Methods and systems for evaporation of liquid from droplet confined on hollow pillar
A heat exchanger for thermal management of an electronic device includes a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source. The heat exchanger also includes an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars. Each hollow pillar has an evaporation surface and a pore configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface. The evaporation surface being configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95% and the contact line has a length of less than about 0.0314 mm.
1. A heat exchanger for thermal management of an electronic device, the heat exchanger comprising:
a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source; and
an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars, wherein each of the hollow pillars has an evaporation surface and a pore, the pore is configured to channel the continuous flow of the liquid through q respective one of the hollow pillars to the evaporation surface, the evaporation surface being configured to maintain a corresponding one of the droplets on the respective one of hollow pillars within a contact line, wherein the evaporation surface has a wetting efficiency of at least 95% and the contact line has a length of less than 0.0314 mm,
wherein the heat exchanger has a stacked configuration in which the liquid delivery laver is positioned between the evaporation laver and the electronic device.
2. The heat exchanger of claim 1 , wherein at least one of the hollow pillars has a non-circular cross-sectional shape.
3. The heat exchanger of claim 1 , wherein the liquid delivery layer is a first liquid delivery layer and the evaporation layer is a first evaporation layer, the heat exchanger further comprising a second liquid delivery layer and a second evaporation layer.
4. The heat exchanger of claim 1 , wherein the liquid is a dielectric liquid.
5. The heat exchanger of claim 1 , wherein the evaporation layer comprises:
a first surface configured receive the continuous flow of the liquid from the liquid delivery layer; and
a second surface opposite the first surface, wherein each of the hollow pillars extend from the second surface.
6. The heat exchanger of claim 5 , wherein the evaporation surface has a non-circular cross-sectional shape.
7. The heat exchanger of claim 6 , wherein at least one of the hollow pillars has a triangular cross-sectional shape.
8. The heat exchanger of claim 6 , wherein at least one of the hollow pillars has a square cross-sectional shape.
9. The heat exchanger of claim 5 , wherein at least one of the hollow pillars is heated to a saturation temperature of the liquid.
10. The heat exchanger of claim 5 further comprising a nanoparticle coating on the evaporation surface.
11. A method of evaporating a liquid, the method comprising:
providing a liquid delivery laver thermally coupled to an electronic device, the liquid delivery laver configured to receive the liquid from a source;
providing a continuous flow of the liquid to an evaporation layer comprising channeling the liquid through the liquid delivery laver toward the evaporation layer, the liquid delivery layer is positioned between the evaporation laver and the electronic device, the evaporation laver comprising hollow pillars, wherein each of the hollow pillars has an evaporation surface and a pore configured to channel the continuous flow of the liquid from the liquid delivery layer to the evaporation surface;
maintaining a droplet on each of the hollow pillars, each evaporation surface configured to maintain the droplet on a respective one of the hollow pillars within a contact line, each evaporation surface having a wetting efficiency of at least 95%, the contact line having a length of less than 0.0314 mm; and
evaporating the continuous flow of the liquid from a surface of the droplet maintained on each of the hollow pillars to remove heat from the electronic device.
12. The method of claim 11 , wherein the pore is positioned in a center of the evaporation surface, the method further comprising wicking the liquid radially outward from the pore to an edge circumscribing the evaporation surface, wherein the evaporation surface has a non-circular shape.
13. The method of claim 11 further comprising transferring the heat through the hollow pillars to the droplet maintained on each of the hollow pillars, wherein each of the hollow pillars has a nanoparticle coating on the evaporation surface to increase heat transfer from the respective one of the hollow pillars to the droplet.