IP Library › Granted Patent US 11,888,101
Granted Patent B2
US 11,888,101 · App. 17/259,681 · Granted Jan 30, 2024

Display panel

Inventors: Youngki Jung (Suwon-si, KR); Jinho Kim (Suwon-si, KR); Dongmyung Son (Suwon-si, KR); Sangmin Shin (Suwon-si, KR); Changjoon Lee (Suwon-si, KR); Kyungwoon Jang (Suwon-si, KR); Seongphil Cho (Suwon-si, KR); Gyun Heo (Suwon-si, KR); Soonmin Hong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L33/62
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Quick Facts
Patent No.
US 11,888,101
App. No.
17/259,681
Granted
Jan 30, 2024
Kind
B2
Abstract

A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.

Claims (9)

1. A display panel comprising: a thin film transistor substrate; a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor substrate; a plurality of first connection pads disposed on the one surface of the thin film transistor substrate; a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface; and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one edge area of an edge area on the one surface and an edge area on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate, wherein the cutting area is formed to have a multi-stage structure, the multi-stage structure comprising a plurality of cutting surfaces consecutively arranged between the side surface and the one surface or the other surface, wherein one or more of the cutting surfaces of the cutting area are formed by cutting or etching a portion of the cutting area between the side surface and the one surface or the other surface to receive a respective one of the plurality of connection wirings, and wherein the plurality of connection wirings are metal deposited along the multi-stage structure of the cutting area.

2. The display panel of claim 1 , wherein one or more of the cutting surfaces of the cutting area is formed to be inclined.

3. The display panel of claim 1 , wherein one or more of the cutting surfaces of the cutting area is formed to be curved.

4. The display panel of claim 1 , the cutting area is disposed on an area where the plurality of connection wirings are disposed among the edge areas of the thin film transistor substrate.

5. The display panel of claim 4 , wherein the plurality of first connection pads are disposed at a preset interval along a length direction of an edge area of the one surface, respectively and

wherein the plurality of second connection pads are disposed to face the plurality of first connection pads, respectively.

6. The display panel of claim 1 , wherein the cutting area is consecutively formed along a length direction of the edge area of the thin film transistor substrate.

7. The display panel of claim 1 , wherein the connection wirings are consecutively formed on the one surface, the other surface, and the cutting surface.

8. The display panel of claim 7 , wherein the connection wirings include a shape corresponding to a shape of the cutting surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2021
From: JUNG, YOUNGKI; KIM, JINHO; SON, DONGMYUNG; SHIN, SANGMIN; LEE, CHANGJOON; JANG, KYUNGWOON; CHO, SEONGPHIL; HEO, GYUN; HONG, SOONMIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 054966/0299 →
Priority Claims (1)
KR 10-2018-0082527 · Jul 16, 2018 · national
Continuity (1)
Related Publication 20210135076A1 · May 6, 2021