Fiber-to-fiber platform for multi-layer ferroelectric on insulator waveguide devices
A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
1. A system comprising:
a first fiber-to-chip coupler configured to receive light from a first optical fiber;
a plurality of multi-layer ferroelectric on insulator optical waveguides; and
a second fiber-to-chip coupler configured to output light to a second optical fiber, wherein the multi-layer ferroelectric on insulator waveguides are coupled between the first fiber-to-chip coupler and the second fiber-to-chip coupler,
wherein the multi-layer ferroelectric on insulator waveguides comprise multi-layer coupled waveguides that allow light to be coupled vertically from a ferroelectric waveguide on one level to a non-ferroelectric waveguide on another level.
2. The system of claim 1 , wherein the first fiber-to-chip coupler is configured to allow light to be coupled from a single mode optical fiber into a ferroelectric on insulator waveguide, and the second fiber-to-chip coupler is configured to allow light to be coupled from a ferroelectric on insulator waveguide into a second single mode optical fiber.
3. The system of claim 1 , wherein the multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings, and electrical interconnects, compatible with packaging.
4. The system of claim 1 , wherein one physical optical fiber functions as both the input and the output optical fibers, and one physical fiber-to-chip coupler functions as both the input and output fiber-to-chip couplers.
5. A system comprising:
a first fiber-to-chip coupler configured to receive light from a first optical fiber;
a plurality of multi-layer ferroelectric on insulator optical waveguides and non-ferroelectric on insulator waveguides; and
a second fiber-to-chip coupler configured to output light to a second optical fiber, wherein the multi-layer ferroelectric on insulator optical waveguides and the non-ferroelectric on insulator optical waveguides are coupled between the first fiber-to-chip coupler and the second fiber-to-chip coupler,
wherein the multi-layer ferroelectric on insulator waveguides comprise multi-layer coupled waveguides that allow light to be coupled vertically from a ferroelectric waveguide on one level to a non-ferroelectric waveguide on another level.
6. The system of claim 5 , wherein the multi-layer ferroelectric on insulator waveguides comprise at least one ferroelectric on insulator waveguide, such as a lithium niobate on insulator (LNOI) waveguide.
7. The system of claim 5 , wherein the first fiber-to-chip coupler is configured to allow light to be coupled from a single mode optical fiber into a ferroelectric on insulator waveguide, or into a non-ferroelectric on insulator waveguide, and the second fiber-to-chip coupler is configured to allow light to be coupled from a ferroelectric on insulator waveguide into a single mode optical fiber, or coupled from a non-ferroelectric on insulator waveguide into a single mode optical fiber.
8. The system of claim 5 , wherein the multi-layer ferroelectric and non-ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings, and electrical interconnects, compatible with packaging.
9. The system of claim 5 , wherein one physical optical fiber functions as both the input and the output optical fibers, and one physical fiber-to-chip coupler functions as both the input and output fiber-to-chip couplers.