Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias

1. A radio frequency (“RF”) transistor amplifier, comprising:

a Group III nitride-based RF transistor amplifier die that includes a semiconductor layer structure and a conductive via that extends through the semiconductor layer structure;

a first impedance matching circuit coupled between a first end of the conductive via and a first external electrical connection; and

a first harmonic termination circuit coupled between a second end of the conductive via and a second external electrical connection,

wherein the second end of the conductive via is opposite the first end.

2. The RF transistor amplifier of claim 1 , wherein the conductive via is a conductive gate via that is connected to a gate electrode of the Group III nitride-based RF transistor amplifier die, and the first end of the conductive gate via is a top end that is adjacent the gate electrode and the second end of the conductive gate via is a bottom end.

3. The RF transistor amplifier of claim 1 , wherein the conductive via is a conductive drain via that is connected to a drain electrode of the Group III nitride-based RF transistor amplifier die, and the first end of the conductive drain via is a bottom end and the second end of the conductive drain via is a top end that is adjacent the drain electrode.

4. The RF transistor amplifier of claim 2 , further comprising a conductive drain via that is connected to a drain electrode of the Group III nitride-based RF transistor amplifier die.

5. The RF transistor amplifier of claim 4 , further comprising:

a second impedance matching circuit coupled between a first end of the conductive drain via and a third external electrical connection.

6. The RF transistor amplifier of claim 1 , further comprising a redistribution layer (“RDL”) laminate substrate, wherein the Group III nitride-based RF transistor amplifier die is mounted on an upper surface of the RDL laminate substrate.

7. The RF transistor amplifier of claim 6 , wherein the first end of the conductive via is a top end and the second end of the conductive via is a bottom end that is electrically connected to a first conductive pad on the RDL laminate substrate through a first contact.

8. The RF transistor amplifier of claim 4 , wherein the conductive gate via, the conductive drain via and the conductive source via all have substantially a same shape and substantially a same cross-sectional area.

9. A radio frequency (“RF”) transistor amplifier, comprising:

a Group III nitride-based RF transistor amplifier die that includes a semiconductor layer structure, a conductive source via that is connected to a source region of the Group III nitride-based RF transistor amplifier die, the conductive source via extending through the semiconductor layer structure, and an additional conductive via that extends through the semiconductor layer structure,

wherein a first end of the additional conductive via is connected to a first external circuit and a second end of the additional conductive via that is opposite the first end is connected to a first matching circuit.

10. The RF transistor amplifier of claim 9 , wherein the additional conductive via is a conductive gate via that is connected to a gate electrode of the Group III nitride-based RF transistor amplifier die, and the first matching circuit is a first input matching circuit.

11. The RF transistor amplifier of claim 10 , the Group III nitride-based RF transistor amplifier die further comprising a conductive drain via that is connected to a drain finger of the Group III nitride-based RF transistor amplifier die, wherein a first end of the conductive drain via is connected to a second external circuit and a second end of the conductive drain via that is opposite the first end of the conductive drain via is connected to a first output matching circuit.

12. The RF transistor amplifier of claim 9 , wherein the additional conductive via is a conductive drain via that is connected to a drain finger of the Group III nitride-based RF transistor amplifier die, and the first matching circuit is a first output matching circuit.

13. The RF transistor amplifier of claim 10 , further comprising an interconnection structure, wherein the Group III nitride-based RF transistor amplifier die is mounted on an upper surface of the interconnection structure.

14. The RF transistor amplifier of claim 13 , wherein the first end of the conductive gate via is a top end and the second end of the conductive gate via is a bottom end that is electrically connected to a first conductive pad on the interconnection structure through a first contact.

15. The RF transistor amplifier of claim 14 , wherein the first input matching circuit comprises a capacitor that is coupled between the bottom end of the conductive gate via and electrical ground.

16. The RF transistor amplifier of claim 14 , wherein the first input matching circuit comprises a harmonic termination circuit, the RF transistor amplifier further comprising a second input impedance matching circuit that comprises a fundamental matching circuit that connects to the top end of the conductive gate via.

17. The RF transistor amplifier of claim 13 , wherein the first end of the additional conductive via is a bottom end that is electrically connected to a first conductive pad on the interconnection structure through a first contact, and the second end of the additional conductive via is a top end.

18. The RF transistor amplifier of claim 13 , wherein the first end of the conductive drain via is a top end and the second end of the conductive drain via is a bottom end that is electrically connected to a second conductive pad on the interconnection structure through a second contact.

19. The RF transistor amplifier of claim 13 , wherein the first end of the conductive drain via is a bottom end that is electrically connected to a first conductive pad on the interconnection structure through a first contact and the second end of the conductive drain via is a top end.

20. The RF transistor amplifier of claim 9 , wherein the first input matching circuit comprises a fundamental impedance matching circuit.

21. The RF transistor amplifier of claim 9 , further comprising:

an interconnection structure, wherein the Group III nitride-based RF transistor amplifier die is mounted on an upper surface of the interconnection structure; and

a passive RF component that includes a capacitor mounted on the interconnection structure and electrically connected to the additional conductive via through the interconnection structure.

22. The RF transistor amplifier of claim 9 , wherein the Group III nitride-based RF transistor amplifier die includes a plurality of parallel source fingers, wherein at least two conductive source vias are positioned underneath each of the conductive source fingers.

23. The RF transistor amplifier of claim 22 , wherein the at least two conductive source vias that are positioned underneath a first of the conductive source fingers define a first axis, and the at least two conductive source vias that are positioned underneath a second of the conductive source fingers that is adjacent the first of the conductive source vias defines a second axis, and wherein the additional conductive via is positioned between the first axis and the second axis when the Group III nitride-based RF transistor amplifier die is viewed from above.

24. The RF transistor amplifier of claim 9 , wherein the additional conductive via comprises a portion of the first matching circuit.