Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy
A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.
1. A hermetic electrical feedthrough, comprising:
a stainless steel shell having a feedthrough opening,
an electrical feedthrough pin comprising 65 to 80 wt. % Pt, 18 to 27 wt. % Ni, and 2 to 8 wt. % Re within the feedthrough opening in the stainless steel shell, and
a glass-ceramic encasing the electrical feedthrough pin and forming a hermetic seal to the stainless steel shell and the electrical feedthrough pin.
2. The hermetic electrical feedthrough of claim 1 , wherein the stainless steel shell comprises an austenitic stainless steel alloy.
3. The hermetic electrical feedthrough of claim 2 , wherein the austenitic stainless steel alloy comprises type 304L or Nitronic 40 stainless steel.
4. The hermetic electrical feedthrough of claim 1 , wherein the glass-ceramic comprises a lithium aluminosilicate glass-ceramic.
5. The hermetic electrical feedthrough of claim 4 , wherein the lithium aluminosilicate glass-ceramic is composed of 65-80 wt. % SiO 2 , 8-16 wt. % Li 2 O, 2-8 wt. % Al 2 O 3 , 1-5 wt. % P 2 O 5 , 1-8 wt. % K 2 O, 0.5-7 wt. % B 2 O 3 , and 0-5 wt. % ZnO.
6. The hermetic electrical feedthrough of claim 1 , wherein the glass-ceramic has a coefficient of thermal expansion of between 11 to 17 ppm/° C.