Substrate processing apparatus
View Patent ↗A processing fluid flows into a processing space SP by way of a flow passage and discharge openings 174, 178 having substantially the same cross-sectional shape as that of a gap space formed in a clearance between a wall surface of the processing space SP and a substrate holder 15 . On the other hand, the processing fluid having passed through the processing space SP is discharged to an outside via discharge flow passages 183, 187 after flowing into the buffer space 182, 186 having substantially the same width as the gap space. From these, the processing fluid can be caused to flow into the buffer space 182, 186 while the laminar flow state is maintained in the gap space. Thus, the generation of a turbulence in the processing space SP can be suppressed.
1. A substrate processing apparatus for processing a surface of a substrate by a processing fluid, comprising:
a substrate holder in the form of a flat plate, the substrate being placeable in a horizontal posture on an upper surface of the substrate holder, that is opposite to a lower surface of the substrate holder; and
a chamber including a processing space capable of accommodating the substrate holder having the substrate placed thereon and a side surface having an aperture that communicates with the processing space and allows the substrate holder to pass through, the chamber having a ceiling surface spaced from the upper surface of the substrate holder to define an upper flow passage, and a bottom surface spaced from the lower surface of the substrate holder to define a lower flow passage;
wherein
the chamber is provided with a first introduction flow passage, a first discharge opening, a second introduction flow passage, a second discharge opening, a buffer space communicating with the processing space, and discharge flow passages configured to discharge the processing fluid from the buffer space to the outside of the chamber,
the first introduction flow passage is connected to the first discharge opening to feed the processing fluid not only in the horizontal direction but concentratedly to the upper flow passage between the ceiling surface of the chamber and the upper surface of the substrate holder,
the second introduction flow passage is connected to the second discharge opening to feed the processing fluid not only in the horizontal direction but concentratedly to the lower flow passage between the bottom surface of the chamber and the lower surface of the substrate holder,
the introduction flow passage is connected to a discharge opening open to a gap space formed in a clearance between a wall surface of the processing space and the substrate holder in one end part of the processing space in a plan view,
a shape of the discharge opening and a cross-sectional shape of a flow passage leading to the discharge opening are substantially the same as a cross-sectional shape of the gap space,
the buffer space is connected to the processing space at another end part opposite to the one end part across the substrate in a plan view and has a width substantially equal to that of the gap space in a width direction orthogonal to a flowing direction of the processing fluid flowing from the one end part toward the other end part, and
the discharge flow passages are respectively connected to a pair of openings provided in both end parts in the width direction of the buffer space.
2. The substrate processing apparatus according to claim 1 , wherein
the introduction flow passage, the buffer space and the discharge flow passages are provided to correspond to the gap space formed in a clearance between a ceiling surface, out of wall surfaces of the processing space, and an upper surface of the substrate holder, and
the introduction flow passage, the buffer space and the discharge flow passages are provided to correspond to the gap space formed in a clearance between a bottom surface, out of the wall surfaces of the processing space, and a lower surface of the substrate holder.
3. The substrate processing apparatus according to claim 1 , wherein the openings to which the discharge flow passages are connected are open on sides outward of both end parts in the width direction of the substrate in a plan view.
4. The substrate processing apparatus according to claim 1 , wherein
the one end part is an end part on a side opposite to the aperture, out of both end parts of the processing space in the flowing direction, when viewed from the substrate, and
the other end part is an end part on the aperture side, out of the both end parts, when viewed from the aperture.
5. The substrate processing apparatus according to claim 1 , wherein
the chamber includes a chamber body provided with a hollow serving as the processing space and a lid part configured to close the aperture via a sealing member, and
the buffer space is a space surrounded by the lid part, the chamber and the sealing member.
6. The substrate processing apparatus according to claim 1 , wherein the flowing direction of the processing fluid is changed by 90 degree or more in a connecting part of the gap space and the buffer space.
7. The substrate processing apparatus according to claim 1 , wherein
an enlarged space having a larger flow passage cross-sectional area than an upstream side in the flowing direction is provided at an intermediate position of the introduction flow passage, and
the flowing direction is changed by 90 degree or more in a flow passage from the enlarged space to the discharge opening.
