IP Library Granted Patent US 11,753,735
Granted Patent B2
US 11,753,735 · App. 17/274,018 · Granted Sep 12, 2023

Nickel-coated copper foil and method for manufacturing the same

Inventor: Ken Asada (Osaka, JP)
Assignee: PROTERIAL, LTD.
C25D5/627B32B15/01B32B15/20C25D5/12C25D5/50C25D5/611C25D7/06H01M4/661H01M4/667B32B2307/732H01M2004/027
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Quick Facts
Patent No.
US 11,753,735
App. No.
17/274,018
Granted
Sep 12, 2023
Kind
B2
Abstract

A nickel-coated copper foil suitable for mass production, to which YAG laser welding can be applied while reducing the electrical resistivity by forming a nickel plating layer with a thickness of 0.5 μm or less on a surface of a copper foil by Ni plating, is provided. The nickel-coated copper foil has an overall thickness of 200 μm or less, and includes a copper layer made of Cu or a Cu alloy, and a nickel plating layer made of Ni or a Ni alloy, covering a surface of the copper foil, having a thickness of 0.01 μm or more and 0.5 μm or less, and including a surface having an a* value of 0 or more and 10 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

Claims (17)

1. A nickel-coated copper foil comprising:

a copper layer made of Cu or a Cu alloy; and

an upper exposed nickel plating layer made of Ni or a Ni alloy, the upper exposed nickel plating layer covering an upper surface of the copper layer and exposing a surface opposite to a surface in contact with the copper layer in order to be welded to a portion of an other material used in batteries by YAG laser,

a bottom exposed nickel plating layer made of Ni or a Ni alloy, the bottom exposed nickel plating layer covering a bottom surface of the copper layer and exposing a surface opposite to a surface in contact with the copper layer in order to be welded to a portion of an other material used in batteries by YAG laser,

the upper exposed nickel plating layer and the bottom exposed nickel plating layer having a thickness of 0.01 μm or more and less than 0.1 μm,

surfaces of the upper exposed nickel plating layer and the bottom exposed nickel plating layer have an L* value of 70 or more and 78 or less, an a* value of 0 or more and 4 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722,

at least one of the surfaces of the upper exposed nickel plating layer and the bottom exposed nickel plating layer are welded to a portion of an other material used in batteries by YAG laser,

and wherein the nickel-coated copper foil has an overall thickness of 100 μm or more and 200 μm or less.

2. The nickel-coated copper foil according to claim 1 , wherein the upper exposed nickel plating layer and the bottom exposed nickel plating layer have the thickness of 0.03 μm or more and less than 0.1 μm.

3. The nickel-coated copper foil according to claim 2 , having a volume resistivity of 2 μΩ-cm or less, the volume resistivity being obtained in a room temperature environment by a 4-terminal method in accordance with JIS C 2525.

4. The nickel-coated copper foil according to claim 1 , having a volume resistivity of 2 μΩ-cm or less, the volume resistivity being obtained in a room temperature environment by a 4-terminal method in accordance with JIS C 2525.

5. A method for manufacturing the nickel-coated copper foil according to claim 1 , the method comprising:

forming a nickel plating layer made of Ni or a Ni alloy on a surface of the copper foil made of Cu or the Cu alloy by a plating process; wherein

the plating process is performed such that the nickel plating layer has a thickness of 0.01 μm or more and less than 0.1 μm and includes a surface having an a* value of 0 or more and 4 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

6. The method for manufacturing a nickel-coated copper foil according to claim 5 , wherein after the plating process, a heat treatment is performed such that the nickel plating layer includes the surface having the a* value of 0 or more and 4 or less and the b* value of 0 or more and 14 or less in the L*a*b* color system obtained by the SCI measurement method in accordance with JIS Z 8722.

7. A battery containing the nickel-coated copper foil according to claim 1 .

8. A lithium-ion secondary battery containing the nickel-coated copper foil according to claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Feb 24, 2023
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 062866/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2021
From: ASADA, KEN
To: HITACHI METALS, LTD.
Reel/Frame 055510/0652 →
Priority Claims (1)
JP 2018-166676 · Sep 6, 2018 · national
Continuity (1)
Related Publication 20210310144A1 · Oct 7, 2021