Method of fabricating magneto-resistive random access memory (MRAM)
A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.
1. A method of fabricating magnetoresistive random-access memory (MRAM) cells on a substrate that is formed with a magnetic tunneling junction (MTJ) layer thereon, said method comprising:
etching the MTJ layer to form a plurality of MRAM cells, wherein metal components are deposited on a surface of the MRAM cells and between the MRAM cells during the etching of the MTJ layer;
removing the metal components by chemical reaction, wherein extra substances are formed during the removal of the metal components; and
removing the extra substances from the surface of the MRAM cells by physical etching;
wherein the removal of the metal components uses a gas that reacts with the metal components, and the extra substances include chemical compounds that result from chemical reactions between the MTJ layer and the gas used for the removal of the metal components.
2. The method of claim 1 , wherein the MTJ layer is etched by ion bombardment.
3. The method of claim 1 , wherein the gas reacts with the metal components to form electrically insulating metal compounds.
4. The method of claim 1 , wherein the gas reacts with the metal components to form metal compounds that have a boiling point lower than that of the metal components.
5. The method of claim 1 , wherein the removal of the extra substances uses ion beam etching (IBE), reactive ion etching (ME), atomic layer etching (ALE) or any combination thereof.
6. The method of claim 5 , wherein the removal of the extra substances uses the IBE that is performed using a gas of argon (Ar), chlorine (Cl), fluorine (F), bromine (Br), iodine (I), helium (He), neon (Ne), krypton (Kr), xenon (Xe), radon (Rn), or any combination thereof.
7. The method of claim 1 , wherein the removal of the metal components uses reactive ion etching (RIE), and the chemical compounds result from chemical reactions between the MTJ layer and chemical fragments dissociated by plasma from the gas used for the removal of the metal components.
8. The method of claim 1 , wherein the substrate is further formed with a first electrode layer over which the MTJ layer is formed, and a second electrode layer formed over the MTJ layer, and the metal components are composed of materials that are released from the first electrode layer, the MTJ layer and the second electrode layer during the etching of the MTJ layer.
9. The method of claim 8 , wherein:
the first electrode layer includes tantalum (Ta), tantalum nitride (TaN), titanium (Ti), titanium nitride (TiN), copper (Cu), cobalt (Co), tungsten (W), aluminum (Al), gold (Au), aluminum-copper alloy (AlCu), or any combination thereof;
the second electrode layer includes tantalum (Ta), tantalum nitride (TaN), titanium (Ti), titanium nitride (TiN), copper (Cu), cobalt (Co), tungsten (W), aluminum (Al), gold (Au), aluminum-copper alloy (AlCu), or any combination thereof; and
the MTJ layer includes a ferromagnetic material of CoFeB, CoFeTa, NiFe, Co, CoFe, CoPt, CoPd, FePt, Ru, Ta, TaN, alloys of Ni, Co and Fe, or any combination thereof, and an insulating material including magnesium oxide, aluminum oxide, aluminum nitride, aluminum oxynitride, or any combination thereof.
10. The method of claim 8 , wherein the etching of the MTJ layer is performed using a first ion beam etching (IBE) process, and the removal of the extra substances is performed using a second IBE process.
11. The method of claim 10 , wherein the second IBE process has an etching time shorter than that of the first IBE process.
12. The method of claim 10 , wherein the second IBE process has a bias voltage smaller than that of the first IBE process.
13. A method for reducing current leakage between electronic circuit elements, comprising:
treating a substrate to form the electronic circuit elements therein by ion bombardment, wherein, during the ion bombardment, metal components in the substrate are released and deposited on and between the electronic circuit elements thus formed;
using a gas that reacts with the metal components to form metal compounds whose boiling point is lower than that of the metal components;
vaporizing the metal compounds; and
removing, by physical etching, extra substances that are formed by the electronic circuit elements reacting with the gas.
14. The method of claim 13 , wherein the gas is introduced to react with the metal components in a process of reactive ion etching (ME), in which the gas is dissociated to generate a main product that is combined with the metal components to form the metal compounds, and a by-product that reacts with the electronic circuit elements to form the extra substances.
15. The method of claim 13 , wherein the substrate is treated using a first ion beam etching (IBE) process to form the electronic circuit elements, and the extra substances are removed using a second IBE process, wherein an intensity of etching of the second IBE process is smaller than that of the first IBE process in terms of at least one of an etching time or a bias voltage.
16. A method of fabricating magnetoresistive random-access memory (MRAM) cells on a substrate that is formed with a magnetic tunneling junction (MTJ) layer thereon, said method comprising:
etching the MTJ layer to form a plurality of MRAM cells, wherein metal components are deposited on a surface of the MRAM cells and between the MRAM cells during the etching of the MTJ layer;
removing the metal components by chemical reaction, wherein extra substances are formed during the removal of the metal components; and
removing the extra substances from the surface of the MRAM cells by physical etching;
wherein the removal of the metal components uses reactive ion etching (RIE), and the extra substances include chemical compounds that result from chemical reactions between the MTJ layer and chemical fragments dissociated by plasma from a gas used for the removal of the metal components.
17. The method of claim 16 , wherein the gas reacts with the metal components to form electrically insulating metal compounds.
18. The method of claim 16 , wherein the gas reacts with the metal components to form metal compounds that have a boiling point lower than that of the metal components.
19. The method of claim 16 , wherein the etching of the MTJ layer is performed using a first ion beam etching (IBE) process, and the removal of the extra substances is performed using a second IBE process; and
wherein the second IBE process has an etching time shorter than that of the first IBE process.
20. The method of claim 16 , wherein the etching of the MTJ layer is performed using a first ion beam etching (IBE) process, and the removal of the extra substances is performed using a second IBE process; and
wherein the second IBE process has a bias voltage smaller than that of the first IBE process.