PARTICLE MIXTURE, KIT, INK, METHODS AND ARTICLE
A particle mixture for forming an enamel comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises greater than 5 wt % silicon oxide (SiO 2 ) and less than 5 wt % boron oxide (B 2 O 3 ); wherein the second glass frit comprises boron oxide (B 2 O 3 ) and less than 5 wt % of silicon oxide (SiO 2 ); and wherein both the particles of the first glass frit and the particles of the second glass frit have a D90 particle size of less than 5 microns. Also described is an ink comprising the particle mixture, methods of preparing the ink, an article formed using the ink, and a kit comprising particles of the first and second glass frit.
1 . A particle mixture for forming an enamel comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises greater than 5 wt % silicon oxide (SiO 2 ) and less than 5 wt % boron oxide (B 2 O 3 ); wherein the second glass frit comprises boron oxide (B 2 O 3 ) and less than 5 wt % of silicon oxide (SiO 2 ); and wherein both the particles of the first glass frit and the particles of the second glass frit have a D90 particle size of less than 5 microns, and wherein the particle mixture further comprises particles of a pigment.
2 . A particle mixture as claimed in claim 1 wherein the first glass frit comprises:
>5 to ≤65 wt % SiO 2 ;
≥0 to ≤50 wt % ZnO;
≥10 to ≤80 wt % Bi 2 O 3 ; and
≥0 to <5 wt % B 2 O 3 .
3 . A particle mixture as claimed in claim 1 wherein the first glass frit comprises ≥10 to ≤65 wt % SiO 2 , preferably ≥15 to ≤50 wt % SiO 2 .
4 . A particle mixture as claimed in claim 1 wherein the second glass frit comprises:
>1 to ≤25 wt % B 2 O 3 ;
≥5 to ≤30 wt % ZnO;
≥40 to ≤70 wt % Bi 2 O 3 ;
≥0 to ≤30 wt % SnO 2 ;
≥0 to ≤20 wt % Al 2 O 3 ;
≥0 to <5 SiO 2 wt %; and
≥0 to ≤18 wt % alkali metal oxide.
5 . A particle mixture as claimed in claim 1 wherein the second glass frit comprises ≥5 to ≤25 wt % B 2 O 3 , preferably, ≥8 to ≤20 of B 2 O 3 .
6 . A particle mixture as claimed in claim 1 wherein the particles of the first glass frit have a D90 particle size of less than 4.8 microns, less than 4 microns, less than 3.5 microns, less than 3 microns, less than 2.5 microns, less than 2 microns, or less than 1.5 microns.
7 . A particle mixture as claimed in claim 1 wherein the particles of the second glass frit have a D90 particle size of less than 4.8 microns, less than 4 microns, less than 3.5 microns, less than 3 microns, less than 2.5 microns, less than 2 microns, or less than 1.5 microns.
8 . A particle mixture as claimed in claim 1 wherein the weight ratio of the first glass frit to the second glass frit is in the range from 1:1 to 10:1, preferably 2:1 to 7:1, more preferably 2:1 to 4:1.
9 . A particle mixture as claimed in claim 8 wherein the weight ratio of the first glass frit to the second glass frit is about 3:1.
10 . (canceled)
11 . A particle mixture as claimed in claim 1 which comprises:
≥10 to ≤90 wt % particles of the first glass frit;
≥5 to ≤95 wt % particles of the second glass frit;
≥0 to ≤50 wt % particles of pigment.
12 . A particle mixture as claimed in claim 11 which comprises:
≥20 to ≤45 wt % particles of the first glass frit;
≥20 to ≤40 wt % particles of the second glass frit;
≥10 to ≤25 wt % particles of pigment.
13 . An ink comprising:
a particle mixture as claimed in claim 1 ; and
a liquid dispersion medium.
14 . (canceled)
15 . (canceled)
16 . (canceled)
17 . (canceled)
18 . A method of forming an enamel on a substrate, the method comprising applying a coating of an ink as claimed in claim 13 onto the substrate and firing the applied coating.
19 . An article comprising a substrate having an enamel formed thereon, wherein the enamel is obtained or obtainable by the method as claimed in claim 18 .
20 . Use of a particle mixture comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises greater than 5 wt % silicon oxide (SiO 2 ) and less than 5 wt % boron oxide (B 2 O 3 );
wherein the second glass frit comprises boron oxide (B 2 O 3 ) and less than 5 wt % of silicon oxide (SiO 2 ); and wherein both the particles of the first glass frit and the particles of the second glass frit have a D90 particle size of less than 5 microns, and wherein the particle mixture further comprises particles of a pigment or an ink as claimed in claim 13 to form an enamel on substrate.
21 . A kit comprising particles of a first glass frit and particles of a second glass frit; wherein the first glass frit comprises greater than 5 wt % silicon oxide (SiO 2 ) and less than 5 wt % boron oxide (B 2 O 3 ); wherein the second glass frit comprises boron oxide (B 2 O 3 ) and less than 5 wt % of silicon oxide (SiO 2 ); and wherein both the particles of the first glass frit and the particles of the second glass frit have a D90 particle size of less than 5 microns.