Co-packaged optical module

1. An optical module for converting communication between optical signals and electrical signals, the optical module comprising:

an optoelectronic assembly comprising:

a flat, rigid substrate;

an array of electrical contacts positioned on a first portion of the substrate; and

an optoelectronics assemblage that is electrically connected to the array of contacts and is at least partially positioned apart from the array of electrical contacts, wherein the optoelectronics assemblage comprises an integrated circuit and a lens configured for optical communications; and

a heat spreader comprised of a thermally conductive material, the heat spreader comprising:

a second portion that is structurally connected to the first portion; and

a third portion that is thermally connected to the optoelectronics assemblage;

wherein the substrate passes through an aperture in the heat spreader.

2. The optical module of claim 1 , wherein the heat spreader is a monolithic component.

3. The optical module of claim 1 , wherein the optoelectronics assemblage is offset from a projection of the second portion.

4. The optical module of claim 1 , wherein the heat spreader is comprised of a metal material.

5. The optical module of claim 1 , wherein the optoelectronics assemblage is configured to be optically connected to a fiber-optic cable.

6. The optical module of claim 1 , wherein

the optical module is electrically connected to an integrated circuit of a multi-chip module; and

wherein the second portion of the heat spreader is thermally connected to a heat sink of the multi-chip module, the third portion of the heat spreader being only thermally connected to the heat sink through the second portion.

7. The optical module of claim 6 , wherein the multi-chip module is part of a main circuit board assembly.

8. An electronics assembly comprising:

a circuit board comprising:

a substrate;

a die mounted on the substrate;

a heat sink that is thermally connected to the die; and

a thermal lid between the die and the heat sink; and

an optical module for converting communication between optical signals and electrical signals, the optical module comprising:

a heat spreader that is structurally connected to the circuit board and extends from inboard of the substrate to outboard of the substrate thus overlapping the substrate, wherein:

the heat spreader is thermally connected to the heat sink; and

a side of the heat spreader that is thermally connected to the heat sink is coplanar with the surface of the thermal lid that is thermally connected to the heat sink; and

an optoelectronics assemblage that is thermally connected to the heat spreader and is wholly outboard of the substrate thus not overlapping the substrate, wherein the optoelectronics assemblage comprises an integrated circuit and a lens configured for optical communications.

9. The electronics assembly of claim 8 , wherein the optical module further comprises:

an optoelectronics assembly comprising:

a substrate;

an array of electrical contacts positioned on a first portion of the substrate; and

the optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts; and

wherein the heat spreader is comprised of a thermally conductive material and includes:

a second portion that is structurally connected to the first portion; and

a third portion that is thermally connected to the optoelectronics assemblage.

10. The electronics assembly of claim 9 , wherein the substrate of the optoelectronics assembly passes through an aperture in the heat spreader.

11. The electronics assembly of claim 9 , wherein the optoelectronics assemblage is offset from a projection of the second portion.

12. The electronics assembly of claim 8 , wherein the electronics assembly is a multi-chip module.

13. The electronics assembly of claim 12 , wherein the multi-chip module is part of a main circuit board assembly.