IP Library › Granted Patent US 11,543,235
Granted Patent B2
US 11,543,235 · App. 17/219,779 · Granted Jan 3, 2023

Hybrid interferometric and scatterometric sensing using in-plane sensors

Inventors: Tong Chen (Fremont, CA); Fei Tan (San Jose, CA); Mingzhou Jin (Campbell, CA)
Assignee: Apple Inc.
G01B9/02092G01N21/47
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Quick Facts
Patent No.
US 11,543,235
App. No.
17/219,779
Granted
Jan 3, 2023
Kind
B2
Abstract

An optical sensor system including a semiconductor substrate; a self-mixing interferometry (SMI) sensor formed on the semiconductor substrate and including a semiconductor laser having a resonant cavity; and an array of photodetectors formed on the semiconductor substrate. The SMI sensor is configured to generate an SMI signal responsive to a retro-reflection of electromagnetic radiation emitted by the semiconductor laser and received into the resonant cavity. The array of photodetectors is configured to generate a set of angular-resolved scatter signals responsive to a scatter of the electromagnetic radiation emitted by the semiconductor laser.

Claims (89)

1. An optical sensor system, comprising:

a semiconductor substrate;

a self-mixing interferometry (SMI) sensor formed on the semiconductor substrate and including a semiconductor laser having a resonant cavity; and

an array of photodetectors formed on the semiconductor substrate; wherein,

the SMI sensor is configured to generate an SMI signal responsive to a retro-reflection of electromagnetic radiation emitted by the semiconductor laser and received into the resonant cavity; and

the array of photodetectors is configured to generate a set of angular-resolved scatter signals responsive to a scatter of the electromagnetic radiation emitted by the semiconductor laser.

2. The optical sensor system of claim 1 , wherein the SMI sensor and the array of photodetectors share a subset of epitaxial layers formed on the semiconductor substrate.

3. The optical sensor system of claim 1 , wherein:

a set of trenches electrically separate photodetectors in the array of photodetectors.

4. The optical sensor system of claim 3 , further comprising:

a set of cathodes for the array of photodetectors, the set of cathodes disposed in the set of trenches.

5. The optical sensor system of claim 4 , further comprising:

a set of anodes for the array of photodetectors, the set of anodes disposed on the array of photodetectors; wherein,

the set of cathodes is oriented in a first set of parallel directions;

the set of anodes is oriented in a second set of parallel directions; and

the second set of parallel directions is orthogonal to the first set of parallel directions.

6. The optical sensor system of claim 1 , further comprising:

an array of SMI sensors formed on the semiconductor substrate; wherein,

the SMI sensor is a first SMI sensor in the array of SMI sensors; and

the array of photodetectors is provided by additional SMI sensors in the array of SMI sensors.

7. An optical sensor system, comprising:

a wafer-integrated array of semiconductor devices, including,

a semiconductor laser; and

a set of resonant-cavity photodetectors (RCPDs);

an optical subsystem configured to direct a retro-reflection of electromagnetic radiation emitted by the semiconductor laser toward an RCPD in the set of RCPDs, and configured to direct an angular-resolved scatter of the electromagnetic radiation emitted by the semiconductor laser toward a subset or all RCPDs in the set of RCPDs.

8. The optical sensor system of claim 7 , wherein all of the RCPDs in the set of RCPDs are in-plane.

9. The optical sensor system of claim 7 , wherein a first RCPD is integrated or stacked with the semiconductor laser.

10. The optical sensor system of claim 7 , wherein:

the RCPD in the set of RCPDs is a first RCPD; and

the optical subsystem provides confocal imaging for,

the first RCPD; and

a second RCPD in a subset of RCPDs.

11. The optical sensor system of claim 7 , wherein:

the RCPD in the set of RCPDs is a first RCPD; and

the optical subsystem provides non-confocal imaging for,

the first RCPD; and

a second RCPD in a subset of RCPDs.

12. The optical sensor system of claim 7 , wherein the optical subsystem comprises:

a telecentric-confocal imaging system positioned apart from the wafer-integrated array of semiconductor devices in an electromagnetic radiation emission path of the semiconductor laser, and in a set of electromagnetic radiation reception paths of the set of RCPDs.

