Display apparatus and method of producing the same
A display apparatus includes: a first semiconductor substrate that includes a light emitting unit and a first drive circuit, the first drive circuit driving the light emitting unit; and a second semiconductor substrate that includes a second drive circuit to be electrically connected to the first drive circuit, the second semiconductor substrate being bonded to the first semiconductor substrate.
1. A display apparatus, comprising:
a first semiconductor substrate that includes a light emitting unit and a first drive circuit, the first drive circuit driving the light emitting unit; and
a second semiconductor substrate that includes a second drive circuit to be electrically connected to the first drive circuit, the second semiconductor substrate being bonded to the first semiconductor substrate, wherein
the light emitting unit includes a plurality of light emitting devices arranged in matrix,
the first drive circuit is a first part of pixel circuits that individually drive the plurality of light emitting devices, and
the second drive circuit is a second part of the pixel circuits.
2. The display apparatus according to claim 1 , wherein
the first drive circuit includes a transistor that switches a signal voltage or a power supply voltage, and
the second drive circuit includes a transistor that controls a current flowing to the light emitting unit.
3. The display apparatus according to claim 2 , wherein the second drive circuit further includes a transistor that resets a voltage applied to the plurality of light emitting devices.
4. The display apparatus according to claim 1 , wherein
the first drive circuit includes a transistor that controls a current flowing to the light emitting unit, and
the second drive circuit includes a transistor that switches a signal voltage or a power supply voltage.
5. The display apparatus according to claim 4 , wherein the first drive circuit further includes a transistor that resets a voltage applied to the plurality of light emitting devices.
6. The display apparatus according to claim 1 , wherein
the first drive circuit includes a first capacitive device, and
the second drive circuit includes a second capacitive device electrically connected to the first capacitive device.
7. The display apparatus according to claim 1 , wherein the second drive circuit includes a first capacitive device and a second capacitive device electrically connected to the first capacitive device.
8. The display apparatus according to claim 1 , wherein
the first drive circuit is a pixel circuit that individually drives the plurality of light emitting devices, and
the second drive circuit is a peripheral circuit that supplies a signal voltage or a power supply voltage to the pixel circuit.
9. The display apparatus according to claim 1 , wherein
the first semiconductor substrate and the second semiconductor substrate each include a substrate body and a wiring layer, and
the wiring layer of the first semiconductor substrate is bonded to the wiring layer of the second semiconductor substrate.
10. The display apparatus according to claim 1 , wherein
the first semiconductor substrate and the second semiconductor substrate each include a substrate body and a wiring layer, and
the substrate body of the first semiconductor substrate is bonded to the wiring layer of the second semiconductor substrate.
11. A method of producing a display apparatus, comprising:
forming a first semiconductor substrate that includes a light emitting unit and a first drive circuit, the first drive circuit driving the light emitting unit;
forming a second semiconductor substrate that includes a second drive circuit; and
electrically connecting the first drive circuit and the second semiconductor substrate by bonding the first semiconductor substrate and the second semiconductor substrate to each other, wherein
the light emitting unit includes a plurality of light emitting devices arranged in matrix,
the first drive circuit is a first part of pixel circuits that individually drive the plurality of light emitting devices, and
the second drive circuit is a second part of the pixel circuits.
12. The method according to claim 11 , wherein
the first drive circuit includes a transistor that switches a signal voltage or a power supply voltage, and
the second drive circuit includes a transistor that controls a current flowing to the light emitting unit.
13. The method according to claim 12 , wherein the second drive circuit further includes a transistor that resets a voltage applied to the plurality of light emitting devices.
14. The method according to claim 11 , wherein
the first drive circuit includes a transistor that controls a current flowing to the light emitting unit, and
the second drive circuit includes a transistor that switches a signal voltage or a power supply voltage.
15. The method according to claim 14 , wherein the first drive circuit further includes a transistor that resets a voltage applied to the plurality of light emitting devices.
16. The method according to claim 11 , wherein
the first drive circuit includes a first capacitive device, and
the second drive circuit includes a second capacitive device electrically connected to the first capacitive device.
17. The method according to claim 11 , wherein the second drive circuit includes a first capacitive device and a second capacitive device electrically connected to the first capacitive device.
18. The method according to claim 11 , wherein
the first drive circuit is a pixel circuit that individually drives the plurality of light emitting devices, and
the second drive circuit is a peripheral circuit that supplies a signal voltage or a power supply voltage to the pixel circuit.
19. The method according to claim 11 , wherein
the first semiconductor substrate and the second semiconductor substrate each include a substrate body and a wiring layer, and
the wiring layer of the first semiconductor substrate is bonded to the wiring layer of the second semiconductor substrate.
20. The method according to claim 11 , wherein
the first semiconductor substrate and the second semiconductor substrate each include a substrate body and a wiring layer, and
the substrate body of the first semiconductor substrate is bonded to the wiring layer of the second semiconductor substrate.