Semiconductor component having a SiC semiconductor body
A silicon carbide substrate has a trench extending from a main surface of the silicon carbide substrate into the silicon carbide substrate. The trench has a trench width at a trench bottom. A shielding region is formed in the silicon carbide substrate. The shielding region extends along the trench bottom. In at least one doping plane extending approximately parallel to the trench bottom, a dopant concentration in the shielding region over a lateral first width deviates by not more than 10% from a maximum value of the dopant concentration. The first width is less than the trench width and is at least 30% of the trench width.
1. A semiconductor component, comprising:
a SiC semiconductor body;
a gate electrode structure extending from a first surface of the SiC semiconductor body into the SiC semiconductor body, the gate electrode structure having a conductive connection structure and a structure width at a bottom of the gate electrode structure;
a shielding region formed in the SiC semiconductor body along the bottom, the shielding region having a central section which has a lateral first width; and
a contact formed between the conductive connection structure and the shielding region,
wherein in at least one doping plane extending approximately parallel to the bottom, a dopant concentration in the central section deviates by not more than 10% from a maximum value of the dopant concentration in the shielding region in the doping plane,
wherein the first width is less than the structure width and is at least 30% of the structure width.
2. The semiconductor component of claim 1 , wherein the doping plane connects laterally adjacent local maximum values of vertical dopant distributions in the shielding region.
3. The semiconductor component of claim 1 , wherein the first width is less than a difference between the structure width and twice an average distance between the doping plane and the bottom.
4. The semiconductor component of claim 1 , wherein the gate electrode structure has a field dielectric, wherein the field dielectric has a sidewall section having a first layer thickness along a sidewall of the gate electrode structure, and wherein the connection structure has a second width at the bottom that is less than the difference between the structure width of the gate electrode structure at the bottom and twice the first layer thickness.
5. The semiconductor component of claim 4 , wherein the field dielectric has a bottom section having a second layer thickness along the bottom, wherein the second layer thickness is at most equal to the first layer thickness, and wherein the bottom section is formed in an outer section of the bottom between a part of the connection structure and the shielding region.
6. The semiconductor component of claim 1 , wherein a JFET partial region is formed in the SiC semiconductor body, wherein the JFET partial region and the shielding region form a unipolar junction, wherein the shielding region is formed between the gate electrode structure and the JFET partial region, wherein the JFET partial region has a lateral fifth width along the unipolar junction, and wherein the fifth width is less than the first width.
7. The semiconductor component of claim 1 , wherein the gate electrode structure has a gate electrode and an isolation dielectric, wherein the gate electrode is formed between the first surface and the connection structure, and wherein the isolation dielectric is formed between the gate electrode and the connection structure.
8. A semiconductor component, comprising:
a silicon carbide substrate having a trench which extends from a main surface of the silicon carbide substrate into the silicon carbide substrate and has a trench width at a trench bottom; and
a shielding region in the silicon carbide substrate and extending along the trench bottom,
wherein in at least one doping plane extending approximately parallel to the trench bottom, a dopant concentration in the shielding region over a lateral first width deviates by not more than 10% from a maximum value of the dopant concentration in the doping plane,
wherein the first width is less than the trench width and is at least 30% of the trench width.
9. The semiconductor component of claim 8 , wherein the doping plane connects laterally adjacent local maximum values of vertical dopant distributions in the shielding region.
10. The semiconductor component of claim 8 , further comprising:
a field dielectric in the trench,
wherein the field dielectric has an opening having a second width at the trench bottom,
wherein the second width is less than the first width.
11. The semiconductor component of claim 10 , wherein the field dielectric has a sidewall section having a first layer thickness along a sidewall of the trench, and wherein the second width is less than a difference between the trench width and twice the first layer thickness.
12. The semiconductor component of claim 8 , further comprising:
a conductive connection structure in the trench,
wherein a contact is formed between the connection structure and the shielding region.