13. The optical sensor system of claim 7 , wherein the optical subsystem comprises:

a set of on-chip lenses disposed on the semiconductor laser and the set of RCPDs; and

a confocal imaging system positioned apart from the wafer-integrated array of semiconductor devices, in an electromagnetic radiation emission path of the semiconductor laser, and in a set of electromagnetic radiation reception paths of the set of RCPDs.

14. The optical sensor system of claim 13 , wherein the optical subsystem comprises:

an optical beam splitter positioned in the electromagnetic radiation emission path of the semiconductor laser.

15. The optical sensor system of claim 7 , wherein:

the wafer-integrated array of semiconductor devices is attached to a semiconductor wafer; and

the semiconductor laser is flip-chip bonded to the semiconductor wafer, over the RCPD to which the retro-reflection is directed.

16. An electronic device, comprising:

a semiconductor substrate;

a set of semiconductor devices formed on the semiconductor substrate; and

a processor configured to,

operate a first semiconductor device in the set of semiconductor devices to emit electromagnetic radiation from a resonant cavity of the first semiconductor device;

determine a set of parameters of a self-mixing interferometry (SMI) signal generated as a result of a self-mixing of electromagnetic radiation within the resonant cavity;

contemporaneously with operating the first semiconductor device, sense a scatter of the emitted electromagnetic radiation using a subset of semiconductor devices in the set of semiconductor devices; and

characterize at least one of an environment of the electronic device, or a relationship between the electronic device and the environment, using the determined set of parameters of the SMI signal and the sensed scatter.

17. The electronic device of claim 16 , wherein:

the environment of the electronic device comprises a surface; and

the processor is configured to characterize the environment of the electronic device by,

determining, using the set of parameters of the SMI signal, at least one of a speckle, a roughness, or a texture of the surface; and

determining a power spectral density of the surface using the sensed scatter.

18. The electronic device of claim 16 , wherein:

the electronic device is a wearable device;

the first semiconductor device has a different optical focus than at least a second semiconductor device in the subset of semiconductor devices;

the environment of the electronic device comprises a body part of a user of the electronic device; and

the processor is configured to characterize the environment of the electronic device by determining at least one biometric feature of the user.

19. The electronic device of claim 16 , wherein:

the environment of the electronic device comprises air; and

the processor is configured to characterize the environment of the electronic device by,

determining a particle speed using the set of parameters of the SMI signal; and

determining a particle size using the sensed scatter.

20. The electronic device of claim 16 , wherein:

the environment of the electronic device comprises a surface;

the processor is configured to characterize the relationship between the electronic device and the environment of the electronic device by,

characterizing a high speed movement of the electronic device with respect to the surface responsive to at least a sensed self-mixing; and

characterizing a low speed movement of the electronic device with respect to the surface responsive to at least the sensed scatter; and

the high speed movement and the low speed movement are distinguished by a threshold speed of movement.

21. An optical sensor system, comprising:

a semiconductor substrate;

an external photon-mixing sensor formed on the semiconductor substrate and including,

a semiconductor laser; and

a photon-mixing detector;

an array of photodetectors formed on the semiconductor substrate; wherein,

the external photon-mixing sensor is configured to generate a field-based coherent scatterometry signal responsive to a combination of electromagnetic radiation emitted by the semiconductor laser and a portion of the emitted electromagnetic radiation that is backscattered to the photo-mixing detector; and

the array of photodetectors is configured to generate a set of intensity-based scatterometry signals responsive to a backscatter of the electromagnetic radiation emitted by the semiconductor laser.

22. The optical sensor system of claim 21 , wherein the semiconductor laser, the photon-mixing detector, and the array of photodetectors share a subset of epitaxial layers formed on the semiconductor substrate.

23. The optical sensor system of claim 21 , further comprising:

an optical subsystem configured to,

direct a first portion of the electromagnetic radiation emitted by the semiconductor laser to the photon-mixing detector; and

direct a second portion of a backscatter of the emitted electromagnetic radiation to the photon-mixing detector.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2021
From: CHEN, TONG; TAN, FEI; JIN, MINGZHOU
To: APPLE INC.
Reel/Frame 055960/0887 →
Continuity (1)
Related Publication 20220316856A1 · Oct 6, 2022