IP Library › Granted Patent US 12,274,034
Granted Patent B2
US 12,274,034 · App. 17/233,921 · Granted Apr 8, 2025

Hardened optical platform with pluggable optics

Inventors: Peter Saturley (Ottawa, CA); Terence Graham (Manotick, CA); Daniel Rivaud (Ottawa, CA); Jeffrey Scott Moynihan (Cumming, GA)
Assignee: Ciena Corporation
H05K7/2049G02B6/445H05K5/0069H05K7/026H05K7/10H05K7/20336H05K7/20418
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Quick Facts
Patent No.
US 12,274,034
App. No.
17/233,921
Granted
Apr 8, 2025
Kind
B2
Abstract

A hardened optical platform includes a hardened enclosure including a door that when closed environmentally seals the hardened enclosure; a first set including one of more modules; a second set including one or more modules arranged substantially perpendicular to the first set; and high-speed cabling interconnecting the first set to the second set, wherein the hardened optical platform is passively cooled with the hardened enclosure and the door being weatherproof thereby having no airflow internally from a surrounding environment.

Claims (28)

1. A hardened optical platform comprising:

a hardened enclosure including a planar rear surface having an inside within the hardened enclosure and an outside exposed to an outside environment outside of the hardened enclosure, a door that when closed environmentally seals the hardened enclosure, and heat fins disposed on the outside of the planar rear surface in the outside environment outside of the hardened enclosure;

a first set of one or more modules disposed in one or more housings disposed within the hardened enclosure, each housing including a planar rear thermal contact surface that is enlarged relative to a remainder of the housing; and

high-speed cabling interconnecting the first set of one or more modules to a second set of one or more modules,

wherein the first set of one or more modules is passively cooled with the hardened enclosure by the enlarged planar rear thermal contact surface of each of the one or more housings directly abutting and making a direct surface-to-surface thermal contact with the inside of the planar rear surface of the hardened enclosure within the hardened enclosure opposite the heat fins disposed on the outside of the planar rear surface of the hardened enclosure in the outside environment and the door being weatherproof thereby having no airflow internally from a surrounding environment.

2. The hardened optical platform of claim 1 , wherein the high-speed cabling is twinaxial cabling.

3. The hardened optical platform of claim 1 , wherein the first set includes any of line modules and client modules, and the second set includes switch modules.

4. The hardened optical platform of claim 1 , wherein the high-speed cabling is utilized in lieu of a backplane.

5. The hardened optical platform of claim 1 , wherein each module in both the first set and the second set includes cabling only on a faceplate.

6. The hardened optical platform of claim 1 , wherein the hardened enclosure has a rectangular shape, and wherein the second set are arranged along a length of the hardened enclosure.

7. The hardened optical platform of claim 1 , wherein the hardened enclosure includes a length and a width, and wherein the second set are arranged along the length of the hardened enclosure.

8. The hardened optical platform of claim 1 , wherein the second set generates more heat than the first set.

9. The hardened optical platform of claim 1 , wherein the second set is configured to supply power to the first set.

10. The hardened optical platform of claim 1 , wherein the high-speed cabling is electrical cable, and wherein the first set further include optical ports.

11. The hardened optical platform of claim 1 , wherein each of the one or more housings is a thermally conductive housing.

12. The hardened optical platform of claim 1 , wherein one or more modules in the first set include at least one cage configured to receive a pluggable optical module.

13. The hardened optical platform of claim 1 , wherein the hardened enclosure is configured to be any of pole-mounted, strand-mounted, mounted to an exterior of a building, and located in an outside plant cabinet.

14. The hardened optical platform of claim 1 , wherein the hardened optical platform is a packet switch.

15. The hardened optical platform of claim 1 , wherein the hardened optical platform is a Time-Division Multiplexed (TDM) switch.

16. The hardened optical platform of claim 1 , wherein a front cover of the door includes spaces and guides for fiber management and fiber splicing.

17. The hardened optical platform of claim 1 , further comprising a temperature sensor and circuitry configured to heat an interior of the hardened enclosure responsive to a predetermined temperature.

18. The hardened optical platform of claim 1 , wherein each of the first set of one or more modules comprises a printed circuit board sandwiched between a first side and a second side of each of the one or more housings adjacent to the planar rear thermal contact surface.

19. The hardened optical platform of claim 1 , wherein the heat fins move heat received from each of the first set of one or more modules and the planar rear thermal contact surface of each of the one or more housings through the planar rear surface of the hardened enclosure to the surrounding environment via convection.

20. A method comprising providing a hardened optical platform that includes

a hardened enclosure including a planar rear surface having an inside within the hardened enclosure and an outside exposed to an outside environment outside of the hardened enclosure, a door that when closed environmentally seals the hardened enclosure, and heat fins disposed on the outside of the planar rear surface in the outside environment outside of the hardened enclosure;

a first set of one or more modules disposed in one or more housings disposed within the hardened enclosure, each housing including a planar rear thermal contact surface that is enlarged relative to a remainder of the housing; and

high-speed cabling interconnecting the first set of one or more modules to a second set of one or more modules,

wherein the first set of one or more modules is passively cooled with the hardened enclosure by the enlarged planar rear thermal contact surface of each of the one or more housings directly abutting and making a direct surface-to-surface thermal contact with the inside of the planar rear surface of the hardened enclosure within the hardened enclosure opposite the heat fins disposed on the outside of the planar rear surface of the hardened enclosure in the outside environment and the door being weatherproof thereby having no airflow internally from a surrounding environment.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2021
From: SATURLEY, PETER; GRAHAM, TERENCE; RIVAUD, DANIEL; MOYNIHAN, JEFFREY SCOTT
To: CIENA CORPORATION
Reel/Frame 055974/0090 →
Continuity (2)
Continuation 16137123 · Sep 20, 2018
Related Publication 20210243915A1 · Aug 5, 2021
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