IP Library › Granted Patent US 11,641,240
Granted Patent B2
US 11,641,240 · App. 17/212,295 · Granted May 2, 2023

Optical module

Inventors: Daisuke Noguchi (Tachikawa, JP); Hiroshi Yamamoto (Inagi, JP)
Assignee: CIG PHOTONICS JAPAN LIMITED
H04B10/501H01L24/05H01L24/48H01L33/483H05K1/113H05K1/181H01L2224/48091H01L2924/3011H01L2924/30105
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Quick Facts
Patent No.
US 11,641,240
App. No.
17/212,295
Granted
May 2, 2023
Kind
B2
Abstract

An optical module includes: a light source; an optical modulator capable of modulating light from the light source; a capacitor with an upper electrode and a lower electrode; and a resistor connected in series with and bonded face-to-face to the upper electrode of the capacitor. The resistor and the capacitor are connected in parallel with the optical modulator.

Claims (47)

1. An optical module comprising:

a light source;

an optical modulator capable of modulating light from the light source;

a capacitor with an upper electrode and a lower electrode; and

a resistor connected in series with and bonded face-to-face to the upper electrode of the capacitor,

wherein the resistor and the capacitor are connected in parallel with the optical modulator,

wherein the resistor includes a first conductor bonded face-to-face to the upper electrode of the capacitor, a second conductor, and a resistive element electrically connected in series between the first conductor and the second conductor,

wherein

the resistor further includes an insulator,

the first conductor extends on the insulator from a lower surface to an upper surface, and

the second conductor and the resistive element are on the upper surface of the insulator.

2. The optical module according to claim 1 , wherein the first conductor extends on a side surface of the insulator.

3. The optical module according to claim 1 , wherein the first conductor is configured to penetrate the insulator.

4. The optical module according to claim 1 , wherein the insulator and the second conductor have respective end portions at positions overhanging from the capacitor in a direction approaching the optical modulator.

5. The optical module according to claim 1 , further comprising a wire having one end bonded to an end portion of the second conductor of the resistor, the wire having another end bonded to the optical modulator.

6. The optical module according to claim 1 , further comprising:

a bonding pad next to the optical modulator in an opposite direction to the capacitor;

a first wire having one end bonded to the optical modulator, the first wire having another end bonded to the bonding pad; and

a second wire having one end bonded to an end portion of the second conductor of the resistor, the second wire arranged above the optical modulator, the second wire having another end bonded to the bonding pad.

7. The optical module according to claim 1 , wherein

the light source includes some light sources,

the optical modulator includes some optical modulators corresponding to the respective light sources,

the capacitor includes some capacitors,

the resistor includes some resistors corresponding to the respective capacitors, and

the optical modulators and the capacitors are alternately arranged.

8. The optical module according to claim 1 , wherein the light source and the optical modulator are an integrated optical semiconductor device.

9. An optical module comprising:

a light source;

an optical modulator capable of modulating light from the light source;

a capacitor with an upper electrode and a lower electrode;

a resistor connected in series with and bonded face-to-face to the upper electrode of the capacitor;

a conductive block having a first surface and a second surface, the conductive block having some through holes configured to penetrate between the first surface and the second surface, the conductive block having a pedestal portion on the first surface; and

lead pins fixed inside the through holes and insulated from the conductive block,

wherein the resistor and the capacitor are connected in parallel with the optical modulator, and

wherein the capacitor is mounted on the pedestal portion.

10. The optical module according to claim 9 , further comprising a mounting substrate on which the light source and the optical modulator are mounted, the mounting substrate being mounted on the pedestal portion.

11. The optical module of claim 10 , wherein

the pedestal portion includes a first region and a second region lower than the first region, on an upper surface,

the mounting substrate is mounted on the first region, and

the capacitor is mounted on the second region.

12. The optical module of claim 10 , wherein

the pedestal portion includes a first region and a second region lower than the first region, on an upper surface,

the mounting substrate is mounted on the first region,

the light source includes some light sources,

the optical modulator includes some optical modulators corresponding to the respective light sources,

the capacitor includes some capacitors consisting of at least one first capacitor mounted on the first region and at least one second capacitor mounted on the second region, and

the resistor includes some resistors corresponding to the respective capacitors.

Assignments (2)
CHANGE OF ADDRESS Recorded Jul 19, 2024
From: CIG PHOTONICS JAPAN LIMITED
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 068436/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2021
From: NOGUCHI, DAISUKE; YAMAMOTO, HIROSHI
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 055717/0148 →
Priority Claims (1)
JP JP2020-077640 · Apr 24, 2020 · national
Continuity (1)
Related Publication 20210336701A1 · Oct 28, 2021