Semiconductor substrate having magnetic core inductor
A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.
1. A substrate for a packaging application, comprising:
a plurality of polymer layers disposed atop a substrate base;
a stacked spiral inductor coil disposed within the plurality of polymer layers and extending vertically through multiple layers of the plurality of polymer layers; and
at least one magnetic core disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil; and
a plurality of magnetic cores comprising vias disposed around and outside of the stacked spiral inductor coil.
2. The substrate of claim 1 , further comprising a second at least one magnetic core in the form of a trench disposed around the stacked spiral inductor coil.
3. The substrate of claim 1 , wherein the substrate base comprises one or more of silicon (Si), germanium, silicon germanium, doped or undoped polysilicon, doped or undoped silicon, and patterned or non-patterned silicon on insulators (SOI), or epoxy mold compound.
4. The substrate of claim 1 , wherein the at least one magnetic core is formed of one or more of iron (Fe), nickel (Ni), zinc (Zn), nickel-iron (NiFe), nickel-zinc (NiZn), nickel-zinc-copper (NiZnCu), aluminum-nickel-cobalt (AlNiCo), cobalt-tantalum-zirconium (CoTaZr), cobalt-niobium-zirconium (CoNbZr), cobalt-zirconium oxide (CoZrO2), iron-hafnium nitride (FeHfN), or cobalt-iron-hafnium oxide (CoFeHfO).
5. The substrate of claim 1 , wherein the at least one magnetic core is a plurality of magnetic cores disposed through the plurality of polymer layers and within the central region defined by the stacked spiral inductor coil.
6. The substrate of claim 5 , wherein the plurality of magnetic cores are four magnetic cores.
7. The substrate of claim 1 , wherein the plurality of polymer layers comprise one or more of a polybenzoxazole (PBO) layer, a polyimide (PI) layer, a benzocyclobutene (BCB) layer, an epoxy layer, or a photo-sensitive material layer.
8. The substrate of claim 1 , wherein the at least one magnetic core disposed through the plurality of polymer layers has a high aspect ratio.
9. A substrate for a packaging application, comprising:
a plurality of polymer layers disposed atop a substrate base;
a stacked spiral inductor coil disposed within the plurality of polymer layers;
at least one magnetic core disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil; and
a plurality of magnetic core vias disposed outside and around the stacked spiral inductor coil.
10. The substrate of claim 9 , wherein the at least one magnetic core disposed through the plurality of polymer layers has a high aspect ratio.
11. The substrate of claim 9 , wherein the substrate base comprises one or more of silicon (Si), germanium, silicon germanium, doped or undoped polysilicon, doped or undoped silicon, and patterned or non-patterned silicon on insulators (SOI), or epoxy mold compound.
12. The substrate of claim 9 , wherein the at least one magnetic core is formed of one or more of iron (Fe), nickel (Ni), zinc (Zn), nickel-iron (NiFe), nickel-zinc (NiZn), nickel-zinc-copper (NiZnCu), aluminum-nickel-cobalt (AlNiCo), cobalt-tantalum-zirconium (CoTaZr), cobalt-niobium-zirconium (CoNbZr), cobalt-zirconium oxide (CoZrO2), iron-hafnium nitride (FeHfN), or cobalt-iron-hafnium oxide (CoFeHfO).
13. The substrate of claim 9 , wherein the at least one magnetic core is a plurality of magnetic cores disposed through the plurality of polymer layers and within the central region defined by the stacked spiral inductor coil.
14. The substrate of claim 13 , wherein the plurality of magnetic cores are four magnetic cores.
15. The substrate of claim 9 , wherein the plurality of polymer layers comprise one or more of a polybenzoxazole (PBO) layer, a polyimide (PI) layer, a benzocyclobutene (BCB) layer, an epoxy layer, or a photo-sensitive material layer.
16. A substrate for a packaging application, comprising:
a plurality of polymer layers disposed atop a substrate base;
a stacked spiral inductor coil disposed within the plurality of polymer layers;
a plurality of magnetic cores disposed through the plurality of polymer layers and within a central region defined by the stacked spiral inductor coil; and
a plurality of magnetic core vias disposed around and outside of the stacked spiral inductor coil.
17. The substrate of claim 16 , wherein the magnetic cores have a high aspect ratio.
18. The substrate of claim 16 , wherein at least one of:
the substrate base comprises one or more of silicon (Si), germanium, silicon germanium, doped or undoped polysilicon, doped or undoped silicon, and patterned or non-patterned silicon on insulators (SOI), or epoxy mold compound; or
the plurality of polymer layers comprise one or more of a polybenzoxazole (PBO) layer, a polyimide (PI) layer, a benzocyclobutene (BCB) layer, an epoxy layer, or a photo-sensitive material layer.
19. The substrate of claim 16 , wherein the plurality of magnetic cores are formed of one or more of iron (Fe), nickel (Ni), zinc (Zn), nickel-iron (NiFe), nickel-zinc (NiZn), nickel-zinc-copper (NiZnCu), aluminum-nickel-cobalt (AlNiCo), cobalt-tantalum-zirconium (CoTaZr), cobalt-niobium-zirconium (CoNbZr), cobalt-zirconium oxide (CoZrO2), iron-hafnium nitride (FeHfN), or cobalt-iron-hafnium oxide (CoFeHfO).