IP Library Granted Patent US 11,795,355
Granted Patent B2
US 11,795,355 · App. 17/270,178 · Granted Oct 24, 2023

One-component hot melt polyurethane adhesive

Inventors: Gary L Jialanella (Oxford, MI); Eric Cole (Auburn Hills, MI); Daniel Sophiea (Auburn Hills, MI)
Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
C09J175/06C08G18/0885C08G18/12C08G18/2081C08G18/24C08G18/307C08G18/3215C08G18/3844C08G18/4009C08G18/4202C08G18/4238C08G18/4829C08G18/664C08G18/7664C08G18/78C08G2170/20C09J2301/304C09J2301/306
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Quick Facts
Patent No.
US 11,795,355
App. No.
17/270,178
Granted
Oct 24, 2023
Kind
B2
Abstract

One-component, moisture-curable polyurethane adhesives exhibit excellent handling strength before being fully cured, and excellent creep properties after curing. The adhesives include an isocyanate-terminated prepolymer made from polyols that include a crystalline polyester and hydroquinone bis (2-hydroxyethyl) ether, and a polyoxazolidine compound.

Claims (20)

1. A one-component, moisture-curable, hot melt polyurethane adhesive composition which is a heat-softenable room temperature solid comprising:

A) 50 to 98% by weight, based on the total weight of the adhesive composition, of a polyurethane prepolymer containing free isocyanate groups, the prepolymer being a reaction product of:

1) A mixture of polyols that comprises

i) at least 35 weight percent, based on the weight of the mixture of polyols, of at least one hydroxyl-terminated polyester that is liquid at 22° C.;

ii) at least 10 weight percent, based on the weight of the mixture of polyols, of at least one hydroxyl-terminated polyester that is a solid at 22° C. and exhibits a crystalline melting temperature of 70 to 130° C.; and

iii) 5 to 20 weight percent, based on the weight of the mixture of polyols, of hydroquinone bis-(2-hydroxyethyl) ether; with

2) An excess of at least one organic polyisocyanate;

B) 1 to 10% by weight, based on the total weight of the adhesive composition, of at least one polyoxazolidine compound having a molecular weight of up to 2000; and

C) a catalytically effective amount of a catalyst for a reaction of water with an isocyanate group.

2. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 1 wherein component ii) has a crystalline melting temperature of 75 to 100° C.

3. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 1 wherein component ii) has a hydroxyl equivalent weight of 700 to 2500 and a hydroxyl functionality of 1.8 to 3.

4. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 1 wherein component i) has a hydroxyl equivalent weight of 700 to 1500 and a hydroxyl functionality of 1.8 to 3.

5. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 1 wherein the polyoxazolidine compound is represented by structure I or structure II:

wherein R is hydrogen, alkyl, aryl-substituted alkyl, phenyl or alkyl-substituted phenyl, x is from 1 to 20, and each y is independently 1 to 20.

6. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 5 wherein the polyoxazolidine compound has the structure:

7. The one-component, moisture-curable, hot melt polyurethane adhesive composition of claim 1 wherein the mixture of polyols contains 12 to 25% by weight of component ii), based on the weight of the mixture of polyols.

8. A cured adhesive formed by curing the one-component polyurethane adhesive composition of claim 1 .

9. A cured adhesive formed by contacting the one-component polyurethane adhesive composition of claim 1 with H 2 O.

10. A method of bonding two substrates, comprising forming a layer of the one-component polyurethane adhesive of claim 1 at a bondline between two substrates, and curing the layer at the bondline to form a cured adhesive bonded to each of the substrates.

11. A method of bonding two substrates, comprising forming a layer of the one-component polyurethane adhesive of claim 1 at a bondline between two substrates, and curing the layer at the bondline by contacting the layer with H 2 O to form a cured adhesive bonded to each of the substrates.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2021
From: JIALANELLA, GARY L.; COLE, ERIC E.; SOPHIEA, DANIEL
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 055445/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2021
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 055454/0380 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2021
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 055488/0001 →
CHANGE OF NAME Recorded Mar 1, 2021
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 055549/0966 →
Continuity (2)
Provisional Application 62722226 · Aug 24, 2018
Related Publication 20210309896A1 · Oct 7, 2021