Optically effective element, method of producing an optically effective element, and optoelectronic component

1. An optoelectronic component comprising:

an optoelectronic semiconductor chip configured to emit electromagnetic radiation;

an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and

a housing,

wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing,

the optically effective element comprises a carrier,

a first optically effective structure arranged on a top side of the carrier, and

a cover arranged above the first optically effective structure,

wherein the optically effective element is arranged in the cavity of the housing.

2. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip is formed as a vertically emitting laser chip.

3. The optoelectronic component according to claim 1 , wherein the optoelectronic semiconductor chip is formed as a light emitting diode chip.

4. The optoelectronic component according to claim 1 , wherein the optically effective element is arranged directly adjacent to the optoelectronic semiconductor chip.

5. The optoelectronic component according to claim 1 , wherein a potting material is arranged in the cavity.

6. The optoelectronic component according to claim 5 , wherein the optoelectronic semiconductor chip and the optically effective element are at least partly embedded into the potting material.

7. The optoelectronic component according to claim 1 , wherein the optically effective element is configured to shape light emitted by the optoelectronic semiconductor chip to form a light pattern.

8. The optoelectronic component according to claim 7 , wherein the light pattern is a point pattern, a checkered pattern, a rectangular light spot or a circular light spot.

9. The optoelectronic component according to claim 1 , wherein the first optically effective structure is a multi-lens structure.

10. The optoelectronic component according to claim 9 ,

wherein a material layer is arranged on the top side of the carrier, and

the multi-lens structure is formed in the material layer.

11. The optoelectronic component according to claim 9 , wherein the top side of the carrier is structured such that the multi-lens structure is formed.

12. The optoelectronic component according to claim 1 , wherein the first optically effective structure is a diffractive structure.

13. The optoelectronic component according to claim 12 , wherein the diffractive structure comprises an inner dielectric layer arranged on the top side of the carrier, said inner dielectric layer comprising inner openings, and an outer dielectric layer arranged above the inner dielectric layer, said outer dielectric layer comprising outer openings.

14. The optoelectronic component according to claim 13 ,

wherein the inner dielectric layer comprises a first refractive index,

the outer dielectric layer comprises a second refractive index, and

the first refractive index and the second refractive index differ by not more than 20%.

15. The optoelectronic component according to claim 13 , wherein an intermediate layer is arranged between the inner dielectric layer and the outer dielectric layer.

16. The optoelectronic component according to claim 13 , wherein the cover comprises a filling material arranged in the inner openings and the outer openings.

17. The optoelectronic component according to claim 14 ,

wherein the cover comprises a filling material arranged in the inner openings and the outer openings, and

the filling material comprises a refractive index that differs from the first refractive index by at least 10%.

18. The optoelectronic component according to claim 1 , wherein the cover is formed as a first covering layer covering the first optically effective structure.

19. The optoelectronic component according to claim 18 , wherein the first covering layer has a refractive index that differs from a refractive index of the carrier by not more than 20%.

20. The optoelectronic component according to claim 1 ,

wherein the cover is formed as a first covering layer covering the top side of the carrier and the first optically effective structure, and

the first covering layer has a refractive index less than a refractive index of the first optically effective structure.

21. The optoelectronic component according to claim 12 , wherein the cover is a plate, a glass plate or a sapphire plate.

22. The optoelectronic component according to claim 21 , wherein the cover is secured by a soldering connection on the top side of the carrier.

23. The optoelectronic component according to claim 22 , wherein the soldering connection completely encloses the first optically effective structure.

24. The optoelectronic component according to claim 23 , wherein the first optically effective structure is hermetically impermeably encapsulated by the soldering connection.

25. The optoelectronic component according to claim 21 , wherein a gap is formed between the first optically effective structure and the cover.

26. The optoelectronic component according to claim 21 , wherein a further optically effective structure is arranged on a top side of the cover facing the top side of the carrier.

27. The optoelectronic component according to claim 1 , wherein a second optically effective structure is arranged on an underside of the carrier.

28. The optoelectronic component according to claim 27 , wherein the second optically effective structure is covered by a second covering layer.

29. The optoelectronic component according to claim 27 , wherein the second optically effective structure is a multi-lens structure.

30. The optoelectronic component according to claim 27 , wherein the second optically effective structure is a diffractive structure.