Piezo actuator and piezo actuator array

1. A piezo actuator comprising:

a piezo bending transducer comprising a carrier layer which is at least partially covered on one or two sides with one or more piezo lamellas, the piezo bending transducer further comprising a movable end;

a housing;

a reference stop connected to the housing for determining a reference position for an actuating movement;

a first bearing region which comprises regions of the piezo actuator and the housing and which allows for twists of the piezo bending transducer;

a second bearing region with a surface on the side of the bending transducer and a surface on the side of the housing, and an intermediate layer between the surface on the side of the bending transducer and the surface on the side of the housing, wherein the intermediate layer connects the surface on the side of the bending transducer and the surface on the side of the housing, wherein the intermediate layer has a liquefaction temperature at which it liquefies; and

a pressure element for generating a bias torque on the piezo bending transducer near the first bearing region against the reference stop;

wherein the piezo actuator is operable between an operating mode and an alignment mode:

wherein when the piezo bending transducer carries out actuating movements in the operating mode, the temperature of the intermediate layer is below the liquefaction temperature and the intermediate layer is sufficiently firm to transfer the bearing forces in the second bearing region,

wherein, in the alignment mode, the piezo bending transducer is aligned with the reference stop and the temperature of the intermediate layer is above the liquefaction temperature due to a supply of heat; and

wherein the supply of heat is provided by one of an external heat source and an integrated heating element in thermal contact with the second bearing region.

2. A piezo actuator according to claim 1 , wherein the heating element is controlled by a process controller adapted to control the heat output and heating time of the heating element such that the temperature in the second bearing region is raised above the liquefaction temperature of the intermediate layer, and such that the intermediate layer is liquified for a period of time between 1 second and 100 seconds.

3. A piezo actuator according to claim 1 , wherein the intermediate layer comprises a solder with a liquefaction temperature below of 250° C. or less, wherein the solder is in electrical contact with one of the carrier layer and an electrode of the piezo lamella.

4. A piezo actuator according to claim 1 , wherein the intermediate layer comprises one of a thermoplastic material, a thermoplastic elastomer, a bitumen, or a wax, having a liquefaction temperature of 250° C. or less.

5. A piezo actuator according to claim 1 , wherein the piezo bending transducer is adapted to receive a bias torque near the first bearing region, wherein upon application of the bias torque the movable end of the piezo bending transducer, or an effector connected thereto, is pressed against the reference stop.

6. A piezo actuator according to claim 5 , wherein

the piezo bending transducer has clamping force of magnitude (F K );

the first bearing region is located a distance (L R ) from an actuation point of the piezo bending transducer;

the bias torque is a force of magnitude (F) applied to the piezo bending transducer by the pressure element at a contact point;

the contact point is located on the piezo bending transducer at a distance (x) from the pivot point of the first bearing region; and

the relationship between (F), (x), (F K ), and (L R ) is (F)*(x)<0.5*(F K )*(L R ).

7. A piezo actuator according to claim 1 , wherein the piezo bending transducer is of monomorphical construction with one piezo lamella glued to the carrier layer, wherein the one piezo lamella covers the carrier layer predominantly in the region of a free length of the piezo bending transducer, or the one piezo lamella covers the carrier layer substantially completely.

8. A piezo actuator according to claim 1 , wherein the piezo bending transducer is of bimorphical construction with two piezo lamellas each glued to either side of the carrier layer, wherein the two piezo lamellas cover the carrier layer predominantly in the region of a free length of the piezo bending transducer, or the two piezo lamellas cover the carrier layer substantially completely.

9. A piezo actuator according to claim 1 , wherein the pressure element comprises a spring.

10. A piezo actuator according to claim 9 , wherein the pressure element is selected from metallic spiral springs, flexion springs, electrical contact springs, and combinations thereof.

11. A piezo actuator according to claim 1 , wherein the pressure element comprises an elastomer element.

12. A method for aligning a piezo actuator in accordance with claim 1 , the method comprising the following steps:

a) providing a piezo actuator in accordance with claim 1 ;

b) liquifying the intermediate layer by applying heat to the second bearing region;

c) aligning the piezo bending transducer against the reference stop by the application of the bias torque to the piezo bending transducer for an alignment time (T A );

d) solidifying the intermediate layer by cooling the second bearing region for a cooling time (T K ).

13. The method for aligning a piezo actuator according to claim 12 , wherein the liquifying step further comprises the application of electricity to the piezo bending transducer.

14. The method for aligning a piezo actuator according to claim 13 , wherein the voltage of the electricity applied to the piezo bending transducer is adjusted in response to deformation of the piezo bending transducer resulting from application of the bias torque.

15. The method for aligning a piezo actuator according to claim 13 , wherein, the voltage of the electricity applied to the piezo bending transducer is different from the voltage applied during the liquefying step of a preceding alignment cycle.