Vibrator device
A vibrator device includes a semiconductor substrate, a vibrator element, a circuit element, a wiring, a processing circuit, and a through electrode. The semiconductor substrate has a first surface and an opposite-side second surface of the semiconductor substrate from the first surface. The vibrator element is provided at the first surface. The circuit element is provided at the first surface and includes an oscillation circuit. The wiring is provided at the first surface and electrically couples the vibrator element and the oscillation circuit. The processing circuit is provided at the second surface and processes an output signal of the oscillation circuit. The through electrode penetrates the semiconductor substrate and electrically couples the oscillation circuit and the processing circuit.
1. A vibrator device comprising:
a semiconductor substrate having a first surface and an opposite-side second surface of the semiconductor substrate from the first surface;
a vibrator element provided at the first surface;
a circuit element that is provided at the first surface and that includes an oscillation circuit;
a wiring that is provided at the first surface and that electrically couples the vibrator element and the oscillation circuit;
a processing circuit that is provided at the second surface and that processes an output signal of the oscillation circuit;
a stacked body that is provided at the second surface and that includes an insulating layer, a wiring layer, and a terminal layer; and
a through electrode that penetrates the semiconductor substrate from the first surface to the second surface, and the through electrode electrically couples the oscillation circuit provided at the first surface of the semiconductor substrate and the processing circuit provided at the second surface of the semiconductor substrate,
wherein the processing circuit includes a plurality of active elements electrically coupled to one another via wirings of the wiring layer of the stacked body and the processing circuit is integrally formed with the semiconductor substrate.
2. The vibrator device according to claim 1 , wherein
the processing circuit includes a phase locked loop (PLL) circuit.
3. The vibrator device according to claim 1 , wherein
the circuit element includes a temperature detection element that detects a temperature of the vibrator element.
4. The vibrator device according to claim 1 , wherein
the vibrator element and the circuit element are arranged side by side at the first surface.
5. The vibrator device according to claim 4 , wherein
the vibrator element is electrically coupled to the wiring at an end portion located at a circuit element side.
6. A vibrator device comprising:
a first semiconductor substrate having a first surface and an opposite-side second surface of the first semiconductor substrate from the first surface;
a circuit element including a second semiconductor substrate that is provided at the first surface and that has an opposite-side third surface of the second semiconductor substrate from the first surface, and an oscillation circuit provided at the third surface;
a vibrator element provided at the third surface of the circuit element;
a wiring that is provided at the third surface and that electrically couples the vibrator element and the oscillation circuit;
a processing circuit that is provided at the second surface and that processes an output signal of the oscillation circuit; and
a first through electrode that penetrates the first semiconductor substrate and that electrically couples the oscillation circuit and the processing circuit.
7. The vibrator device according to claim 6 , wherein
the circuit element includes a second through electrode that penetrates the second semiconductor substrate and that electrically couples the oscillation circuit and the first through electrode.
8. The vibrator device according to claim 1 , further comprising:
a lid that is bonded to the first surface of the semiconductor substrate and that forms an accommodation space that accommodates the vibrator element between the lid and the semiconductor substrate.