IP Library › Granted Patent US 12,272,489
Granted Patent B2
US 12,272,489 · App. 17/255,954 · Granted Apr 8, 2025

Electronic device

Inventors: Kosuke Ikeda (Saitama, JP); Yoshiaki Hiruma (Saitama, JP)
Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
H01F27/327
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Quick Facts
Patent No.
US 12,272,489
App. No.
17/255,954
Granted
Apr 8, 2025
Kind
B2
Abstract

An electronic device has a primary coil 10 ; a secondary coil 20 disposed to face the primary coil 10 ; a coil sealing part 50 sealing the primary coil 10 and the secondary coil 20 and being made of sealing resin; a primary-side electronic element 110 electrically connected to the primary coil 10 ; and a secondary-side electronic element 210 electrically connected to the secondary coil 20 . The primary-side electronic element 110 is provided on a primary-side extension part 60 extending from the primary coil 10 to an outside of the coil sealing part 50 , or the secondary-side electronic element 210 is provided on a secondary-side extension part 70 extending from the secondary coil 20 to an outside of the coil sealing part 50.

Claims (23)

1. An electronic device comprising:

a primary coil;

a secondary coil disposed to face the primary coil;

a coil sealing part sealing the primary coil and the secondary coil and being made of sealing resin;

a primary-side electronic element electrically connected to the primary coil;

a secondary-side electronic element electrically connected to the secondary coil;

a primary-side extension part integrated with the primary coil and extending from the primary coil to an outside of the coil sealing part; and

a secondary-side extension part integrated with the secondary coil and extending from the secondary coil to the outside of the coil sealing part,

wherein entire footprint of the primary-side electronic element is provided on a surface of the primary-side extension part via a conductive adhesive, and entire footprint of the secondary-side electronic element is provided on a surface of the secondary-side extension part via a conductive adhesive.

2. The electronic device according to claim 1 , wherein the primary-side electronic element has a primary-side first electronic element, a primary-side connecting body provided on the primary-side first electronic element, and a primary-side second electronic element provided on the primary-side connecting body.

3. The electronic device according to claim 1 , wherein the secondary-side electronic element has a secondary-side first electronic element, a secondary-side connecting body provided on the secondary-side first electronic element, and a secondary-side second electronic element provided on the secondary-side connecting body.

4. The electronic device according to claim 1 , wherein the primary coil has a first coil and a second coil coupled to the first coil.

5. The electronic device according to claim 4 , wherein the primary coil is made from a lead frame.

6. The electronic device according to claim 1 , wherein

a first bent part is provided between the coil sealing part and the primary-side electronic element, and in the primary-side extension part.

7. The electronic device according to claim 1 , wherein

a second bent part is provided between the coil sealing part and the secondary-side electronic element, and in the secondary-side extension part.

8. The electronic device according to claim 1 ,

wherein a first bent part is provided between the coil sealing part and the primary-side electronic element, and in the primary-side extension part,

wherein a second bent part is provided between the coil sealing part and the secondary-side electronic element, and in the secondary-side extension part,

wherein a primary-side sealing part sealing the primary-side electronic element is provided,

wherein a secondary-side sealing part sealing the secondary-side electronic element is provided, and

wherein a back surface of the coil sealing part, a back surface of the primary-side sealing part, and a back surface of the secondary-side sealing part is able to abut onto a cooling body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2021
From: IKEDA, KOSUKE; HIRUMA, YOSHIAKI
To: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
Reel/Frame 056188/0260 →
Continuity (1)
Related Publication 20210272748A1 · Sep 2, 2021
References Cited (32)
US 6181231B1 · Bartilson · 2001 [cited by examiner]
US 7969002B2 · Ashrafzadeh · 2011 [cited by examiner]
US 8675368B2 · Cho · 2014 [cited by examiner]
US 10405429B2 · Ando · 2019 [cited by examiner]
US 20030127704A1 · Kobayashi · 2003 [cited by examiner]
US 20070152795A1 · Zeng · 2007 [cited by examiner]
US 20070176726A1 · Xu · 2007 [cited by examiner]
US 20090196973A1 · Piatko · 2009 [cited by examiner]
US 20090309684A1 · Tsai · 2009 [cited by examiner]
US 20090322447A1 · Daley · 2009 [cited by examiner]
US 20100301987A1 · Belot · 2010 [cited by examiner]
US 20110254649A1 · Hollevoet · 2011 [cited by examiner]
US 20140027891A1 · Kimura et al. · 2014 [cited by applicant]
US 20180330870A1 · Sakai et al. · 2018 [cited by applicant]
US 20200258675A1 · Jimenez Pino · 2020 [cited by examiner]
CN 103366935A · 2013 [cited by examiner]
EP 2924451A1 · 2015 [cited by examiner]
JP H05283247A · 1993 [cited by applicant]
JP 2002165453A · 2002 [cited by applicant]
JP 4123768B2 · 2008 [cited by examiner]
JP 2009212141A · 2009 [cited by applicant]
JP 2010123898A · 2010 [cited by examiner]
JP 2012231616A · 2012 [cited by applicant]
JP 2014056868A · 2014 [cited by applicant]
JP 2015159174A · 2015 [cited by applicant]
JP 2017037946A · 2017 [cited by applicant]
WO WO2012014250A1 · 2012 [cited by examiner]
WO 201713117A1 · 2017 [cited by applicant]
Extended European Search Report from EP app. No. 18924681.2, dated Jan. 24, 2022, all pages. [cited by applicant]
Office Action for Japanese Patent Application 2020-526843 issued on Mar. 22, 2022. [cited by applicant]
International Search Report in the international application No. PCT/JP2018/024765, mailed on Aug. 7, 2018. [cited by applicant]
Written Opinion of the International Searching Authority in the international application No. PCT/JP2018/024765, mailed on Aug. 7, 2018 and English translation provided by Google Translate. [cited by applicant]