Optoelectronic semiconductor device and method of manufacturing an optoelectronic semiconductor device
An optoelectronic semiconductor device and a method for manufacturing an optoelectronic semiconductor device are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor body having a first region of a first conductive type, an active region configured to generate electromagnetic radiation, a second region of a second conductive type and a coupling-out surface configured to couple-out the electromagnetic radiation, wherein the first region, the active region and the second region are arranged along a stacking direction, wherein the active region extends from a rear surface opposite the coupling-out surface to the coupling-out surface along a longitudinal direction transverse to or perpendicular to the stacking direction, and wherein the coupling-out surface is arranged plane-parallel to the rear surface.
1. An optoelectronic semiconductor device comprising:
a semiconductor body comprising:
a first region of a first conductive type;
an active region configured to generate electromagnetic radiation;
a second region of a second conductive type;
a coupling-out surface configured to couple-out the electromagnetic radiation,
wherein the first region, the active region and the second region are arranged along a stacking direction,
wherein the active region extends from a rear surface opposite the coupling-out surface to the coupling-out surface along a longitudinal direction transverse to or perpendicular to the stacking direction,
wherein the coupling-out surface is arranged plane-parallel to the rear surface,
wherein the first region at the coupling-out surface has at least one step in the longitudinal direction; and
a plurality of recesses arranged directly in the semiconductor body and arranged on the rear surface and the coupling-out surface forming a mirror and a further mirror,
wherein each of the recesses is provided with a passivation layer and a mirror layer.
2. The optoelectronic semiconductor device according to claim 1 , wherein the optoelectronic semiconductor device is configured to generate coherent radiation.
3. The optoelectronic semiconductor device according to claim 1 , wherein the semiconductor body has an extension in the longitudinal direction of less than 300 μm.
4. The optoelectronic semiconductor device according to claim 1 , wherein at least a portion of the semiconductor body is based on a nitride compound semiconductor material.
5. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface run parallel to a m-plane of a crystal of the semiconductor body.
6. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface have an average roughness in a range from 0.1 nm to 10 nm.
7. The optoelectronic semiconductor device according to claim 1 , wherein the step is structured so that the electromagnetic radiation emitted from the semiconductor body does not strike the step.
8. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface are coated with a semi-crystalline material.
9. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface are coated with a dielectric material.
10. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface are coated with a metal.
11. The optoelectronic semiconductor device according to claim 1 , wherein the coupling-out surface and the rear surface of the semiconductor body are produced by an etching process and a chemical polishing process to ensure low surface roughness and high plane-parallelism of the coupling-out surface and the rear surface.
12. The optoelectronic semiconductor device according to claim 11 , wherein characteristics of the coupling-out surface and the rear surface being produced by the etching process are verifiable on the optoelectronic semiconductor device, and wherein the characteristics are irregularities on the coupling-out surface and the rear surface caused by different etching rates in different materials or steps on the rear surface and the coupling-out surface.
13. The optoelectronic semiconductor device according to claim 11 , wherein a characteristic of the coupling-out surface and the rear surface being produced by the etching process are verifiable on the optoelectronic semiconductor device, and wherein the characteristic is a distance of less than 300 μm between the coupling-out surface and the rear surface.