Low pressure sintering powder

1. A sintering powder comprising:

a particulate, wherein the particulate comprises:

from 1 to 19 wt % of a first type of metal particles having a mean longest dimension of from 100 nm to 20 μm, wherein the first type of metal particles is at least partially coated with a first capping agent comprising oleic acid and has a D50 of from 1 to 3 μm;

from 81 to 99 wt % of a second type of metal particles having a mean longest dimension of from 5 to 75 nm, wherein the second type of metal particles is at least partially coated with a second capping agent comprising octylamine; and

a total capping agent concentration of up to 5 wt %.

2. The sintering powder of claim 1 , wherein the sintering powder has a total capping agent concentration of at least 0.1 wt %.

3. The sintering powder of claim 1 , wherein the sintering powder has a total capping agent concentration of from 0.1 to 3 wt % capping agent.

4. The sintering powder of claim 2 , wherein the concentration of the first type of metal particles in the particulate is from 1 to 10 wt % and the concentration of the second type of metal particles in the particulate is from 90 to 99 wt %.

5. A sintering film comprising:

the sintering powder of claim 2 ; and

a binder.

6. A sintering paste comprising:

the sintering powder of claim 2 ; and

a solvent.

7. The sintering paste of claim 6 , wherein the sintering paste further comprises at least one of a binder, a rheology modifier, an organosilver compound, an activator, a surfactant, a wetting agent, hydrogen peroxide, and organic peroxide.

8. A method of manufacturing a sintered joint comprising:

printing the sintering paste of claim 6 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

providing the sintering film in a vicinity of two or more work pieces to be joined; and

heating the sintering film to at least partially sinter the metal.

9. A method of die attachment comprising:

printing the sintering paste of claim 6 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

placing the sintering film between a die and a substrate to be joined; and

sintering the sintering film.

10. A method of wafer bonding comprising:

printing the sintering paste of claim 6 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate or the wafer to be bonded to form an assembly having a sintering film side and a substrate or the wafer side;

contacting the sintering film side of the assembly with a component or another wafer;

sintering the sintering film, wherein the sintering is carried out without the application of pressure or with an application of pressure in the range from 1-20 MPa and heating 150-400° C. for 1 to 60 minutes.

11. A method of transferring a sintering film to a component, comprising:

printing the sintering paste of claim 6 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate to form an assembly having a sintering film side and a substrate side;

contacting the sintering film side of the assembly with a component;

heating the assembly to a temperature of from 50 to 200° C.;

applying a pressure of from 1 to 5 MPa to the assembly for from 0.1 seconds to 60 minutes; and

separating the substrate from the sintering film.

12. A sintering powder comprising:

a particulate, wherein the particulate comprises:

from 1 to 19 wt % of a first type of metal particles having a mean longest dimension of from 100 nm to 20 μm, wherein the first type of metal particles is at least partially coated with a first capping agent comprising oleic acid, has a tap density of from 3.5 to 5.5 g/cc, and has a D50 of from 1 to 3 μm; and

from 81 to 99 wt % of a second type of metal particles having a mean longest dimension of from 5 to 75 nm, wherein the second type of metal particles is at least partially coated with a second capping agent comprising octylamine.

13. The sintering powder of claim 12 , wherein the concentration of the first type of metal particles in the particulate is from 1 to 10 wt % and the concentration of the second type of metal particles in the particulate is from 90 to 99 wt %.

14. A sintering film comprising:

the sintering powder of claim 12 ; and

a binder.

15. A sintering paste comprising:

the sintering powder of claim 12 ; and

a solvent.

16. The sintering paste of claim 15 , wherein the sintering paste further comprises at least one of a binder, a rheology modifier, an organosilver compound, an activator, a surfactant, a wetting agent, hydrogen peroxide, and organic peroxide.

17. A method of manufacturing a sintered joint comprising:

printing the sintering paste of claim 15 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

providing the sintering film in a vicinity of two or more work pieces to be joined; and

heating the sintering film to at least partially sinter the metal.

18. A method of die attachment comprising:

printing the sintering paste of claim 15 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

placing the sintering film between a die and a substrate to be joined; and

sintering the sintering film.

19. A method of wafer bonding comprising:

printing the sintering paste of claim 15 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate or the wafer to be bonded to form an assembly having a sintering film side and a substrate or the wafer side;

contacting the sintering film side of the assembly with a component or another wafer;

sintering the sintering film, wherein the sintering is carried out without the application of pressure or with an application of pressure in the range from 1-20 MPa and heating 150-400° C. for 1 to 60 minutes.

20. A method of transferring a sintering film to a component, comprising:

printing the sintering paste of claim 15 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate to form an assembly having a sintering film side and a substrate side;

contacting the sintering film side of the assembly with a component;

heating the assembly to a temperature of from 50 to 200° C.;

applying a pressure of from 1 to 5 MPa to the assembly for from 0.1 seconds to 60 minutes; and

separating the substrate from the sintering film.

21. A sintering powder comprising:

a particulate, wherein the particulate comprises:

from 1 to 19 wt % of a first type of metal particles having a mean longest dimension of from 100 nm to 20 μm, wherein the first type of metal particles is at least partially coated with a first capping agent comprising oleic acid and has a D50 of from 1 to 3 μm;

from 81 to 99 wt % of a second type of metal particles having a mean longest dimension of from 5 to 75 nm, wherein the second type of metal particles is at least partially coated with a second capping agent comprising octylamine; and

wherein the first type of metal particles and/or second type of metal particles comprises silver or an alloy or core-shell structures of silver coated particles thereof.

22. The sintering powder of claim 21 , wherein the concentration of the first type of metal particles in the particulate is from 1 to 10 wt % and the concentration of the second type of metal particles in the particulate is from 90 to 99 wt %.

23. A sintering film comprising:

the sintering powder of claim 21 ; and

a binder.

24. A sintering paste comprising:

the sintering powder of claim 21 ; and

a solvent.

25. The sintering paste of claim 24 , wherein the sintering paste further comprises at least one of a binder, a rheology modifier, an organosilver compound, an activator, a surfactant, a wetting agent, hydrogen peroxide, and organic peroxide.

26. A method of manufacturing a sintered joint comprising:

printing the sintering paste of claim 24 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

providing the sintering film in a vicinity of two or more work pieces to be joined; and

heating the sintering film to at least partially sinter the metal.

27. A method of die attachment comprising:

printing the sintering paste of claim 24 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

placing the sintering film between a die and a substrate to be joined; and

sintering the sintering film.

28. A method of wafer bonding comprising:

printing the sintering paste of claim 24 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate or the wafer to be bonded to form an assembly having a sintering film side and a substrate or the wafer side;

contacting the sintering film side of the assembly with a component or another wafer;

sintering the sintering film, wherein the sintering is carried out without the application of pressure or with an application of pressure in the range from 1-20 MPa and heating 150-400° ° C. for 1 to 60 minutes.

29. A method of transferring a sintering film to a component, comprising:

printing the sintering paste of claim 22 onto a sheet;

heating the paste to at least partially remove the solvent and form a sintering film;

applying the sintering film to a substrate to form an assembly having a sintering film side and a substrate side;

contacting the sintering film side of the assembly with a component;

heating the assembly to a temperature of from 50 to 200° C.;

applying a pressure of from 1 to 5 MPa to the assembly for from 0.1 seconds to 60 minutes; and

separating the substrate from the sintering film.