Method for manufacturing flexible flat device
Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).
1. A method for manufacturing a flexible device, the method comprising:
forming an adhesive layer on a support substrate;
adhering a flexible substrate onto the adhesive layer;
forming a device layer on the flexible substrate; and
separating the support substrate from the flexible substrate,
wherein the adhesive layer comprises a self-assembled monolayer (SAM),
wherein the self-assembled monolayer comprises a silane-based compound selected from the group consisting of Chemical formulas 1, 3, 5, 7, 9, and 11, and the mixture thereof:
wherein ‘R 1 ’ to ‘R 3 ’ of the Chemical formulas 1, 3, 5, 7, 9, and 11 are independently alkyl, functionalized alkyl, aryl, or alkoxy, and
wherein ‘m’ is an integer of 1 or more.
2. The method of claim 1 , wherein the forming the adhesive layer on the support substrate comprises spin coating, dip coating, or spray coating an adhesive material on the support substrate.
3. The method of claim 1 , wherein the silane-based compound is selected from the group consisting of the following Chemical formulas 2, 4, 6, 8, 10, and 12, and the mixture thereof:
4. The method of claim 3 , wherein:
‘R 1 ’ to ‘R 3 ’ of the Chemical formulas 2, 4, 6, 8, 10, and 12 are independently CH 3 or (CH 2 ) n CH 3 , and
‘n’ is an integer of 1 or more.
5. The method of claim 1 , wherein the support substrate comprises a glass substrate.
6. The method of claim 1 , wherein the device layer comprises an organic light-emitting device (OLED) or liquid crystal display (LCD).
7. The method of claim 1 , wherein the step of separating the support substrate from the flexible substrate is performed by a mechanical force.
8. The method of claim 1 , wherein the flexible substrate comprises polyimide.
9. The method of claim 1 , further comprising irradiating the lower surface of the support substrate prior to separating the support substrate from the flexible substrate.
10. The method of claim 9 , wherein the irradiation is UV-ray irradiation or laser irradiation.
11. The method of claim 10 , wherein wavelength of the irradiation is about 500 nm or less.
12. The method of claim 1 , wherein ‘m’ is an integer of 10 or fewer.
13. The method of claim 4 , wherein ‘n’ is an integer of 10 or fewer.