Focused ion beam processing apparatus
Provided is a focused ion beam processing apparatus including: an ion source; a sample stage a condenser lens; an aperture having a slit in a straight line shape; a projection lens and the sample stage, wherein, in a transfer mode, by Köhler illumination, with an applied voltage of the condenser lens when a focused ion beam is focused on a main surface of the projection lens scaled to be 100, the applied voltage is set to be less than 100 and greater than or equal to 80; a position of the aperture is set such that the focused ion beam is masked by the aperture with the one side of the aperture at a distance greater than 0 μm and equal to or less than 500 μm from a center of the focused ion beam; and the shape of the slit is transferred onto the sample.
1. A focused ion beam processing apparatus for processing a cross-section parallel to an irradiation direction of a focused ion beam with respect to a sample comprising:
an ion source;
a sample stage holding a sample;
a condenser lens focusing ions emitted from the ion source into a focused ion beam;
an aperture having a slit with at least one side in a straight line shape, the slit being used to mask a part of the focused ion beam focused by the condenser lens to process the sample into a desired shape;
a projection lens placed in a beam path between the aperture and the sample stage, and focusing the focused ion beam that passed through the aperture on a predetermined position on the sample; and
a computer as a control means configured to control elements of the focused ion beam processing apparatus,
wherein, in a transfer mode, the computer is configured to set:
an applied voltage of the condenser lens to be 80% or more and less than 100% relative to an initial applied voltage of the condenser lens, wherein the initial applied voltage is set when the focused ion beam is focused on a main surface of the projection lens by Köhler illumination;
a position of the aperture such that the focused ion beam is masked by the aperture with the at least one side of the aperture at a distance greater than 0 μm and equal to or less than 500 μm from a center of the focused ion beam; and
an applied voltage of the projection lens such that an image formed by the slit of the aperture is focused on a surface of the sample, and
wherein the surface of the sample is irradiated at once with the focused ion beam that is formed in a shape of the slit without scanning with the focused ion beam so that the shape of the slit is transferred onto the sample in the transfer mode.
2. The focused ion beam processing apparatus of claim 1 , wherein a beam size of the focused ion beam is adjustable by adjusting applied voltage of the projection lens.
3. The focused ion beam processing apparatus of claim 1 , wherein the slit of the aperture is in a rectangular shape.
4. The focused ion beam processing apparatus of claim 2 , wherein the slit of the aperture is in a rectangular shape.
5. The focused ion beam processing apparatus of claim 1 , wherein the ion source is a plasma ion source.
6. The focused ion beam processing apparatus of claim 2 , wherein the ion source is a plasma ion source.
7. The focused ion beam processing apparatus of claim 3 , wherein the ion source is a plasma ion source.
8. The focused ion beam processing apparatus of claim 4 , wherein the ion source is a plasma ion source.