Multi-layer ceramic electronic component, circuit board, and method of producing a multi-layer ceramic electronic component

1. A multi-layer ceramic electronic component, comprising:

a ceramic body including

an end surface facing in a first direction, and

internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction,

wherein the end surface has two first peripheral portions being disposed opposite each other in a third direction orthogonal to the first direction and the second direction, and two second peripheral portions being disposed opposite each other in the second direction; and

an external electrode provided on the end surface and including two protrusions that are formed continuously along the two first peripheral portions of the end surface, respectively, and protrude in the first direction,

wherein the external electrode includes no protrusions protruding in the first direction and extending continuously along the two second peripheral portions of the end surface,

and wherein a dimension of each of the two protrusions in the third direction is 15 μm or more and 60 μm or less.

2. The multi-layer ceramic electronic component according to claim 1 , wherein

a dimension of each of the two protrusions in the first direction is 10 μm or more and 20 μm or less.

3. The multi-layer ceramic electronic component according to claim 1 , wherein

each of the two protrusions includes a top portion most protruding in the first direction on a cross-section viewed in the second direction, and

a distance in the third direction between the top portions of the two protrusions is 250 μm or more and 285 μm or less.

4. A circuit board, comprising:

a mount board having a mount surface;

two multi-layer ceramic electronic components disposed side by side in a first direction and each including

a ceramic body including

an end surface facing in the first direction, and

internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction,

wherein the end surface has two first peripheral portions being disposed opposite each other in a third direction orthogonal to the first direction and the second direction, and two second peripheral portions being disposed opposite each other in the second direction, and

an external electrode provided on the end surface and connected to the mount surface; and

a solder that bonds a surface of the external electrode and the mount surface to each other,

wherein the external electrode includes two protrusions that are formed continuously along the two first peripheral portions of the end surface, respectively, and protrude in the first direction,

the external electrode includes no protrusions protruding in the first direction and extending continuously along the two second peripheral portions of the end surface,

a distance in the first direction between the external electrodes of the two multi-layer ceramic electronic components is 100 μm or less, and

a dimension of each of the two protrusions in the third direction is 15 μm or more and 60 μm or less.

5. The circuit board according to claim 4 , wherein the mount surface includes a land, and

the solder bonds the surface of the external electrode and the land to each other.

6. A multi-layer ceramic electronic component, comprising: a ceramic body including

an end surface facing in a first direction, and

internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction; and

an external electrode provided on the end surface and including two protrusions that are formed continuously along two peripheral portions of the end surface, respectively, and protrude in the first direction, the two peripheral portions being disposed opposite each other in a third direction orthogonal to the first direction and the second direction,

wherein a width of each of the two protrusions in the third direction is less than a distance between the two protrusions in the third direction.

7. The multi-layer ceramic electronic component according to claim 6 , wherein the width of each of the two protrusions in the third direction is 15 μm or more and 60 μm or less.

8. The multi-layer ceramic electronic component according to claim 6 , wherein a dimension of each of the two protrusions in the first direction is 10 μm or more and 20 μm or less.

9. The multi-layer ceramic electronic component according to claim 6 , wherein

the two protrusions have apexes, respectively, protruding most in the first direction, and

a distance between the apexes of the two protrusions is 250 μm or more and 285 μm or less.