IP Library › Granted Patent US 12,318,778
Granted Patent B2
US 12,318,778 · App. 17/209,463 · Granted Jun 3, 2025

Microfluidic chip system and method for preparing droplets

Inventors: I-Jane Chen (Shenzhen, CN); Tao Wu (Shenzhen, CN); Michael Junkin (San Jose, CA)
Assignee: Qingdao MGI Tech Co., Ltd
B01L3/50273B01L3/502753C12Q1/6806B01L2200/0647B01L2300/0816B01L2400/02B01L2400/0433B01L2400/0487
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Quick Facts
Patent No.
US 12,318,778
App. No.
17/209,463
Granted
Jun 3, 2025
Kind
B2
Abstract

A microfluidic chip system for generating droplets is provided by the present disclosure. The microfluidic chip system includes a droplet generation device for generating the droplets, a power generation device for supplying power to the droplet generation device, a collection container for collecting the droplets flowing out of the droplet generation device, a connection device connecting the droplet generation device, the power generation device, and the collection container to each other, and a preparation platform holds together the droplet generation device, the power generation device, and the collection container. A method for preparing the droplets is also provided by the present disclosure.

Claims (18)

1. A microfluidic chip system for generating droplets, comprising:

a droplet generation device for generating the droplets;

a power generation device for supplying a power to the droplet generation device, the power generation device comprising a main body, an operation portion, and a first limiting member, an end of the operation portion received in the main body, another end of the operation portion exposed from the main body and connected to the first limiting member;

a collection container for collecting the droplets flowing out of the droplet generation device;

a connection device connecting the droplet generation device, the power generation device, and the collection container to each other, and

a preparation platform for supporting the droplet generation device, the power generation device, and the collection container, wherein the preparation platform comprises a base, the base defines a droplet generation device slot, a power generation device slot, and a first limiting slot, the base comprises a first surface, a second surface opposite to the first surface, and a first sidewall connected between the first surface and the second surface, the droplet generation device slot and the power generation device slot are recessed from the first surface, the first limiting slot is recessed from the first surface and the first sidewall, the droplet generation device is received in the droplet generation device slot, the main body and the operation portion are received in the power generation device slot, and the first limiting slot is configured to receive the first limiting member and keep the first limiting member at a predetermined location.

2. The microfluidic chip system of claim 1 , wherein the droplet generation device comprises a chip body, the chip body defines a continuous phase inlet and a dispersed phase inlet, the continuous phase and the dispersed phase enter the chip body through the continuous phase inlet and the dispersed phase inlet.

3. The microfluidic chip system of claim 2 , wherein the microfluidic chip system further comprises a continuous phase reservoir and a dispersed phase reservoir, the continuous phase reservoir and the dispersed phase reservoir are fixed on or disposed outside the chip body.

4. The microfluidic chip system of claim 2 , wherein the collection container is fixedly received in the chip body, and the chip body is fixedly received in the droplet generation device slot.

5. The microfluidic chip system of claim 2 , wherein the microfluidic chip system further comprises at least one vibration device, the vibration device is received in the droplet generation device slot and corresponds to the dispersed phase inlet, and the vibration device is configured to apply vibration to the dispersed phase.

6. The microfluidic chip system of claim 2 , wherein the microfluidic chip system also comprises at least one vibration device, the vibration device is disposed on the chip body and corresponds to the dispersed phase inlet, and the vibration device is configured to apply vibration to the dispersed phase.

7. The microfluidic chip system of claim 2 , wherein the power generation device is a positive pressure generation device, and the positive pressure generation device connects to the continuous phase inlet and the dispersed phase inlet through the connection device.

8. The microfluidic chip system of claim 1 , wherein the base comprises a first portion and a second portion connected to the first portion, the first portion is lower than the second portion, the droplet generation device slot is formed on the first portion, and the power generation device slot is formed on the second portion.

9. The microfluidic chip system of claim 1 , wherein the collection container is disposed outside the droplet generation device, the base further defines a collection container slot, the collection container slot is recessed from the first surface, and the collection container is fixedly received in the collection container slot.

10. The microfluidic chip system of claim 1 , wherein the collection container is disposed on and integrally formed with the droplet generation device.

11. The microfluidic chip system of claim 1 , wherein the power generation device is an injection device.

12. The microfluidic chip system of claim 1 , wherein the power generation device is a negative pressure generation device, and the negative pressure generation device connects to the collection container through the connection device.

13. The microfluidic chip system of claim 12 , wherein the preparation platform further comprises a fixing seat and a dustproof cover rotatably connected to the fixing seat, the dustproof cover is disposed on one side of the droplet generation device, and the dustproof cover is configured to prevent dust from entering the droplet generation device.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2023
From: DGI TECH (QING DAO) CO., LIMITED
To: QINGDAO MGI TECH CO.,LTD
Reel/Frame 065461/0746 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2021
From: CHEN, I-JANE; WU, TAO; JUNKIN, MICHAEL
To: DGI TECH (QING DAO) CO., LIMITED
Reel/Frame 055683/0980 →
Priority Claims (1)
CN 201811151625.2 · Sep 29, 2018 · national
Continuity (2)
Continuation In Part PCTCN2019108536 · Sep 27, 2019
Related Publication 20210205806A1 · Jul 8, 2021
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