Method of producing optoelectronic semiconductor components and an optoelectronic semiconductor component
An optoelectronic semiconductor component includes a primary light source including a carrier and a semiconductor layer sequence mounted thereon and configured to generate primary light, and at least one conversion unit of at least one semiconductor material adapted to convert the primary light into at least one secondary light, wherein the semiconductor layer sequence and the converter unit are separate elements, the semiconductor layer sequence includes a plurality of pixels, the pixels are configured to be controlled electrically independently of each other, the carrier includes a plurality of control units configured to drive the pixels, all pixels of a first group are free of a conversion unit and are configured to emit the primary light, all pixels of a second group of pixels include exactly one conversion unit each and are configured to emit the at least one secondary light.
1. An optoelectronic semiconductor component comprising:
a primary light source comprising a carrier and a semiconductor layer sequence mounted thereon and configured to generate primary light, and
at least one conversion unit of at least one semiconductor material adapted to convert the primary light into at least one secondary light,
wherein
the semiconductor layer sequence and the converter unit are separate elements,
the semiconductor layer sequence comprises a plurality of pixels,
the pixels are configured to be controlled electrically independently of each other,
the carrier comprises a plurality of control units configured to drive the pixels,
all pixels of a first group are free of a conversion unit, and the pixels of the first group are configured to emit the primary light,
all pixels of a second group of pixels comprise exactly one conversion unit each, and the pixels of the second group are configured to emit the at least one secondary light,
a plurality of pixels from the first group and the second group are combined to form a display area that is adjustable to emit light of different colors, and
a light path between the carrier and a light-exit side of the conversion unit facing away from the carrier is free of organic materials.
2. The optoelectronic semiconductor component according to claim 1 , wherein the semiconductor layer sequence and the conversion unit are produced separately from each other and are not grown together.
3. The optoelectronic semiconductor component according to claim 1 , wherein the semiconductor layer sequence and the conversion unit are in direct physical contact with each other.
4. The optoelectronic semiconductor component according to claim 1 , wherein the semiconductor layer sequence is structured into the plurality of pixels that can be controlled electrically independently of each other.
5. The optoelectronic semiconductor component according to claim 1 , wherein no conversion unit is assigned to the pixels of the first group so that selected pixels emit the primary light.
6. The optoelectronic semiconductor component according to claim 1 , wherein the second group of pixels comprises a first sub-group of pixels configured to emit green light.
7. The optoelectronic semiconductor component according to claim 1 , wherein the second group of pixels comprises a second sub-group of pixels configured to emit red light.
8. The optoelectronic semiconductor component according to claim 1 , wherein the semiconductor layer sequence is based on AlInGaN, the semiconductor material is based on AlInGaN, AlInGaP or AlInGaAs, and the carrier is based on Si or Ge.
9. The optoelectronic semiconductor component according to claim 1 , wherein adjacent pixels are optically isolated by an opaque partition wall from each other, the partition wall completely penetrating at least one conversion unit and at least partially the semiconductor layer sequence.
10. The optoelectronic semiconductor component according to claim 1 , wherein the semiconductor layer sequence extends continuously and contiguously over all the pixels.
11. The optoelectronic semiconductor component according to claim 1 , wherein at least one mirror layer is applied to a side of the conversion units facing the semiconductor layer sequence, and the mirror layer is impermeable to the secondary light produced in an associated conversion unit and permeable to the primary light.
12. The optoelectronic semiconductor component according to claim 1 , wherein at least one filter layer is applied to a side of the conversion units facing away from the carrier, the filter layer is impermeable to the primary light, and the filter layer completely covers the conversion units.
13. The optoelectronic semiconductor component according to claim 1 , wherein the conversion unit or each of the conversion units and/or the semiconductor layer sequence have a thickness of 1 μm to 10 μm, the pixels having an average diameter of 3 μm to 200 μm in plan view, a distance between adjacent pixels is 0.3 μm to 6 μm, and the semiconductor component includes 100 to 10 7 of the pixels.
14. An optoelectronic semiconductor component comprising:
a primary light source comprising a carrier and a semiconductor layer sequence mounted thereon that generate primary light, and
at least one conversion unit of at least one semiconductor material adapted to convert the primary light into at least one secondary light,
wherein
the semiconductor layer sequence and the conversion unit are produced separately from each other and are not grown together, the semiconductor layer sequence is structured into a plurality of pixels that can be controlled electrically independently of each other,
the carrier comprises a plurality of control units that drive the pixels,
no conversion unit is assigned to some of the pixels so that selected pixels emit the primary light, and exactly one conversion unit each is assigned to remaining pixels,
a plurality of pixels emitting different colors are combined to form a display area that is adjustable to emit light of different colors, and
a light path between the carrier and a light-exit side of the conversion unit facing away from the carrier is free of organic materials.