first direction.
2. The semiconductor device according to claim 1 , wherein the first metal element is at least one element selected from the group consisting of titanium (Ti), silver (Ag), nickel (Ni), copper (Cu), and tantalum (Ta).
3. The semiconductor device according to claim 1 , wherein the first element is at least one element selected from the group consisting of zinc (Zn), silicon (Si), aluminum (Al), tin (Sn), gallium (Ga), hafnium (Hf), lanthanum (La), and cerium (Ce).
4. The semiconductor device according to claim 1 , wherein the second element is at least one element selected from the group consisting of indium (In), zinc (Zn), tin (Sn), and cadmium (Cd).
5. The semiconductor device according to claim 1 , wherein each of the first electrode and the second electrode is a metal having a chemical composition different from a chemical composition of the first conductive layer.
6. The semiconductor device according to claim 1 , wherein each of the first electrode and the second electrode contains tungsten (W) or molybdenum (Mo).
7. The semiconductor device according to claim 1 , wherein the oxide semiconductor layer contains indium (In), gallium (Ga), and zinc (Zn).
8. The semiconductor device according to claim 1 , further comprising:
a third conductive layer provided at at least one position between the first electrode and the first conductive layer or between the second electrode and the first conductive layer, the third conductive layer containing the first metal element, and a concentration of the first metal element in the third conductive layer being higher than a concentration of the first metal element in the first conductive layer.
9. The semiconductor device according to claim 1 , wherein a thickness of the first conductive layer is more than a thickness of the second conductive layer.
10. The semiconductor device according to claim 1 , wherein the first conductive layer is amorphous.
11. The semiconductor device according to claim 1 , wherein the gate electrode surrounds the oxide semiconductor layer.
12. A semiconductor device comprising:
an oxide semiconductor layer;
a gate electrode;
a gate insulating layer provided between the oxide semiconductor layer and the gate electrode;
a first electrode electrically connected to the oxide semiconductor layer at a first position of the oxide semiconductor layer;
a second electrode electrically connected to the oxide semiconductor layer at a second position of the oxide semiconductor layer disposed in a first direction with respect to the first position;
a first conductive layer provided at at least one position between the oxide semiconductor layer and the first electrode or between the oxide semiconductor layer and the second electrode, the first conductive layer containing a first metal element, a first element different from the first metal element, and at least one element of oxygen (O) or nitrogen (N); and
a second conductive layer provided between the oxide semiconductor layer and the first conductive layer, the second conductive layer containing oxygen (O) and a second element different from both of the first metal element and the first element,
wherein a third position of the oxide semiconductor layer facing the gate electrode is disposed between the first position and the second position in the first direction,
wherein a crystal grain size of the first conductive layer is smaller than a crystal grain size of the second conductive layer.
13. A semiconductor memory device comprising:
a first wire extending in a first direction;
a second wire extending in a second direction intersecting the first direction; and
a memory cell,
wherein the memory cell includes
an oxide semiconductor layer electrically connected to the first wire, the oxide semiconductor layer being surrounded by a part of the second wire,
a gate insulating layer provided between the oxide semiconductor layer and the part of the second wire,
a capacitor electrically connected to the oxide semiconductor layer,
a first conductive layer provided at at least one position between the oxide semiconductor layer and the first wire or between the oxide semiconductor layer and the capacitor, the first conductive layer containing a first metal element, a first element different from the first metal element, and oxygen (O), and
a second conductive layer provided between the oxide semiconductor layer and the first conductive layer, the second conductive layer containing oxygen (O) and a second element different from both of the first metal element and the first element.
14. The semiconductor memory device according to claim 13 , wherein the first metal element is at least one element selected from the group consisting of titanium (Ti), silver (Ag), nickel (Ni), copper (Cu), and tantalum (Ta).
15. The semiconductor memory device according to claim 13 , wherein the first element is at least one element selected from the group consisting of zinc (Zn), silicon (Si), aluminum (Al), tin (Sn), gallium (Ga), hafnium (Hf), lanthanum (La), and cerium (Ce).
16. The semiconductor memory device according to claim 13 , wherein the second element is at least one element selected from the group consisting of indium (In), zinc (Zn), tin (Sn), and cadmium (Cd).