IP Library › Granted Patent US 11,965,731
Granted Patent B2
US 11,965,731 · App. 17/200,868 · Granted Apr 23, 2024

Package structure and measurement method for the package structure

Inventor: Kuei-Sung Chang (Kaohsiung, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
G01B11/14G01B21/16H01L21/4817H01L21/50H01L21/56H01L22/12H01L23/04H01L23/043H01L23/28G01B7/31
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Quick Facts
Patent No.
US 11,965,731
App. No.
17/200,868
Granted
Apr 23, 2024
Kind
B2
Abstract

The present disclosure provides a measurement method including providing a base, a device disposed on the base, and a lid disposed over the base and the device; irradiating a top surface of the device through an opening of the lid to obtain a first focal plane associated with a top surface of the device; irradiating the lid at the lower end of the opening to obtain a second focal plane associated with the lid at the lower end of the opening; and deriving a distance between the top surface of the device and an interior surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane. The present disclosure also provides a package structure for the measurement.

Claims (37)

1. A measurement method, comprising:

providing a base, a device disposed on the base, and a lid disposed over the base and the device, wherein the lid includes an opening disposed above and tapered toward the device, and the opening includes a lower end proximal to the device;

irradiating a top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device;

irradiating the lid at the lower end of the opening to obtain a second focal plane associated with the lid at the lower end of the opening; and

deriving a distance between the top surface of the device and an interior surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane.

2. The measurement method according to claim 1 , wherein the top surface of the device and the lid at the lower end of the opening are irradiated by X-ray, infrared (IR), ultraviolet (UV) or visible light.

3. The measurement method according to claim 1 , wherein the irradiation includes adjusting a focus on the top surface of the device or the lid at the lower end of the opening.

4. The measurement method according to claim 1 , wherein the first focal plane is substantially coplanar with the top surface of the device, and the second focal plane is substantially coplanar with the interior surface of the lid facing the top surface of the device.

5. The measurement method according to claim 1 , wherein the first focal plane is substantially parallel to the second focal plane.

6. The measurement method according to claim 1 , further comprising sealing the opening after the deriving of the distance.

7. The measurement method according to claim 1 , wherein the opening is formed by removing a portion of the lid.

8. The measurement method according to claim 1 , wherein the opening is formed before the lid is disposed over the base and the device.

9. A measurement method, comprising:

providing a device having a top surface;

forming an opening extending through a lid;

disposing the lid above the device to at least partially expose the top surface of the device through the opening;

irradiating the top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device;

irradiating a lower end of the opening proximal to the top surface of the device to obtain a second focal plane associated with the lower end of the opening; and

deriving a vertical distance between the first focal plane and the second focal plane.

10. The measurement method according to claim 9 , wherein the irradiating the top surface of the device and the irradiating the lower end of the opening are implemented sequentially.

11. The measurement method according to claim 9 , wherein the vertical distance is substantially equal to a gap width between the top surface of the device and an interior surface of the lid facing to the top surface of the device.

12. The measurement method according to claim 9 , wherein the opening has inconsistent width along a thickness of the lid.

13. The measurement method according to claim 9 , further comprising laterally moving a light source after the irradiating the top surface of the device.

14. The measurement method according to claim 9 , wherein the opening is tapered toward or away from the top surface of the device.

15. The measurement method according to claim 9 , further comprising forming a sealing member over the device and filled the entire opening after the deriving the vertical distance.

16. The measurement method according to claim 15 , wherein the sealing member is irremovable from the opening.

17. A measurement method, comprising:

providing a device having a top surface;

forming a first opening and a second opening extending through a lid;

disposing the lid above the device to at least partially expose the top surface of the device through the first opening and the second opening;

irradiating the top surface of the device through the first opening or the second opening to obtain a first focal plane associated with the top surface of the device;

irradiating a first lower end of the first opening proximal to the top surface of the device to obtain a second focal plane associated with the first lower end of the first opening;

irradiating a second lower end of the second opening proximal to the top surface of the device to obtain a third focal plane associated with the second lower end of the second opening; and

deriving a first vertical distance between the first focal plane and the second focal plane, and a second vertical distance between the first focal plane and the third focal plane.

18. The measurement method according to claim 17 , wherein the first vertical distance is different from the second vertical distance, and a depth of the first opening is different from a depth of the second opening.

19. The measurement method according to claim 17 , wherein the irradiating the first lower end of the first opening and the irradiating the second lower end of the second opening are implemented sequentially or simultaneously.

20. The measurement method according to claim 17 , further comprising sealing the first opening and the second opening after the deriving the first vertical distance and the second vertical distance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2021
From: CHANG, KUEI-SUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 055584/0701 →
Continuity (2)
Provisional Application 63109165 · Nov 3, 2020
Related Publication 20220139789A1 · May 5, 2022
Cited By (1)
US 12,455,160