Thermal gap filler and its application for battery management system

1. A thermally conductive silicone composition comprising:

(A) 100 parts by mass of an alkenyl group-containing organopolysiloxane having a viscosity of from 10 to 100000 mPa·s at 25° C.;

(B) an organohydrogenpolysiloxane having a viscosity of from 1 to 1000 mPa·s at 25° C. having an average of two to four silicon-bonded hydrogen atoms in a molecule, comprised at a quantity whereby an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), wherein at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule;

(C) a catalytic quantity of a hydrosilylation reaction catalyst;

(D) 400 to 3500 parts by mass of a thermally conductive filler;

(E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule, comprised at a quantity of from 0.1 to 2.0 mass % relative to component (D); and

(F) glass beads having a particle size within the range of 100 μm to 500 containing less than 0.1 mass % of iron, comprised at a quantity of from 0.1 to 10 parts by mass relative to 100 parts by mass of component (A).

2. The thermally conductive silicone composition according to claim 1 ,

wherein component (E) is an alkoxysilane represented by the general formula:

Y n Si(OR) 4-n ,

wherein, Y is an alkyl group containing 6 to 18 carbon atoms, R is an alkyl group containing 1 to 5 carbon atoms, and subscript n is 1 or 2.

3. The thermally conductive silicone composition according to claim 1 , wherein component (E) is a trialkoxysilane having an alkyl group containing 6 to 18 carbon atoms.

4. The thermally conductive silicone composition according to claim 1 , wherein component (D) has been surface-treated with component (E).

5. The thermally conductive silicone composition according to claim 1 , further comprising (G) a hydrosilylation reaction inhibitor.

6. The thermally conductive silicone composition according to claim 1 , further comprising (H) a thermal stabilizer.

7. The thermally conductive silicone composition according to claim 1 , wherein component (D) is:

(D1) a plate-like boron nitride powder having an average particle size of from 0.1 to 30 μm; or

(D2) a granular boron nitride powder having an average particle size of from 0.1 to 50 μm; or

(D3) a spherical and/or crushed alumina powder having an average size of from 0.01 to 50 μm; or

(D4) a graphite having an average particle size of from 0.01 to 50 μm; or

(D5) a mixture of at least two of (D1) to (D4).

8. The thermally conductive silicone composition according to claim 1 , wherein component (B) contains (B1) a straight-chain organohydrogenpolysiloxane having an average of two to three silicon-bonded hydrogen atoms in a molecule, and wherein at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule.

9. The thermally conductive silicone composition according to claim 1 , wherein the content of the silicon-bonded hydrogen atoms in component (B) is represented as [H B ], the content of the silicon-bonded hydrogen atoms in an organohydrogenpolysiloxane other than component (B) is represented as [H non-B ], and the ratio of [H non-B ]/([H B ]+[H non-B ]) is within the range of 0.0 to 0.70.

10. A thermally conductive member produced by curing the thermally conductive silicone composition according to claim 1 .

11. An electronic device having the thermally conductive member according to claim 10 .

12. The electronic device according to claim 11 , wherein the electronic device is a battery management system.

13. A manufacturing method of the electronic device of claim 11 , including filling at least one gap in the electronic device with the thermally conductive silicone composition.