8. The substrate processing apparatus according to claim 7 , wherein the introduction flow passage on a side downstream of the enlarged space in the flowing direction has a constant cross-sectional shape up to the discharge opening.
9. The substrate processing apparatus according to claim 7 , wherein a length of the enlarged space in the width direction is equal to or larger than a length of the introduction flow passage on the side downstream of the enlarged space in the flowing direction.
10. The substrate processing apparatus according to claim 7 , wherein an opening position where the introduction flow passage on a side upstream of the enlarged space in the flowing direction faces the enlarged space and an opening position where the introduction flow passage on the side downstream of the enlarged space in the flowing direction faces the enlarged space do not overlap each other in a vertical direction.
11. The substrate processing apparatus according to claim 1 , further comprising a first supply passage that supplies processing fluid to the first introduction flow passage, and a second supply passage that supplies processing fluid to the second introduction flow passage.
12. A substrate processing apparatus for processing a surface of a substrate by a processing fluid, comprising:
a substrate holder in the form of a flat plate, the substrate being placeable in a horizontal posture on an upper surface of the substrate holder; and
a chamber including a processing space capable of accommodating the substrate holder having the substrate placed thereon and a side surface having an aperture that communicates with the processing space and allows the substrate holder to pass through,
wherein
the chamber is provided with an introduction flow passage communicating with the processing space so as to receive the processing fluid supplied from outside the chamber, a buffer space communicating with the processing space and discharge flow passages configured to discharge the processing fluid from the buffer space to the outside of the chamber,
the introduction flow passage is connected to a discharge opening open to a gap space formed in a clearance between a wall surface of the processing space and the substrate holder in one end part of the processing space in a plan view,
a shape of the discharge opening and a cross-sectional shape of a flow passage leading to the discharge opening are substantially the same as a cross-sectional shape of the gap space,
the buffer space is connected to the processing space at another end part opposite to the one end part across the substrate in a plan view and has a width substantially equal to that of the gap space in a width direction orthogonal to a flowing direction of the processing fluid flowing from the one end part toward the other end part,
the discharge flow passages are respectively connected to a pair of openings provided in both end parts in the width direction of the buffer space,
the chamber includes a chamber body provided with a hollow serving as the processing space and a lid part configured to close the aperture via a sealing member,
the buffer space is a space surrounded by the lid part, the chamber and the sealing member, and
the flowing direction of the processing fluid is changed by 90 degree or more in a connecting part of the gap space and the buffer space.
13. The substrate processing apparatus of claim 12 , wherein the buffer space has a larger flow passage cross-sectional area than the upper flow passage.
14. A substrate processing apparatus for processing a surface of a substrate by a processing fluid, comprising:
a substrate holder in the form of a flat plate, the substrate being placeable in a horizontal posture on an upper surface of the substrate holder; and
a chamber including a processing space capable of accommodating the substrate holder having the substrate placed thereon and a side surface having an aperture that communicates with the processing space and allows the substrate holder to pass through,
wherein
the chamber is provided with an introduction flow passage communicating with the processing space so as to receive the processing fluid supplied from outside the chamber, a buffer space communicating with the processing space and discharge flow passages configured to discharge the processing fluid from the buffer space to the outside of the chamber,
the introduction flow passage is connected to a discharge opening open to a gap space formed in a clearance between a wall surface of the processing space and the substrate holder in one end part of the processing space in a plan view,
a shape of the discharge opening and a cross-sectional shape of a flow passage leading to the discharge opening are substantially the same as a cross-sectional shape of the gap space,
the buffer space is connected to the processing space at another end part opposite to the one end part across the substrate in a plan view and has a width substantially equal to that of the gap space in a width direction orthogonal to a flowing direction of the processing fluid flowing from the one end part toward the other end part,
the discharge flow passages are respectively connected to a pair of openings provided in both end parts in the width direction of the buffer space,
the chamber includes a chamber body provided with a hollow serving as the processing space and a lid part configured to close the aperture via a sealing member,
a separation wall is provided to extend from the chamber body, and
the buffer space is a space surrounded by the lid part, the chamber, the sealing member, and the separation wall.