IP Library › Granted Patent US 11,917,868
Granted Patent B2
US 11,917,868 · App. 17/263,139 · Granted Feb 27, 2024

Organic light emitting diode display device and method of manufacturing thereof

Inventors: Xuyang Liu (Wuhan, CN); Chao Liang (Wuhan, CN)
Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
H10K59/124G06V40/12G06V40/1318H01L27/1222H01L27/1225H01L27/1251H01L29/41733H10K59/126H10K59/40H10K59/65H10K71/00H10K59/1201H10K59/60
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Quick Facts
Patent No.
US 11,917,868
App. No.
17/263,139
Granted
Feb 27, 2024
Kind
B2
Abstract

An organic light emitting diode (OLED) display device and a method of manufacturing thereof are provided. The organic light emitting diode display device includes a display area and a non-display area. The display area includes a pixel area and a photosensitive area disposed between the pixel areas. The photosensitive area includes a first thin film transistor. The pixel area includes a second thin film transistor, which the same type as the first thin film transistor. The non-display area includes a third thin film transistor, which is a different type from the first thin film transistor.

Claims (16)

1. A method of manufacturing an organic light emitting diode (OLED) display device, comprising steps of following:

S 10 , depositing a barrier layer and a buffer layer on a flexible substrate in order, and forming a second active layer on the buffer layer;

S 20 , forming a first gate insulating layer on the buffer layer, the first gate insulating layer completely covering the second active layer, and forming a first gate on the first gate insulating layer;

S 30 , forming a second gate insulating layer on the first gate insulating layer, the second gate insulating layer completely covering the first gate, and forming a second gate and a first active layer on the second gate insulating layer;

S 40 , forming an interlayer insulating layer on the second gate insulating layer, the interlayer insulating layer completely covering the second gate and the first active layer, and forming a first via hole, a second via hole, and a third via hole in the interlayer insulating layer;

S 50 , forming a source-drain metal layer and a light-shielding layer on the interlayer insulating layer, wherein the light-shielding layer is disposed directly above a part of the first active layer of a non-photosensitive area; and

S 60 , forming a planarization layer on the interlayer insulating layer, the planarization layer completely covering the source-drain metal layer and the light-shielding layer, forming a fourth via hole on the planarization layer, and forming an anode metal layer and a pixel definition layer on the planarization layer in order;

wherein in the S 40 , the third via hole exposes both ends of an edge of the second active layer, the first via hole exposes both ends of an edge of the first active layer in a photosensitive area, and the second via hole exposes a part of both ends of an edge of the first active layer in the non-photosensitive area of a display area.

2. The method of manufacturing the OLED display device according to claim 1 , wherein the first active layer is made of a low-leakage current material, and the low leakage current material comprises indium gallium zinc oxide or amorphous silicon material; and

wherein the second active layer comprises a high-mobility material, and the high-mobility material comprises polysilicon.

3. The method of manufacturing the OLED display device according to claim 1 , wherein in the S 10 , the flexible substrate is a single-layer polyimide film or a double-layer polyimide film, and the barrier layer and the buffer layer are inorganic films composed of silicon nitride or silicon oxide.

4. The method of manufacturing the OLED display device according to claim 1 , wherein the first gate insulating layer and the second gate insulating layer are inorganic films composed of silicon nitride or silicon oxide, and the first gate and the second gate are made of copper-molybdenum alloy.

5. The method of manufacturing the OLED display device according to claim 1 , wherein in the S 40 , the interlayer insulating layer is an inorganic film composed of silicon nitride or silicon oxide.

6. The method of manufacturing the OLED display device according to claim 1 , wherein the source-drain metal layer is connected to both ends of the edge of the second active layer through the third via; and

wherein the source-drain metal layer is connected to both ends of the edge of the first active layer through the first via hole in the photosensitive area, and the source-drain metal layer is connected to the part of both ends of the first active layer in the non-photosensitive area through the second via hole.

7. The method of manufacturing the OLED display device according to claim 6 , wherein the light-shielding layer and the source-drain metal layer are made of a triple layer of titanium, aluminum, and titanium.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2021
From: LIU, XUYANG; LIANG, CHAO
To: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Reel/Frame 056149/0140 →
Priority Claims (1)
CN 202010782373.4 · Aug 6, 2020 · national
Continuity (1)
Related Publication 20220302233A1 · Sep 22, 2022