Display panel and manufacturing method thereof
Provided is a display panel, comprising a flexible substrate, a transition layer, a buffer layer, a drive layer, a functional layer, and a thin-film encapsulation layer. The transition layer covers one side of the flexible substrate; the buffer layer covers one side, away from a rigid carrier, of the transition layer; the drive layer covers one side, away from the transition layer, of the buffer layer; the functional layer covers one side, away from the buffer layer, of the drive layer; and the thin-film encapsulation layer covers the surface of the functional layer. According to the invention, a sulfydryl-containing transition layer is modified on a flexible substrate by means of sulfydryl modification to realize tight adhesion between the flexible substrate and a buffer layer in a drive layer, so that the adhesion force between the flexible substrate and the buffer layer is greatly enhanced by means of chemical adsorption.
1. A manufacturing method of a display panel, comprising steps of:
coating a layer of organic polymer on an upper surface of a hard layer, wherein the organic polymer is dried to form a flexible substrate;
placing a flexible substrate in a sulfydryl-containing organic solution, wherein after the flexible substrate is taken out, the organic solution is dried to form a transition layer to be in direct contact with the flexible substrate;
forming a buffer layer on an upper surface of the transition layer, wherein the buffer layer is in direct contact with the upper surface of the transition layer;
forming a driving layer on an upper surface of the buffer layer;
forming a functional layer on an upper surface of the driving layer; and
coating a thin film packaging layer on an upper surface of the functional layer, wherein the organic solution is selected from a group consisting of 2-mercaptopropionic acid, mercaptopropionic acid, and 3-mercaptobutyric acid, and the buffer layer comprises titanium dioxide or silicon dioxide, and
wherein material of the flexible substrate is selected from a group consisting of polyimide, diphenyl ether resin, and polyethylene naphthalate.
2. The display panel manufacturing method according to claim 1 , wherein the step of placing the flexible substrate in the sulfydryl-containing organic solution comprises:
time for placing the flexible substrate in the organic solution is 5 to 30 minutes;
temperature of the organic solution is 20 to 50 degrees Celsius;
pH value of the organic solution is 2 to 8; and
time for drying the organic solution is 15 to 30 minutes.
3. The display panel manufacturing method according to claim 1 , wherein the driving layer is selected from a group consisting of a low-temperature polycrystalline silicon thin film transistor, a thin film transistor, and an oxide thin film transistor.
4. The display panel manufacturing method according to claim 1 , wherein the step of coating the thin film packaging layer on the upper surface of the functional layer comprises a chemical vaporization deposition method, an atomic layer deposition method, or an ink-jet printing method.
5. The display panel manufacturing method according to claim 1 , wherein the hard layer is glass or hard resin.
6. The display panel manufacturing method according to claim 1 , wherein the organic polymer is selected from a group consisting of polyimide, diphenyl ether resin, and polyethylene naphthalate.
7. The display panel manufacturing method according to claim 1 , wherein the forming of the buffer layer on the upper surface of the transition layer comprises:
forming the buffer layer on the upper surface of the transition layer by a chemical vaporization deposition (CVD) method or an atomic layer deposition (ALD) method.
8. The display panel manufacturing method according to claim 1 , wherein the buffer layer is made of at least one of TiO 2 and SiO 2 .
9. The display panel manufacturing method according to claim 1 , wherein a thickness of the buffer layer ranges from 0.5 μm to 500 μm.
10. The display panel manufacturing method according to claim 9 , wherein the thickness of the buffer layer is 10 μm, 50 μm, 100 μm, 250 μm or 400 μm.
11. The display panel manufacturing method according to claim 1 , wherein the functional layer can be an OLED display device including an anode, a hole injection layer, a hole transmission layer, a light-emitting electron transmission layer, an electron injection layer, and a cathode.
12. The display panel manufacturing method according to claim 2 , wherein the time for placing the flexible substrate in the organic solution is 10 minutes, 15 minutes, or 25 minutes.
13. The display panel manufacturing method according to claim 2 , wherein the temperature of the organic solution is 25 degrees Celsius, 30 degrees Celsius, or 40 degrees Celsius s.
14. The display panel manufacturing method according to claim 2 , wherein the pH value of the organic solution is 3, 4, 5, or 6.
15. The display panel manufacturing method according to claim 2 , wherein the time for drying the organic solution is 20 minutes, 24 minutes, 25 minutes, or 28 minutes.