Semiconductor device
Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.
1. A semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device, the semiconductor device being used for current control in instantaneous charging and discharging, using a current of at least 1 A, of a charge/discharge circuit of a battery and including a plurality of elements provided on a silicon substrate, the semiconductor device comprising:
a series connection circuit including a plurality of resistor elements and a transistor element that are connected in series, the plurality of resistor elements being connected to one another in parallel, the transistor element being instantaneously placed in a conducting state at the instantaneous charging and discharging, wherein:
a thickness of the semiconductor device is at least 250 μm, and
all elements of the series connection circuit are provided on the silicon substrate.
2. The semiconductor device according to claim 1 , wherein
the plurality of resistor elements are dispersedly disposed in a region occupying at least a half of a plan-view surface area of the semiconductor device.
3. The semiconductor device according to claim 1 , wherein
a thickness of the semiconductor device is at least 350 μm.
4. The semiconductor device according to claim 1 , wherein the plurality of resistor elements and the transistor element are connected in series with no other elements therebetween.
5. A semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device, the semiconductor device being used for current control for instantaneous charging and discharging using a current of at least 1 A, of a charge/discharge circuit of a battery and including a plurality of elements provided on a silicon substrate, the semiconductor device comprising:
a series connection circuit including a plurality of resistor elements and a transistor element that are connected in series, the plurality of resistor elements being connected to one another in parallel, the transistor element being instantaneously placed in a conductive state at the instantaneous charging and discharging, wherein:
a volume of the semiconductor device is at least 1.94 mm 3 , and
all elements of the series connection circuit are provided on the silicon substrate.
6. The semiconductor device according to claim 5 , wherein
the plurality of resistor elements are dispersedly disposed in a region occupying at least a half of a plan-view surface area of the semiconductor device.
7. The semiconductor device according to claim 5 , wherein
a volume of the semiconductor device is at least 2.20 mm 3 .
8. The semiconductor device according to claim 5 , wherein the plurality of resistor elements and the transistor element are connected in series with no other elements therebetween.
9. The semiconductor device according to claim 7 , wherein
the volume of the semiconductor device is at least 3.05 mm 3 .