IP Library Granted Patent US 11,477,403
Granted Patent B2
US 11,477,403 · App. 17/250,307 · Granted Oct 18, 2022

Imaging element and method for manufacturing imaging element

Inventors: Sachio Nishi (Kumamoto, JP); Hironobu Fukagawa (Kumamoto, JP); Hideaki Kato (Kumamoto, JP); Akimitsu Sato (Kumamoto, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N5/36961H01L27/146
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Quick Facts
Patent No.
US 11,477,403
App. No.
17/250,307
Granted
Oct 18, 2022
Kind
B2
Abstract

A step of forming an on-chip lens of a phase difference pixel is simplified. An imaging element includes a pixel array unit, an individual on-chip lens, a common on-chip lens, and an adjacent on-chip lens. In the pixel array unit, pixels that performs photoelectric conversion according to incident light components, a plurality of phase difference pixels that is included in the pixels, is arranged adjacent to each other, and detects a phase difference, and phase difference pixel adjacent pixels that are included in the pixels and are adjacent to the phase difference pixels are arranged two-dimensionally. The individual on-chip lens is arranged for each of the pixels and individually condenses the incident light components on corresponding one of the pixels. The common on-chip lens is commonly arranged in the plurality of phase difference pixels and commonly condenses the incident light component. The adjacent on-chip lens is arranged for each of the phase difference pixel adjacent pixels, individually condenses the incident light components on corresponding one of the phase difference pixel adjacent pixels, and is formed to have a size different from the individual on-chip lens to adjust a shape of the common on-chip lens.

Claims (28)

1. An imaging element, comprising:

a pixel array unit in which pixels that perform photoelectric conversion according to incident light components, a plurality of phase difference pixels that is included in the pixels, is arranged adjacent to each other, and detects a phase difference, and phase difference pixel adjacent pixels that are included in the pixels and are adjacent to the plurality of phase difference pixels are arranged two-dimensionally;

an individual on-chip lens that is arranged for each of the pixels and individually condenses the incident light components on corresponding one of the pixels;

a common on-chip lens that is commonly arranged in the plurality of phase difference pixels and commonly condenses the incident light components; and

an adjacent on-chip lens that is arranged for each of the phase difference pixel adjacent pixels, individually condenses the incident light components on corresponding one of the phase difference pixel adjacent pixels, and is formed to have a size different from the individual on-chip lens to adjust a shape of the common on-chip lens,

wherein the adjacent on-chip lens is formed at different heights between a bottom portion of a region adjacent to the common on-chip lens and a bottom portion of a region adjacent to the individual on-chip lens.

2. The imaging element according to claim 1 , wherein the adjacent on-chip lens is formed to have a size larger than the individual on-chip lens.

3. The imaging element according to claim 2 , wherein the adjacent on-chip lens is formed to have a bottom portion with a width larger than the individual on-chip lens.

4. The imaging element according to claim 2 , wherein the adjacent on-chip lens adjacent to the common on-chip lens at an apex is formed to have a size larger than the adjacent on-chip lens adjacent to the common on-chip lens on a side.

5. The imaging element according to claim 1 , wherein

the individual on-chip lens is arranged so that a position relative to corresponding one of the pixels is shifted according to an incident angle of the incident light components,

the adjacent on-chip lens is arranged so that a position relative to corresponding one of the phase difference pixel adjacent pixels is shifted according to the incident angle of the incident light components, and

the common on-chip lens is arranged so that a position relative to the plurality of phase difference pixels is shifted according to the incident angle of the incident light components.

6. The imaging element according to claim 5 , wherein, among peripheral adjacent on-chip lenses that are adjacent on-chip lenses adjacent to a peripheral common on-chip lens which is a common on-chip lens arranged in a periphery of the pixel array unit, a peripheral adjacent on-chip lens close to an optical center of the pixel array unit and a peripheral adjacent on-chip lens close to an end portion of the pixel array unit are formed to have different sizes.

7. The imaging element according to claim 6 , wherein, among the peripheral adjacent on-chip lenses, the peripheral adjacent on-chip lens close to the optical center of the pixel array unit is formed to have a size smaller than the peripheral adjacent on-chip lens close to the end portion of the pixel array unit, which is arranged symmetrically with respect to the peripheral common on-chip lens.

8. The imaging element according to claim 6 , wherein a peripheral close-adjacent on-chip lens that is a peripheral adjacent on-chip lens arranged between the peripheral common on-chip lens and the optical center of the pixel array unit is formed to have a size smaller than a peripheral far-adjacent on-chip lens that is a peripheral adjacent on-chip lens arranged symmetrically with respect to the peripheral common on-chip lens.

9. The imaging element according to claim 8 , wherein the peripheral close-adjacent on-chip lens is formed to have a size smaller than the individual on-chip lens adjacent to the peripheral close-adjacent on-chip lens.

10. The imaging element according to claim 8 , wherein the peripheral far-adjacent on-chip lens is formed to have a size larger than the individual on-chip lens adjacent to the peripheral far-adjacent on-chip lens.

11. The imaging element according to claim 1 , wherein a shape of a bottom surface of the adjacent on-chip lens is formed as a shape different from a bottom surface of the phase difference pixel adjacent pixels.

12. The imaging element according to claim 1 , wherein the common on-chip lens commonly condenses the incident light components on two of the plurality of phase difference pixels.

13. The imaging element according to claim 1 , wherein the common on-chip lens commonly condenses the incident light components on four of the plurality of phase difference pixels.

14. The imaging element according to claim 1 , wherein the plurality of phase difference pixels performs pupil division on the incident light components to detect the phase difference.

15. A method for manufacturing an imaging element, the method comprising:

forming a pixel array unit in which pixels that perform photoelectric conversion according to incident light components, a plurality of phase difference pixels that is included in the pixels, is arranged adjacent to each other, and detects a phase difference, and phase difference pixel adjacent pixels that are included in the pixels and are adjacent to the plurality of phase difference pixels are arranged two-dimensionally;

forming an individual on-chip lens that is arranged for each of the pixels and individually condenses the incident light components on corresponding one of the pixels;

forming a common on-chip lens that is commonly arranged in the plurality of phase difference pixels and commonly condenses the incident light components; and

forming an adjacent on-chip lens that is arranged for each of the phase difference pixel adjacent pixels, individually condenses the incident light components on corresponding one of the phase difference pixel adjacent pixels, and is formed to have a size different from the individual on-chip lens to adjust a shape of the common on-chip lens,

wherein the adjacent on-chip lens is formed at different heights between a bottom portion of a region adjacent to the common on-chip lens and a bottom portion of a region adjacent to the individual on-chip lens.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2020
From: NISHI, SACHIO; FUKAGAWA, HIRONOBU; KATO, HIDEAKI; SATO, AKIMITSU
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 054785/0620 →
Priority Claims (1)
JP JP2018-129652 · Jul 9, 2018 · national
Continuity (1)
Related Publication 20210368117A1 · Nov 25, 2021