Thickness measurement of substrate using color metrology
A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.
1. A computer program product for obtaining values representative of a plurality of thicknesses of a plurality of locations on a substrate, the computer program product tangibly embodied in a non-transitory computer readable medium, comprising instructions for causing a processor to:
store an image mask representing image data that will not be processed;
receive a color image of the substrate from a color camera;
transform the color image to a standard coordinate frame;
apply the image mask to the color image in the standard coordinate frame to generate a masked color image;
for each unmasked pixel in the masked color image,
determine a coordinate of the pixel in a coordinate space of at least two dimensions including a first color channel and a second color channel from color data in the color image for the pixel, and
determine a value representative of a thickness of a layer on the substrate based on the coordinate of the pixel in the coordinate space.
2. The computer program product of claim 1 , wherein the image mask comprises a plurality of rectangular unmasked regions separated by gaps that provide portions of the image to screen out.
3. The computer program product of claim 1 , wherein portions of the image to mask out represent scribe lines on a substrate.
4. The computer program product of claim 1 , comprising instructions to locate a wafer orientation feature and a wafer center.
5. The computer program product of claim 4 , comprising instructions to rotate the color image such that that there is a Wangle between the x-axis of the image and a radial segment connecting the wafer center and the wafer orientation feature.
6. The computer program product of claim 1 , wherein the first color channel and the second color channel are selected from a group of color channels comprising hue, saturation, luminosity, X, Y, Z, red chromaticity, green chromaticity, and blue chromaticity.
7. The computer program product of claim 6 , wherein the first color channel is a red chromaticity and the second color channel is a green chromaticity.
8. The computer program product of claim 1 , comprising instructions to
store a function that provides a value representative of a thickness as a function of a position on a predetermined path in the coordinate space;
for each pixel of a plurality of pixels at different locations in the color image,
determine a position of a point on the predetermined path that is closest to the coordinate of the pixel; and
calculate the value representative of a thickness of a layer on the substrate from the function and the position of the point on the predetermined path.
9. The computer program product of claim 8 , wherein the coordinate space is two-dimensional.
10. The computer program product of claim 8 , wherein the coordinate space is three-dimensional.
11. The computer program product of claim 1 , comprising instructions to receive a sequence of color images with each image capturing less than all of the substrate and to generate a 2-dimensional color image of all of the substrate from the sequence of color images.