IP Library Granted Patent US 12,427,754
Granted Patent B2
US 12,427,754 · App. 17/261,515 · Granted Sep 30, 2025

Multicomponent layered dielectric film with surface modification

Inventors: Deepak Langhe (Valley View, OH); Michael Ponting (Valley View, OH)
Assignee: POLYMERPLUS, LLC
B32B27/08B32B27/20H01G4/14B32B2250/42B32B2270/00B32B2307/204B32B2307/516B32B2457/16
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Quick Facts
Patent No.
US 12,427,754
App. No.
17/261,515
Granted
Sep 30, 2025
Kind
B2
Abstract

A multicomponent dielectric film includes overlapping dielectric layers and outer layers that have a higher surface energy compared to the overlapping dielectric layers, the overlapping dielectric layers including at least a first polymer material, a second polymer material, and optionally a third polymer material, adjoining dielectric layers defining a generally planar interface therebetween which lies generally in an x-y plane of an x-y-z coordinate system, the interfaces between the layers delocalizing the charge build up in the layers.

Claims (18)

1. A multicomponent dielectric film comprising a stack of overlapping dielectric layers and outer layers forming the outermost layers of the multicomponent dielectric film that have a higher surface energy compared to the overlapping dielectric layers,

the stack of overlapping dielectric layers including first dielectric layers and second dielectric layers of at least a first polymer material, a second polymer material, and optionally a third polymer material, adjoining first and second dielectric layers defining a generally planar interface therebetween which lies generally in an x-y plane of an x-y-z coordinate system, the interfaces between the layers delocalizing the charge build up in the layers allowing increased charge storage on electrodes,

wherein the outer layers are formed from a fourth polymer material having a different composition and a higher surface energy than the first polymer material, the second polymer material, and optional third polymer material forming the stack of overlapping dielectric layers, and the fourth polymer material is selected from polypropylene, polyethylene, or polyoxymethylene, and

wherein the multicomponent dielectric film has a surface energy of at least 40 dynes/cm 2 .

2. The multicomponent dielectric film of claim 1 , wherein the at least one of the dielectric layers includes a blend of two or more polymers.

3. The multicomponent dielectric film of claim 1 , the first dielectric layers including a stack of discrete polymer layers with polymer layer interfaces extending transverse to the x-y plane and optionally at least one non-polymeric filler having a higher dielectric constant than the first polymer material, the second polymer material, and/or third polymer material.

4. The multicomponent dielectric film of claim 3 , wherein the stack of discrete polymer layers includes alternating first polymer layers and second polymer layers, adjoining first polymer layers and second polymer layers of the stack defining a generally planar interface therebetween.

5. The multicomponent dielectric film of claim 4 , wherein the polymer layer interfaces extend substantially perpendicular to the x-y plane.

6. The multicomponent dielectric film of claim 5 , the first polymer material and/or second polymer material having a permittivity greater than the third polymer material, and the third polymer material having a breakdown strength greater than the first polymer material and/or the second polymer material.

7. The multicomponent dielectric film of claim 1 , comprising about 2 to about 500,000 alternating first dielectric layers and second dielectric layers.

8. The multicomponent dielectric film of claim 1 , comprising a stack of alternating first dielectric layers and second dielectric layers fabricated by multilayer coextrusion forced assembly processes.

9. The multicomponent dielectric film of claim 1 being axially oriented in at least one direction substantially parallel to a surface of the film at a ratio effective to increase the breakdown strength of the film.

10. An energy storage device comprising a multicomponent dielectric film, the film including a stack of discrete overlapping dielectric layers and outer layers forming the outermost layers of the multicomponent dielectric film that have a higher surface energy compared to the overlapping dielectric layers,

the stack of overlapping dielectric layers including first dielectric layers and second dielectric layers of at least a first polymer material, a second polymer material, and optionally a third polymer material, adjoining dielectric layers defining a generally planar interface therebetween which lies generally in an x-y plane of an x-y-z coordinate system, the interfaces between the layers delocalizing the charge build up in the layers allowing increased charge storage on electrodes of the device,

wherein the outer layers are formed from a fourth polymer material having a different composition and a higher surface energy than the first polymer material, the second polymer material, and optional third polymer material forming the stack of overlapping dielectric layers, and the fourth polymer material is selected from polypropylene, polyethylene, or polyoxymethylene, and

wherein the multicomponent dielectric film has a surface energy of at least 40 dynes/cm 2 .

11. The energy storage device of claim 10 , comprising a capacitor.

12. The energy storage device of claim 11 , comprising a wound or stacked capacitor.

Assignments (1)
SECURITY INTEREST Recorded Feb 7, 2023
From: POLYMERPLUS, LLC
To: SQUADRON MEDICAL FINANCE SOLUTIONS LLC
Reel/Frame 062617/0987 →
Continuity (2)
Provisional Application 62700558 · Jul 19, 2018
Related Publication 20210291499A1 · Sep 23, 2021
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