Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
Techniques for reducing the specific contact resistance of metal-semiconductor (group IV) junctions by interposing a monolayer of group V or group III atoms at the interface between the metal and the semiconductor, or interposing a bi-layer made of one monolayer of each, or interposing multiple such bi-layers. The resulting low specific resistance metal-group IV semiconductor junctions find application as a low resistance electrode in semiconductor devices including electronic devices (e.g., transistors, diodes, etc.) and optoelectronic devices (e.g., lasers, solar cells, photodetectors, etc.) and/or as a metal source and/or drain region (or a portion thereof) in a field effect transistor (FET). The monolayers of group III and group V atoms are predominantly ordered layers of atoms formed on the surface of the group IV semiconductor and chemically bonded to the surface atoms of the group IV semiconductor.
1. An electrical contact, comprising a metal and group IV semiconductor separated by an interfacial layer, the semiconductor comprising either an n-type or a p-type doped semiconductor source or drain of a transistor, the metal being a barrier metal, and the interfacial layer being a layer of ordered group V atoms adjacent the semiconductor if the semiconductor is the n-type doped semiconductor source or drain or an ordered layer of group III atoms adjacent the semiconductor if the semiconductor is the p-type doped semiconductor source or drain.
2. The electrical contact of claim 1 , wherein the metal comprises tantalum nitride.
3. The electrical contact of claim 1 , wherein the metal comprises titanium nitride.
4. The electrical contact of claim 1 , wherein the metal comprises ruthenium.
5. The electrical contact of claim 1 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {111}-oriented surface.
6. The electrical contact of claim 1 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {100}-oriented surface.
7. The electrical contact of claim 1 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {100}-oriented surface.
8. The electrical contact of claim 1 , wherein the interfacial layer comprises one or more bi-layers, at least one of the bi-layers including the layer of ordered group V atoms or layer of ordered group III atoms, as applicable.
9. The electrical contact of claim 8 , wherein the at least one of the bi-layers further includes a layer of group III atoms coordinated with the layer of ordered group V atoms or a layer of group V atoms coordinated with the layer of ordered group III atoms, as applicable.
10. The electrical contact of claim 9 , wherein the metal comprises one of: tantalum nitride, titanium nitride, and ruthenium.
11. An electrical contact, comprising a metal and a group IV semiconductor separated by an interfacial layer, the semiconductor comprising either an n-type or a p-type doped semiconductor channel of a transistor, the metal being a barrier metal source or drain of a transistor, and the interfacial layer being a layer of ordered group V atoms adjacent the semiconductor if the semiconductor is the n-type doped semiconductor source or drain or an ordered layer of group III atoms adjacent the semiconductor if the semiconductor is the p-type doped semiconductor source or drain.
12. The electrical contact of claim 11 , wherein the metal comprises tantalum nitride.
13. The electrical contact of claim 11 , wherein the metal comprises titanium nitride.
14. The electrical contact of claim 11 , wherein the metal comprises ruthenium.
15. The electrical contact of claim 11 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {111}-oriented surface.
16. The electrical contact of claim 11 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {100}-oriented surface.
17. The electrical contact of claim 11 , wherein a surface of the group IV semiconductor on which the metal contact is formed is a {100}-oriented surface.
18. The electrical contact of claim 11 , wherein the interfacial layer comprises one or more bi-layers, at least one of the bi-layers including the layer of ordered group V atoms or layer of ordered group III atoms, as applicable.
19. The electrical contact of claim 18 , wherein the at least one of the bi-layers further includes a layer of group III atoms coordinated with the layer of ordered group V atoms or a layer of group V atoms coordinated with the layer of ordered group III atoms, as applicable.
20. The electrical contact of claim 19 , wherein the metal comprises one of: tantalum nitride, titanium nitride, and ruthenium.