Embedded ferroelectric memory in high-k first technology

1. An integrated chip, comprising:

a first doped region and a second doped region within a substrate;

a ferroelectric material arranged over the substrate and laterally between the first doped region and the second doped region; and

a conductive electrode over the ferroelectric material and between sidewalls of the ferroelectric material;

one or more sidewall spacers arranged along opposing sides of the ferroelectric material; and

a dielectric layer continuously and laterally extending from directly below the one or more sidewall spacers to directly below the ferroelectric material.

2. The integrated chip of claim 1 , further comprising:

one or more dielectric materials disposed within one or more trenches in the substrate, the one or more trenches arranged along opposing sides of the first doped region and the second doped region; and

wherein the first doped region and the second doped region are laterally separated from the one or more dielectric materials by the substrate.

3. The integrated chip of claim 1 , wherein the one or more sidewall spacers have a substantially constant width over a height extending between a bottommost surface and a topmost surface of the one or more sidewall spacers.

4. The integrated chip of claim 1 , wherein the one or more sidewall spacers comprise:

a first dielectric material covering sidewalls of the ferroelectric material; and

a second dielectric material covering sidewalls of the first dielectric material.

5. The integrated chip of claim 4 , further comprising:

an inter-level dielectric (ILD) layer surrounding the one or more sidewall spacers, wherein the ILD layer has an uppermost surface that is substantially co-planar with uppermost surfaces of both the first dielectric material and the second dielectric material.

6. The integrated chip of claim 1 , wherein the ferroelectric material directly contacts the conductive electrode.

7. The integrated chip of claim 1 , wherein the ferroelectric material comprises lead titanate, lead zirconate titanate, lead lanthanum zirconate titanate, strontium bismuth tantalate, bismuth lanthanum titanate, or bismuth neodymium titanate.

8. The integrated chip of claim 1 , wherein the dielectric layer continuously and laterally extends from directly below the one or more sidewall spacers to directly above the first doped region and the second doped region.

9. An integrated chip, comprising:

a first doped region and a second doped region disposed within a substrate;

a ferroelectric material arranged over the substrate and between the first doped region and the second doped region, wherein the ferroelectric material has sidewalls defining a first recess within an upper surface of the ferroelectric material;

a conductive material within the first recess;

an isolation structure arranged within the substrate along a first side of the ferroelectric material, wherein the isolation structure has a first width measured along an uppermost surface of the isolation structure and a second width measured along a horizontal line that extends along a bottom of the ferroelectric material, the second width being larger than the first width; and

wherein the first doped region is laterally between the conductive material and the isolation structure and wherein the first doped region is laterally separated from the isolation structure by a non-zero distance.

10. The integrated chip of claim 9 , wherein the isolation structure has a bottommost surface that is between a first side of the isolation structure facing the conductive material and a second side of the isolation structure facing away from the conductive material, the second side of the isolation structure having a first sidewall segment having a first slope and a second sidewall segment having a second slope that is different than the first slope.

11. The integrated chip of claim 9 , further comprising:

a dielectric layer disposed on the substrate and on a sidewall and a top surface of the isolation structure; and

an inter-level dielectric (ILD) layer arranged on the dielectric layer and laterally surrounding the ferroelectric material.

12. The integrated chip of claim 9 , further comprising:

a replacement gate remnant disposed over the isolation structure, wherein the replacement gate remnant extends from directly over the isolation structure to a sidewall that is laterally between the ferroelectric material and a sidewall of the isolation structure that faces the ferroelectric material.

13. The integrated chip of claim 9 , further comprising:

a replacement gate remnant disposed over the isolation structure, wherein the replacement gate remnant comprises a vertically extending segment and a horizontally extending segment, the horizontally extending segment protruding outward from a sidewall of the vertically extending segment to an outer edge that is laterally between the ferroelectric material and a sidewall of the isolation structure that faces the ferroelectric material.

14. The integrated chip of claim 9 , further comprising:

a transistor device arranged within the substrate; and

an additional isolation structure arranged within the substrate along a side of the transistor device facing away from the ferroelectric material, wherein the isolation structure has a different cross-sectional profile than the additional isolation structure.

15. The integrated chip of claim 9 , wherein the isolation structure has a first side comprising a first vertically extending surface directly coupled to a second vertically extending surface.

16. The integrated chip of claim 9 , wherein the isolation structure has a first side comprising a first vertically extending surface directly coupled to a second vertically extending surface, the first vertically extending surface arranged at a first slope and the second vertically extending surface arranged at a second slope that is different than the first slope.

17. A method of forming an integrated chip, comprising:

forming one or more isolation structures within a substrate;

etching the substrate and the one or more isolation structures to form a recess that is between sidewalls of the one or more isolation structures;

forming a dielectric layer over the substrate and the one or more isolation structures;

forming a sacrificial memory stack within the recess after forming the dielectric layer;

patterning the sacrificial memory stack to define a sacrificial memory structure over the substrate, wherein patterning the sacrificial memory stack leaves a remnant of the sacrificial memory stack along the sidewalls of the substrate;

forming an inter-level dielectric (ILD) layer over the substrate and laterally surrounding the sacrificial memory structure;

removing the sacrificial memory structure to form a memory device cavity surrounded by the ILD layer;

forming a ferroelectric material within the memory device cavity; and

forming a conductive material over the ferroelectric material and within the memory device cavity.

18. The method of claim 17 , wherein the dielectric layer remains over a topmost surface of the one or more isolation structures after forming the sacrificial memory stack.

19. The method of claim 18 , wherein the remnant of the sacrificial memory stack extends from directly over the one or more isolation structures to laterally between the ferroelectric material and a sidewall of the one or more isolation structures that faces the ferroelectric material.

20. The method of claim 17 , wherein the remnant of the sacrificial memory stack comprises a vertically extending segment and a horizontally extending segment protruding outward from a sidewall of the vertically extending segment.