Module
A module ( 101 ) is provided with a substrate including a principal surface ( 1 u ), a plurality of electronic components ( 41, 42 , and 43 ) arranged on the principal surface ( 1 u ), a sealing resin ( 3 ) covering the principal surface ( 1 u ), a ground electrode arranged on the principal surface ( 1 u ), a conductive layer ( 6 ) covering the sealing resin ( 3 ), and a magnetic member ( 5 ). The conductive layer ( 6 ) is electrically connected to the ground electrode by a plurality of connecting conductors ( 62 ) arranged so as to penetrate the sealing resin ( 3 ), and the magnetic member ( 5 ) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin ( 3 ) and a magnetic member wall-shaped portion ( 52 ) arranged in a wall shape in the sealing resin ( 3 ). The magnetic member wall-shaped portion ( 52 ) is longer than each of the connecting conductors ( 62 ).
1. A module comprising:
a substrate including a principal surface;
a plurality of electronic components arranged on the principal surface;
a sealing resin covering the principal surface and the plurality of electronic components;
a ground electrode arranged on the principal surface;
a conductive layer covering the sealing resin; and
a magnetic member,
wherein the conductive layer is electrically connected to the ground electrode by a plurality of connecting conductors arranged so as to penetrate the sealing resin,
wherein the magnetic member includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin and a plurality of magnetic member wall-shaped portions intermittently arranged in a wall shape between any of the plurality of electronic components in the sealing resin,
wherein, when viewed in a direction perpendicular to the principal surface, each of the plurality of connecting conductors includes a portion arranged so as to at least partially overlap with either a strip-shaped region virtualized on an extension of the single magnetic member wall-shaped portion or the plurality of magnetic member wall-shaped portions, and
wherein a length of the single magnetic member wall-shaped portion or any one of the plurality of magnetic member wall-shaped portions is longer than a length of each of the connecting conductors.
2. The module according to claim 1 , wherein the sealing resin includes a sealing resin side surface,
wherein at least one of the plurality of magnetic member wall-shaped portions is exposed from the sealing resin at a first portion of the sealing resin side surface, and
wherein at least one of the plurality of connecting conductors is exposed from the sealing resin at a second portion of the sealing resin side surface.
3. The module according to claim 1 , wherein the magnetic member plate-shaped portion is interposed between the conductive layer and the sealing resin, and wherein when viewed in a direction perpendicular to the principal surface, an area of the magnetic member plate-shaped portion is smaller than an area of the conductive layer, and wherein, in a first region surrounded by the conductive layer, a second region smaller than the first region and surrounded by the magnetic member exists.
4. The module according to claim 1 , wherein the magnetic member contains an alloy, a ferrite material or a permalloy plated material, wherein the alloy includes an Fe—Co-based alloy and an Fe—Ni-based alloy, and the ferrite material includes NiZn and MnZn.
5. The module according to claim 1 , wherein the substrate further includes a second principal surface as a surface opposite to the principal surface,
the module comprising:
a second electronic component arranged on the second principal surface;
a second sealing resin covering the second principal surface and the second electronic component; and
an external terminal provided on the second principal surface.
6. The module according to claim 2 , wherein the magnetic member plate-shaped portion is interposed between the conductive layer and the sealing resin, and wherein when viewed in a direction perpendicular to the principal surface, an area of the magnetic member plate-shaped portion is smaller than an area of the conductive layer, and wherein, in a first region surrounded by the conductive layer, a second region smaller than the first region and surrounded by the magnetic member exists.
7. The module according to claim 2 , wherein the magnetic member contains an alloy, a ferrite material or a permalloy plated material, wherein the alloy includes an Fe—Co-based alloy and an Fe—Ni-based alloy, and the ferrite material includes NiZn and MnZn.
8. The module according to claim 3 , wherein the magnetic member contains an alloy, a ferrite material or a permalloy plated material, wherein the alloy includes an Fe—Co-based alloy and an Fe—Ni-based alloy, and the ferrite material includes NiZn and MnZn.
9. The module according to claim 2 , wherein the substrate further includes a second principal surface as a surface opposite to the principal surface,
the module comprising:
a second electronic component arranged on the second principal surface;
a second sealing resin covering the second principal surface and the second electronic component; and
an external terminal provided on the second principal surface.
10. The module according to claim 3 , wherein the substrate further includes a second principal surface as a surface opposite to the principal surface,
the module comprising:
a second electronic component arranged on the second principal surface;
a second sealing resin covering the second principal surface and the second electronic component; and
an external terminal provided on the second principal surface.
11. The module according to claim 4 , wherein the substrate further includes a second principal surface as a surface opposite to the principal surface,
the module comprising:
a second electronic component arranged on the second principal surface;
a second sealing resin covering the second principal surface and the second electronic component; and
an external terminal provided on the second principal surface.